Synchronizer ring and manufacturing method thereof
First Claim
1. A synchronizer ring including a coating of wear-resistant material which is formed on a conical surface of a body of said synchronizer ring by thermal spraying and by pressing and rotating a conical jig against said conical surface, said conical surface having a ten-point average roughness of 22 to 67 μ
- mRz and a plateau ratio of hp40-hpl;
35 μ
m.
1 Assignment
0 Petitions
Accused Products
Abstract
A synchronizer ring and a manufacturing method thereof having an object to reduce the manufacturing cost and to improve its durability. Therefore, the synchronizer ring according to the invention includes a coating formed by thermal spraying of wear-resistant material on a conical surface of the synchronizer ring body which has been subjected to mechanical machining, pressing a conical jig having a predetermined opening angle against the coated surface in a manner to exert a surface pressure of 4 to 40 N/mm2 on the coated surface, and rotating the conical jig in a range of 45 to 590 degrees, to thereby make the heights of projections of the surface of the coating uniform.
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Citations
3 Claims
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1. A synchronizer ring including a coating of wear-resistant material which is formed on a conical surface of a body of said synchronizer ring by thermal spraying and by pressing and rotating a conical jig against said conical surface, said conical surface having a ten-point average roughness of 22 to 67 μ
- mRz and a plateau ratio of hp40-hpl;
35 μ
m.
- mRz and a plateau ratio of hp40-hpl;
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2. A synchronizer ring including a coating of wear-resistant material which is formed on a conical surface of a body of said synchronizer ring, said conical surface having a ten-point average roughness of 22 to 67 μ
- mRz and a plateau ratio of hp40-hpl;
35 μ
m.
- mRz and a plateau ratio of hp40-hpl;
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3. A synchronizer ring including a coating of wear-resistant material which is formed on a conical surface of a body of said synchronizer ring, said conical surface having a plateau ratio of hp40-hpl:
- 35 μ
m.
- 35 μ
Specification
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- Resources
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Current AssigneeAisan Kogyo Kabushiki Kaisha
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Original AssigneeAisan Kogyo Kabushiki Kaisha
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InventorsYamada, Shigeki
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Primary Examiner(s)Bonck, Rodney H.
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Application NumberUS08/047,194Time in Patent Office732 DaysField of Search192/107 M, 192/53 F, 192/107 R, 148/436US Class Current192/107.00MCPC Class CodesF16D 2250/00 Manufacturing; AssemblyF16D 23/025 Synchro ringsF16D 23/06 and a blocking mechanism pr...F16D 65/127 characterised by properties...
