Circuit board assembly

• US 5,400,949 A
• Filed: 01/18/1994
• Issued: 03/28/1995
• Est. Priority Date: 09/19/1991
• Status: Expired due to Term

• Current Assignee: Nokia Mobile Phones UK Limited (Nokia Corporation)
• Original Assignee: Nokia Mobile Phones UK Limited (Nokia Corporation)
• Inventors: Hirvonen, Timo, Hossi, Petri, Uronen, Lasse, Olkkola, Jari, Leman, Ari, Valimaa, Veli-Matti
• Primary Examiner(s): LEDYNH, BOT L
• Application Number:
  US08/183,577
• Time in Patent Office: 434 Days
• Field of Search: 174/35 R, 174/35 MS, 174/52.4, 361/816, 361/817, 361/818, 228/180.1, 228/180.21, 228/180.22, 228/234.1, 219/10.55 R, 219/10.55 D, 219/10.55 M, 219/129, 219/85.1, 219/85.12, 219/85.13, 219/85.14, 219/85.15, 219/85.2, 219/85.21, 219/85.22 , 219/603, 219/615-616, 257/659, 257/660
• US Class Current: 228/180.22
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: H05K 9/0026 integrally formed from metal sheet
• CPC Class Codes: H05K 9/0028 with retainers or specific soldering features
• CPC Class Codes: H05K 9/003 made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedence
• CPC Class Codes: Y10S 174/35 Box or housing mounted on substrate or PCB

Abstract

A circuit board assembly including a shielding housing mounted on a circuit board (1), the shielding housing being intended for radio-frequency shieldings. The shielding housing (2) having a wall inclined at an angle α to a plane orthogonal to the plane of the circuit board. The housing of the circuit board assembly being suitable for at least a partial embedding into an exterior wall of an electronic apparatus.

Claims

1. A method of reflow soldering components to a circuit board comprising steps of:

positioning an interference shielding housing on the circuit board to enclose predetermined electronic components located on the circuit board, the housing having apertures extending through a top surface and located between the circuit board and a bottom edge of the housing and, a substantially solid inclined wall between the bottom edge and top surface that does not have holes; and

heating the circuit board, electronic components and housing by use of hot air, wherein the hot air flows into the apertures at the bottom edge of the housing and out of the housing through the apertures at the top surface with a chimney-like air flow such that the hot air heats solder enclosed by the housing to thereby cause melting and reflow of the solder to simultaneously reflow solder the housing and the enclosed predetermined electronic components to the circuit board.