Induction plasma source
First Claim
1. A plasma process apparatus for integrated circuit fabrication having a chamber and a platen for supporting on a surface thereof a substrate in the chamber, comprising:
- a hemispherically shaped induction coil having multiple windings proceeding from an equatorial base to a pole of the hemispherically shaped induction coil generally parallel to the support surface of the platen, the chamber being disposed inside the induction coil;
a radio frequency power source coupled to the induction coil; and
a bias power source coupled to the platen.
1 Assignment
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Accused Products
Abstract
An induction plasma source for integrated circuit fabrication includes a hemispherically shaped induction coil in an expanding spiral pattern about the vacuum chamber containing a semiconductor wafer supported by a platen. The windings of the induction coil follow the contour of a hemispherically shaped quartz bell jar, which holds the vacuum. The power source is a low frequency rf source having a frequency of about 450 KHz and a power in the range of 200-2000 watts, and the pressure is a low pressure of about 0.1-100 mTorr. A high frequency rf source independently adjusts the bias voltage on the wafer.
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Citations
31 Claims
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1. A plasma process apparatus for integrated circuit fabrication having a chamber and a platen for supporting on a surface thereof a substrate in the chamber, comprising:
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a hemispherically shaped induction coil having multiple windings proceeding from an equatorial base to a pole of the hemispherically shaped induction coil generally parallel to the support surface of the platen, the chamber being disposed inside the induction coil; a radio frequency power source coupled to the induction coil; and a bias power source coupled to the platen. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A plasma process apparatus for integrated circuit fabrication having a chamber and a platen for supporting on a surface thereof a substrate in the chamber, comprising:
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a vessel having a hemispherical quartz wall which contains the chamber; a low frequency radio frequency power source which induces a low frequency oscillating azimuthal electric field in a region near the quartz wall so that electrons entering the region within the plasma boundary are accelerated and cancel an axial magnetic field in the interior of the plasma discharge; and a high frequency radio frequency power source which imposes a biasing voltage on the wafer independently of the low frequency radio frequency power source.
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12. A plasma process apparatus for integrated circuit wafer fabrication, comprising:
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a housing having a top plate; a bell jar having a hemispherical quartz wall, the bell jar being mounted on the top plate and containing a vacuum chamber; a platen having a top wafer-supporting surface; a hemispherical induction coil disposed about the quartz wall of the bell jar, the induction coil having a plurality of windings proceeding from an equatorial base to a pole of the hemispherically shaped induction coil generally parallel to the platen; a gas system coupled to the chamber; a radio frequency power source connected to one end of the induction coil through a matching network and the other end of the induction coil being connected to the housing; and a high frequency radio frequency power source connected to the platen through a matching network. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A method of generating a plasma for processing an integrated circuit substrate comprising the steps of:
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placing the substrate in a chamber contained within a hemispherical induction coil; delivering a gas to the chamber; applying an oscillating current to the induction coil so that a plasma is formed by excitation of the gas in the chamber; and imposing a biasing voltage on the substrate. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 31)
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30. A chamber housing of a plasma process apparatus for integrated circuit fabrication, comprising:
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a vessel disposed about a chamber; an induction coil disposed about the vessel and having multiple windings of a copper tube; a cooling system furnishing a cooling fluid to one end of the copper tube and removing cooling fluid from the other of the copper tube; and a thermally conductive dielectric material packing the windings of the induction coil and coupling the induction coil to the vessel.
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Specification