Method of producing a monolithically integrated millimeter wave circuit
First Claim
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1. A method of producing an integrated circuit including at least one HFET and at least one Schottky diode, comprising the following steps:
- epitaxially growing a first semiconductor layer sequence for a Schottky diode on a semi-insulating substrate;
subsequently precipitating an undoped further semiconductor layer, which is configured as an etch-stop layer, a desorption stop layer and a charge carrier barrier for the HFET, on Said first semiconductor layer sequence.covering the undoped further semiconductor layer with a thin undoped passivation layer;
subsequently producing, in a photolithographic process, a mask on the surface of the passivation layer for the first semiconductor layer sequence, which mask covers that part of said first semiconductor layer sequence from which the Schottky diode is to be produced;
converting the semiconductor material of the electrically conductive Schottky diode layers in the window regions of the mask into semi-insulating material by selective insulation implantation via the window regions of the mask;
thereafter removing the mask and the passivation layer;
growing a pseudomorphic second semiconductor layer sequence for the HFET on the undoped further semiconductor layer in a second epitaxy process;
selectively etching away the second semiconductor layer sequence of the HFET in the region of the first semiconductor layer sequence from which the Schottky diode is to be produced;
selectively removing the undoped further semiconductor layer in the region of the Schottky diode; and
producing the contact regions for the Schottky diode and for the HFET simultaneously.
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Abstract
A method and an arrangement for an integrated millimeter wave circuit wherein a Schottky diode and an HFET are produced in a quasi-planar arrangement from a semiconductor layer sequence. Due to the quasi-planar arrangement, the manufacturing process is simplified since particularly the contact regions of the Schottky diode and the HFET are produced simultaneously.
38 Citations
8 Claims
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1. A method of producing an integrated circuit including at least one HFET and at least one Schottky diode, comprising the following steps:
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epitaxially growing a first semiconductor layer sequence for a Schottky diode on a semi-insulating substrate; subsequently precipitating an undoped further semiconductor layer, which is configured as an etch-stop layer, a desorption stop layer and a charge carrier barrier for the HFET, on Said first semiconductor layer sequence. covering the undoped further semiconductor layer with a thin undoped passivation layer; subsequently producing, in a photolithographic process, a mask on the surface of the passivation layer for the first semiconductor layer sequence, which mask covers that part of said first semiconductor layer sequence from which the Schottky diode is to be produced; converting the semiconductor material of the electrically conductive Schottky diode layers in the window regions of the mask into semi-insulating material by selective insulation implantation via the window regions of the mask; thereafter removing the mask and the passivation layer; growing a pseudomorphic second semiconductor layer sequence for the HFET on the undoped further semiconductor layer in a second epitaxy process; selectively etching away the second semiconductor layer sequence of the HFET in the region of the first semiconductor layer sequence from which the Schottky diode is to be produced; selectively removing the undoped further semiconductor layer in the region of the Schottky diode; and producing the contact regions for the Schottky diode and for the HFET simultaneously. - View Dependent Claims (2, 3, 4, 6, 7, 8)
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5. A method as defined in claim 12, wherein the selective insulation implantation is effected with oxygen.
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