Substrate for a sintered electrode

• US 5,408,744 A
• Filed: 04/30/1993
• Issued: 04/25/1995
• Est. Priority Date: 04/30/1993
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Gates, James T.
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US08/056,448
• Time in Patent Office: 725 Days
• Field of Search: 29/875, 29/885
• US Class Current: 29/875
• CPC Class Codes: A61N 1/0568 with drug delivery
• CPC Class Codes: Y10T 29/49206 by powder metallurgy
• CPC Class Codes: Y10T 29/49224 with coating

Abstract

A substrate for use in a pacing lead having a sintered porous platinized steroid eluting electrode. The substrate has at least one raised surface which provides an advantageous mounting portion for the sintered electrode. In the preferred embodiment the mounting portion is nailhead-shaped. The present invention provides an electrode produced with increased dimensional consistency, mechanical strength and impedance as compared to electrodes having a straight wire substrate. Also disclosed is a method of manufacturing such an electrode.

Claims

1. A method of manufacturing an electrode for a lead used to stimulate and sense a body comprising the steps of:

forming a raised surface on a distal end of a conductive stem;

preparing a slurry mixture containing at least one conductive material;

introducing at least a portion of said raised surface of said conductive stem into said slurry mixture;

withdrawing said portion of said raised surface of said conductive stem from said slurry mixture such that a portion of said slurry mixture envelopes said raised portion of said conductive stem and covers said distal end of said substrate in a non-uniform thickness; and

sintering said portion of said slurry mixture enveloping said raised surface.

2. The method of claim 1 wherein said forming said raised surface on a distal end of a conductive stem comprises deforming with heat said distal end of said conductive stem.

3. The method of claim 2 wherein said deforming with heat comprises melting said distal end of said conductive stem.

4. The method of claim 1 wherein said forming said raised surface on said distal end of said conductive stem comprises mechanically deforming said distal end of said conductive stem.

5. The method of claim 1 wherein said conductive material is from the class of materials consisting essentially of platinum, palladium, titanium, tantalum, rhodium, iridium, carbon, vitreous carbon and alloys, oxides or nitrides of such metals.

6. The method of claim 1 wherein said raised surface comprises a nailhead-shaped configuration.

7. The method of claim 1 wherein said mixture comprises a slurry containing at least one binder.

8. A method of manufacturing an electrode for a lead used to stimulate and sense a body comprising the steps of:

providing a cylindrical conductive stem having a first diameter;

forming a raised surface on a distal end of the conductive stem, the raised surface having a second diameter, the second diameter being greater than the first diameter;

preparing a mixture containing at least one conductive material;

introducing at least a portion of the raised surface of the conductive stem into the mixture;

withdrawing the portion of the raised surface of the conductive stem from the mixture such that a portion of the mixture envelopes the raised portion of the conductive stem, the portion of the mixture enveloping the raised portion of the conductive stem having a third diameter, the third diameter being greater than the second diameter; and

sintering the portion of the mixture enveloping the raised surface.

9. The method of claim 8 the portion of the mixture enveloping the raised portion of the conductive stem envelopes the raised portion in a non-uniform thickness.

10. A method of manufacturing an electrode for a lead used to stimulate and sense a body comprising the steps of:

providing a conductive stem having a first diameter;

forming a raised surface at a distal end of the conductive stem, the raised surface having a second diameter, the second diameter being equal to or greater than the first diameter;

preparing a mixture containing at least one conductive material;

introducing at least a portion of the raised surface of the conductive stem into the mixture;

withdrawing the portion of the raised surface of the conductive stem from the mixture such that a portion of the mixture envelopes the raised portion of the conductive stem, the portion of the mixture enveloping the raised portion of the conductive stem having a third diameter, the third diameter being greater than the second diameter, the mixture enveloping the raised portion of the conductive stem in a non-uniform thickness; and

sintering the portion of the mixture enveloping the raised surface.

11. The method of either claims 8 or 10 wherein the forming the raised surface on the distal end of the conductive stem comprises mechanically deforming the distal end of the conductive stem.

12. The method of either claims 8 or 10 wherein the conductive material is from the class of materials consisting essentially of platinum, palladium, titanium, tantalum, rhodium, iridium, carbon, vitreous carbon and alloys, oxides or nitrides of such metals.

13. The method of either claims 8 or 10 wherein the mixture comprises a slurry containing at least one binder.

14. The method of either claims 8 or 10 wherein the mixture comprises a fluidized bed of the conductive material and a gas.