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Magnetron sputtering method and apparatus for compound thin films

  • US 5,405,517 A
  • Filed: 12/06/1993
  • Issued: 04/11/1995
  • Est. Priority Date: 12/06/1993
  • Status: Expired due to Fees
First Claim
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1. In apparatus for sputtering a compound thin film of selected coating materials onto selected substrates, an evacuable coating chamber, a thermally cooled rotating primary magnetron surrogate sputtering cathode, a plurality of controllable auxiliary coating means, said auxiliary coating means for coating the surface of said primary cathode with a plurality of selected materials, wherein said controllable auxiliary coating means cooperate to deposit upon said primary surrogate cathode a multi-element coating containing all necessary elements in controlled amounts, said multi-element coating being rotatable into a sputter plasma zone of said primary cathode which sputter deposits said selected compound thin film onto said substrates.

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