Method for forming patterned transparent conducting film

• US 5,403,616 A
• Filed: 06/06/1994
• Issued: 04/04/1995
• Est. Priority Date: 10/27/1992
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Hattori, Akiyoshi, Yoshida, Akihiko, Hori, Yoshihiro
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): Maiorana, David M.
• Application Number:
  US08/254,664
• Time in Patent Office: 302 Days
• Field of Search: 427/126.3, 427/226, 427/259, 427/282, 427/287, 427/553, 427/558, 427/559, 427/386
• US Class Current: 427/126.3
• CPC Class Codes: G02F 1/13439 characterised by their electrical, optical, physical properties; materials therefor; method of making
• CPC Class Codes: H05B 2203/017 Manufacturing methods or apparatus for heaters
• CPC Class Codes: H05B 3/84 Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 2201/0166 Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
• CPC Class Codes: H05K 2201/0326 Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• CPC Class Codes: H05K 2203/0568 Resist used for applying paste, ink or powder
• CPC Class Codes: H05K 2203/121 Metallo-organic compounds
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
• CPC Class Codes: H05K 3/1258 by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern

Abstract

Printing is conducted at the transparent conducting film unnecessary portion on a substrate 1 with a masking ink having a higher thermal decomposition temperature than that of the transparent conducting film forming composition, and the ink is dried and cured by heat or light to form a masking pattern 2. The portion where a transparent conducting film is to be formed is preferably subjected to ozone cleaning and then coated with a transparent conducting film forming composition comprising an indium compound and/or a tin compound and a solvent to form a transparent conducting film forming composition layer 3. The thus worked substrate is subjected to a heat treatment, causing thermal decomposition of the masking pattern 2 after formation of a transparent conducting film. Then the residues of the masking ink and the transparent conducting film are removed to finally obtain a desired patterned transparent conducting film 4.

Claims

1. A process for forming a patterned transparent conducting film comprising the steps of:

(a) printing a masking ink on portions of a substrate at which no transparent conducting film forming composition is to be coated, said masking ink comprising at least a heat- or light-curing compound having a functional group,

(b) curing the masking ink by heat or light so as to have, after curing, a higher decomposition temperature than that of the transparent conducting film forming composition,

(c) coating the transparent conducting film forming composition on said substrate, said transparent conducting film forming composition comprising an indium compound, a tin compound, and a solvent, said tin compound being stannous oxalate,

(d) subjecting said substrate to a heat treatment, and

(e) removing residues of said masking ink and said transparent conducting film.

2. The process according to claim 1, wherein the masking ink contains at least one of epoxy acrylate, epoxy methacrylate, urethane acrylate and urethane methacrylate.

3. The process according to claim 1, wherein the masking ink contains carbon powder selected from the group consisting of natural graphite, synthetic graphite and amorphous carbon.

4. The process according to claim 3, wherein the carbon powder content in the masking ink is 30 wt % or less.

5. The process according to claim 1, wherein the solvent in the transparent conducting film forming composition is an organic solvent.

6. The process according to claim 1, wherein step (d) is carried out at a temperature above the decomposition of the transparent conducting film forming composition and the cured masking ink and below a substrate deforming temperature.

7. The process according to claim 1, wherein step (e) is carried out by physical means.

8. A process for forming a patterned transparent conducting film comprising the steps of:

(a) printing a masking ink on portions of a substrate at which no transparent conducting film forming composition is to be coated, said masking ink comprising at least a heat-or light-curing compound having a functional group,

(b) curing the masking ink by heat or light so as to have, after curing, a higher decomposition temperature than that of the transparent conducting film forming composition,

(c) subjecting the printed substrate to ozone cleaning,

(d) coating the transparent conducting film forming composition on said substrate, said transparent conducting film forming composition comprising an indium compound, a tin compound, and a solvent, said tin compound being stannous oxalate,

(e) subjecting said substrate to a heat treatment, and

(f) removing residues of said masking ink and said transparent conducting film.

9. The process according to claim 8, wherein step (b) comprises curing the masking ink by light and steps (b) and (c) are performed at the same time.

10. The process according to claim 8, wherein the masking ink contains at least one of epoxy acrylate, epoxy methacrylate, urethane acrylate and urethane methacrylate.

11. The process according to claim 8, wherein the masking ink contains carbon powder selected from the group consisting of natural graphite, synthetic graphite and amorphous carbon.

12. The process according to claim 11, wherein the carbon powder content in the masking ink is 30 wt % or less.

13. The process according to claim 8, wherein the solvent in the transparent conducting film forming composition is an organic solvent.

14. The process according to claim 8, wherein step (e) is carried out at a temperature above the decomposition of the transparent conducting film forming composition and the cured masking ink and below a substrate deforming temperature.

15. The process according to claim 8, wherein step (f) is carried out by physical means.