Method and apparatus for power-source wiring design of semiconductor integrated circuits

• US 5,404,310 A
• Filed: 10/17/1990
• Issued: 04/04/1995
• Est. Priority Date: 10/17/1989
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Mitsuhashi, Takashi
• Primary Examiner(s): Trans, Vincent N.
• Application Number:
  US07/599,030
• Time in Patent Office: 1,630 Days
• Field of Search: 364/488, 364/489, 364/490, 364/491
• US Class Current: 716/112
• CPC Class Codes: G06F 2119/06 Power analysis or power optimisation
• CPC Class Codes: G06F 30/33 Design verification, e.g. functional simulation or model checking
• CPC Class Codes: G06F 30/3308 using simulation
• CPC Class Codes: G06F 30/367 Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
• CPC Class Codes: G06F 30/394 Routing G06F30/396 takes precedence

Abstract

Disclosed is an apparatus for power-source wiring design of semiconductor integrated circuits including a theoretical lattice setting device for setting lattice to divide the surface of a semiconductor substrate sectional regions, an extracting device for extracting electric characteristics of each sectional region, and an operation device for obtaining circuit characteristics of each sectional region. Also disclosed is an apparatus for power-source wiring design of semiconductor integrated circuits comprising a trial circuit generating device for generating a circuit model of power-source.ground wiring of a semiconductor integrated circuit on trial, an analysis device for analyzing electric characteristics of each sectional region of the circuit model, and a comparison device for comparing the analysis result of electric characteristics obtained by the analysis device to the circuit model with an analysis result of electric characteristics previously obtained by the analysis device to a circuit model previously obtained, and estimating the former analysis result, and an improving plan generating device for generating information of a plan to improve the circuit model preferably in accordance with the comparison estimation result by the comparison device, and giving the information to the trial circuit generating device.

Claims

1. A method for power source wiring an integrated circuit, the method comprising the steps of:

a) generating a wiring layout according to predetermined wiring rules;

b) converting said wiring layout to a trial circuit having a plurality of four sided regions and storing said trial circuit;

c) identifying electrical factors affecting electrical current drawn in said regions and, from said factors, determining an electrical current value flowing into a node at an intersection of power source lines in each said region;

d) identifying an initial estimate of power source current to ground and a node voltage in each said region, determining admittance of said power source lines between said node and a peripheral node of said region from a selected resistivity and width of said power source lines, and determining therefrom a voltage at a said periphery of said region;

e) calculating a new value of said node voltage from said admittance and said current and subsequently calculating a new value for said node voltage;

f) repeating steps c) and d) until said voltage at said periphery achieves a predetermined accuracy with respect to a previously determined voltage at said periphery;

g) determining if said power source wiring layout produces in said power source wiring lines currents and voltage drops within predetermined levels;

h) if said currents and voltage drops are in said power source wiring lines are not within said predetermined levels, generating a plan, according to predetermined improving rules, for improving said power source wiring layout to obtain current levels and voltage drops in said power source wiring within said predetermined levels and repeating steps a) through g); and

i) when said power source wiring layout produces in said power source wiring lines currents and voltages within said predetermined levels, converting said trial circuit into a practical wiring layout.

2. The method recited in claim 1 wherein the step of generating an improvement plan comprises:

constraining current density to below a predetermined maximum based on power line widths and electromigration properties of metal used in forming said power source lines;

constraining a voltage drop from power source wiring ground resistance to a first fixed value;

constraining voltage variations between each node in said lattice to less than a second fixed value; and

minimizing a total sum of all power source line widths and a number of vias required in said power source wiring layout.

3. The method recited in claim 2 wherein the step of generating an improving plan further comprises:

providing power source ground wiring at input-output cells on a peripheral portion of said chip and providing said power source wiring lines to cells in a core portion of said chip;

providing power source compensation wiring in accordance with positional power consumption in said regions where voltage and current constraints have not been met by said wiring layout.

4. The method recited in claim 2 further comprising:

identifying said regions where current on vertical ones of said power source lines exceeds said first fixed value;

identifying ones of said regions where voltage drops along horizontal ones of said power source lines exceed said second fixed value;

identifying a power source wiring line with the largest number of regions exceeding said first and second fixed values;

positioning vias to supply current from said horizontal ones of said power source lines to provide compensation to said vertical ones of said power source lines at points where current exceeds said first fixed value.

5. The method recited in claim 4 wherein said horizontal ones of said power source lines are used for power source line compensation if located near a one of said regions where voltage drops along a said horizontal one of said power source lines exceed said second fixed value, and otherwise another horizontal power source compensation wiring is generated.

6. The method recited in claim 5 wherein, if a said one of said horizontal ones of said power source lines is used, a via is generated at a point where current on a vertical one of said power source lines exceeds said first fixed value.

7. The method recited in claim 2 wherein generating said improvement plan comprises:

providing power source compensation lines at positions capable of compensation and switches between said power source lines and said compensation lines;

determining the most suitable power line compensation by selectively activating and deactivating said switches.

8. The method recited in claim 7 further comprising the steps of:

estimating and storing the effects of closing said switches at opposite ends of one of said compensation lines;

estimating the improvement provided to a first predetermined position by said switch closing;

estimating the improvement provided to a second predetermined position by said switch closing;

applying an interval search method to compare said improvements, determine if said improvements are in a range wherein further improvement is impractical and, if not, to select other switches to be closed.

9. The method recited in claim 8 wherein said interval search is used to position vias.

10. A power-source wiring design apparatus for integrated circuits, comprising:

(a) means for dividing an entire substrate into regions having electrical characteristics;

(b) means for extracting said electric characteristics of said regions;

(c) means for obtaining circuit operational characteristics of each of said regions to obtain electric power consumption characteristics of said regions;

(d) means for displaying results obtained by said means for obtaining operational characteristics; and

(e) means for designing power-source wiring of said entire substrate on the basis of said results displayed by said display means,

wherein said means for obtaining operational characteristics comprises;

i) a circuit equation preparing portion for preparing a circuit equation for obtaining electric potentials of power source lines, an amount of electric current, power consumption or an amount of heat generation, and ii) a circuit equation analysis portion for solving said circuit equation to obtain said circuit operational characteristics of each said region, and

wherein said circuit equation analysis portion is constructed to calculate power consumption using an average switching probability of logic gates included in each of said regions.

11. The apparatus recited in claim 10, wherein said extracting means extracts the number of gates, dimensions of transistors, load capacitance of gates, and clock frequencies related to gates of each of said regions as electric characteristic parameters.

12. The apparatus recited claim 10, wherein each said region has four sides and wherein the circuit equation preparing portion is constructed to calculate a resistance value of power source lines crossing said four sides of each said region, and to prepare a circuit node equation by calculating an amount of current flowing in each of said regions.

13. A method of designing power-source wiring of semiconductor integrated circuits, the method comprising the steps of:

(a) dividing a substrate into regions;

(b) extracting electric characteristics of each of said regions on the semiconductor substrate;

(c) obtaining circuit operational characteristics of each of said regions to obtain electric power consumption characteristic of said region;

(d) displaying a said operational characteristic; and

(e) designing said power source wiring using said displayed operational characteristic,

wherein the step (b) comprises extracting the number of gates, dimensions of transistors, load capacitance of gates, and clock frequencies related to gates of each of said regions as electric characteristic parameters,

wherein the step (c) comprises i) a circuit equation preparing step for preparing a circuit equation for obtaining electric potentials of power source lines, an amount of electric current, power consumption or an amount of heat generation, and ii) a circuit equation analysis step for solving said circuit equation so as to obtain circuit characteristics of each said region, and

wherein in said circuit equation preparing step power consumption is determined assuming an average switching probability of logic gates included in each of said regions.

14. The method according to claim 13, wherein each said region has four sides and wherein in said circuit equation preparing step a resistance value of power source lines crossing said four sides of each of said regions is determined, and a circuit node equation is prepared by calculating an amount of current flowing in each said region.

15. A power-source wiring design apparatus for integrated circuits, comprising:

(a) trial circuit generating means for generating a circuit model of power-source ground wiring of an integrated circuit to be tried, said trial circuit generating means dividing said model into regions;

(b) means for analyzing electrical characteristics related to power consumption of each of said regions of said circuit model;

(c) means for comparing electric characteristics obtained by said analyzing means for analysis of a circuit model to electric characteristics previously obtained by said analyzing means for analysis of a previous circuit model; and

(d) means for determining if said power source requires improvement and generating information of a plan to improve said power source wiring in said circuit model in accordance with results of a comparison by said comparing means, and for providing said information to said trial circuit generating means for generating a revised circuit model if said power source wiring requires improvement,

wherein said means for analyzing comprises lattice setting means for setting a hypothetical lattice on the circuit model, means for extracting electric characteristics of each of said regions of said circuit model divided by said lattice, and means for obtaining circuit characteristics of each of said regions,

wherein said means for obtaining circuit characteristics comprises;

i) a circuit equation preparing portion for preparing a circuit equation for obtaining electric potentials of power source lines, an amount of electric current, power consumption or an amount of heat generation, and ii) a circuit equation analysis portion for solving said circuit equation to obtain said circuit operational characteristics of said region, and

wherein said circuit equation preparing portion is constructed to determine power consumption assuming an average switching probability of logic gates included in each of said regions.

16. The apparatus recited in claim 15, wherein the number of gates, dimensions of transistors, load capacitance of gates, and clock frequencies related to gates of each of said regions is extracted by said extracting means as electric characteristic parameters.

17. The apparatus recited in claim 15, wherein each said region has four sides and wherein said circuit equation preparing portion is constructed to determine a resistance value of power source lines crossing said four sides of each of said regions, and to prepare a circuit node equation by determining an amount of current flowing in each of said regions.