Sprayable thermoplastic compositions
First Claim
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1. A sprayable hot-melt adhesive composition comprising (A) styrenic block copolymer whose interpolymerized units comprise from 12 to 45 weight percent of units derived from styrenic monomers;
- (B) tackifying resin; and
(C) ethylene copolymer having a melt index sufficiently high to impart good sprayability and desirably long open time to said composition.
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Abstract
Sprayable hot-melt adhesive compositions are disclosed comprising (A) styrenic block copolymer, (B) tackifying resin, and (C) ethylene copolymer. Methods of preparing and using said compositions are also disclosed.
126 Citations
19 Claims
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1. A sprayable hot-melt adhesive composition comprising (A) styrenic block copolymer whose interpolymerized units comprise from 12 to 45 weight percent of units derived from styrenic monomers;
- (B) tackifying resin; and
(C) ethylene copolymer having a melt index sufficiently high to impart good sprayability and desirably long open time to said composition. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
- (B) tackifying resin; and
- 14. An article comprising a first and second substrate, wherein said substrates are bonded together with a sprayable hot-melt adhesive composition comprising a styrenic block copolymer whose interpolymerized units comprise from 12 to 45 weight percent of units derived from styrenic monomers, a tackifying resin, and an ethylene copolymer having a melt index sufficiently high to impart good sprayability and desirably long open times to said composition.
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17. A method for preparing an article comprising the steps of
(A) preparing a sprayable hot-melt adhesive composition comprising a styrenic block copolymer whose interpolymerized units comprise from 12 to 45 weight percent of units derived from styrenic monomers, a tackifying resin, and an ethylene copolymer having a melt index sufficiently high to impart good sprayability and desirably long open times to said composition, (B) spraying said adhesive composition onto a first substrate to form an adhesive layer, and (C) applying a second substrate to said adhesive layer such that a bond is formed between said first and second layers.
Specification