Physical variable sensor and method of manufacturing the same

• US 5,407,730 A
• Filed: 07/22/1993
• Issued: 04/18/1995
• Est. Priority Date: 07/24/1992
• Status: Expired due to Fees

• Current Assignee: Detelle Relay KG LLC (Intellectual Ventures LLC)
• Original Assignee: Omron Corporation
• Inventors: Imanaka, Koichi
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): Lee, Kam F.
• Application Number:
  US08/095,320
• Time in Patent Office: 635 Days
• Field of Search: 428/209, 428/210, 428/901
• US Class Current: 428/209
• CPC Class Codes: G01D 21/00 Measuring or testing not otherwise provided for
• CPC Class Codes: G01D 3/02 with provision for altering or correcting the law of variation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

A physical variable sensor with a processor circuit that can be used for any of a number of different applications. The variable sensor is compact and inexpensive to produce. The variable sensor comprises first, second and third substrates. On the second substrate is mounted a sensor component and a first processor circuit to convert the output of the sensor component to a standard electrical signal. A second processor circuit is provided on the third substrate. The second processor circuit includes an amplifier circuit, a digital fuzzy microprocessor and a luminous element to transmit an optical signal to the exterior. A solar cell can be provided on the first substrate to supply energy to the circuits. The first and third substrates are common to all types of sensors, and by modifying the second substrate different sensors to measure different types of variables can be produced.

Claims

1. A physical variable sensor, comprising:

a first substrate forming a surface substrate;

a second substrate forming a sensor substrate, said sensor substrate, comprising;

a sensor component which converts a physical variable measured into a characteristic electrical signal; and

a first electrical processor circuit which converts said characteristic electrical signal output from said sensor component into a compatible electrical signal; and

a third substrate forming an electrical processor circuit substrate, said electrical circuit substrate including a second electrical processor circuit which converts said compatible electrical signal into a specific electrical property, said first, second and third substrates are stacked and connected electrically to each other and said second and third substrates are connected together so that said output signal of said second substrate serves as an input signal to said third substrate.

2. A physical variable sensor as claimed in claim 1, wherein said first, second and third substrates are stacked in a form that said second substrate is sandwiched between said first and third substrates.

3. A physical variable sensor as claimed in claim 1, wherein said first, second and third substrates are stacked in a form that said third substrate is sandwiched between said first and second substrates.

4. A physical variable sensor as claimed in claim 2, wherein said first substrate has an opening at a corresponding location of said sensor component mounted on said second substrate through which the external physical variable can be measured.

5. A physical variable sensor as claimed in claim 1, wherein said electrical connection between said first, second and third substrates is accomplished by the engagement of a male electrode on one substrate with a female electrode on the other substrate.

6. A physical variable sensor as claimed in claim 1, wherein said electrical connection between said first, second and third substrates is accomplished by means of pathways comprising a conductive polymer.

7. A physical variable sensor as claimed in claim 1, wherein said electrical connection between said first, second and third substrates is accomplished by means of optical signals sent by an electro-optical converter element on one substrate to a photo-electric converter element on the other substrate.

8. A physical variable sensor as claimed in claim 1, wherein said first substrate comprises a solar cell on said first substrate to supply driving energy.

9. A physical variable sensor as claimed in claim 1, wherein a battery is supplied on either said first or said second substrates to supply driving energy.

10. A physical variable sensor as claimed in claim 1, wherein said first or second substrate comprises an electrical converter on either said first or said second substrate to supply driving energy, and said electrical converter receives microwave signals and converts said microwave signals into electric power.

11. A physical variable sensor as claimed in claim 1, further comprising a transmission device to transmit to an external controller said specific electrical property outputted from said third substrate.

12. A physical variable sensor as claimed in claim 11, wherein said transmission device is a wireless device.

13. A physical variable sensor as claimed in claim 1, wherein each of said first, second and third substrates comprises a semi-conductive material selected from the group consisting of a single crystal and polycrystal semi-conductor.

14. A physical variable sensor as claimed in claim 1, wherein each of said first, second and third substrates comprises a ceramic material.

15. A physical variable sensor as claimed in claim 1, wherein said second substrate comprises a plurality of stacked constituent substrates each having a different sensor component, and said first electrical processor circuit electrically connects said constituent substrate to said third substrate.

16. A physical variable sensor as claimed in claim 15, wherein said first, second and third substrates are stacked in a form that said second substrate is sandwiched between said first and third substrate.

17. A physical variable sensor as claimed in claim 16, wherein said first substrate and said constituent substrates have an opening at a corresponding location of said sensor component mounted on an adjacent lower constituent substrate through which the external physical variable can be measured.

18. A physical variable sensor as claimed in claim 15, wherein said third substrate further comprises a switching circuit to switch two or more electrical signals from two or more sensor components, and output a single electrical signal as an input to said second electrical processor circuit.

19. A physical variable sensor as claimed in claim 18, wherein said switching circuit includes a timing circuit, and detects individual measurements by applying time sharing to said two or more electric signals from said two or more sensor components.

20. A physical variable sensor as claimed in claim 18, wherein said switching circuit further comprises a control receiving device to receive a control signal from an external controller to switch said two or more electric signals so that a desired physical variable can be selected.

21. A physical variable sensor as claimed in claim 15, further comprising a transmission device to transmit to an external controller, an electrical property outputted from said third substrate.

22. A physical variable sensor as claimed in claim 21, wherein said transmission device is a wireless device.

23. A physical variable sensor, comprising:

a surface substrate;

a sensor substrate connected to said surface substrate, said sensor substrate including at least one sensor component and a first processor circuit receiving input from said at least one sensor component;

a processor substrate connected to said sensor substrate, said processor substrate including a second processor circuit receiving input from said first processor circuit; and

a power source for driving said circuits,

wherein said sensor substrate can be substituted with another sensor substrate having at least one different sensor component for converting the physical variable sensor to detect a different physical property.