Coated tantalum feedthrough pin

• US 5,406,444 A
• Filed: 03/29/1993
• Issued: 04/11/1995
• Est. Priority Date: 03/29/1993
• Status: Expired due to Term

• Current Assignee: Daniel W. Latham
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Selfried, Lynn M., Tettemer, Susan A.
• Primary Examiner(s): Reynolds, Bruce A.
• Assistant Examiner(s): Mills, Gregory L.
• Application Number:
  US08/038,373
• Time in Patent Office: 743 Days
• Field of Search: 361/301.2, 361/302, 361/303, 361/307, 174/50.61, 174/50.63, 174/143, 174/152 GM, 333/182, 29/25.42
• US Class Current: 361/302
• CPC Class Codes: H01B 17/28 Capacitor type
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

Tantalum feedthrough conductor pins are provided with a thin, vacuum deposited metal coating to control oxidation growth during feedthrough fabrication. The coated feedthrough pins are incorporated into a feedthrough which includes a capacitive structure in electrical contact with the coated pin.

Claims

1. In a method of fabricating a combination electrical feedthrough and capacitive structure wherein at least one conductive tantalum pin is included within the feedthrough construction and a portion thereof is contacted by an insulating body and a portion thereof is contacted by the capacitive structure, the improvement comprising providing a thin film protective conductive metal coating by vacuum depositing the coating on at least that portion of the tantalum pin to which the capacitive structure is to be contacted prior to contacting it with the capacitive structure.

2. The method of claim 1 in which the protective metal coating is applied to the pin by sputtering.

3. The method of claim 1 in which the insulating body is glass and the pin is contacted by the glass insulating body before being coated.

4. The method of claim 1 in which the insulating body is glass and the entire tantalum pin is coated with the protective metal coating prior to its being contacted by the glass and the protective metal is selected from the group consisting of gold, platinum, palladium and titanium.

5. The method of claim 4 in which the protective metal coating is applied to the pin by sputtering.

6. A method of fabricating a combination feedthrough/capacitor comprising the steps:

metallizing a tantalum pin by vacuum depositing a thin film coating selected from the group consisting of gold, platinum, palladium and titanium;

inserting the pin through a metal ferrule and glassing it therein with a body of insulating glass, and

contacting the pin with a capacitive structure within the ferrule.

7. The method of claim 6 wherein the metallization is accomplished by sputtering.

8. The method of claim 6 wherein the entire pin is coated.

9. The method of claim 6 wherein only that portion of the pin contacting the capacitive structure is coated.

10. A method of fabricating a combination feedthrough/capacitor comprising the steps:

inserting a tantalum pin through a metal ferrule and glassing same therein with a glass insulator body;

metallizing at least that portion of the pin to be contacted by a capacitive structure with a thin film protective vacuum deposited metal coating selected to protect the pin from oxidation growth, and

contacting the pin with a capacitive structure within the ferrule.

11. The method of claim 10 wherein the metal coating is sputtered onto the pin.

12. In a combination electrical feedthrough/capacitor for minimizing EMI in an electrical device, including a tantalum feedthrough pin and a capacitive structure contacting a portion of the pin within a sealed metal ferrule, the improvement comprising a protective metal coating on at least that portion of the pin contacting the capacitive structure, the metal coating being a thin film vacuum deposited coating selected from those metals which are conductive and which protect the tantalum pin from oxidation formation when exposed to high temperatures.

13. The combination of claim 12 wherein the metal coating is a sputtered coating.

14. The combination of claim 13 wherein the entire pin is coated with the protective metal coating and the feedthrough includes glass insulator means sealingly engaging a portion of the coated tantalum pin, the improvement comprising a metal coating selected from the group consisting of gold, platinum, palladium and titanium.

15. The combination of claim 14 wherein the metal coating is a sputtered coating.

16. The combination of claim 12 wherein the seal is provided by a glass insulator body.

17. The combination of claim 12 wherein the entire pin is coated with the protective metal coating and the feedthrough includes brazed ceramic insulator means sealingly engaging a portion of the coated tantalum pin, the improvement comprising a metal coating selected from the group consisting of gold, platinum, palladium and titanium.

18. The combination of claim 17 wherein the metal coating is a sputtered coating.