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Semiconductor device package with shaped parts for direct coupling to standard connectors

  • US 5,412,248 A
  • Filed: 10/13/1992
  • Issued: 05/02/1995
  • Est. Priority Date: 03/03/1992
  • Status: Expired due to Term
First Claim
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1. An electronic device package, comprising:

  • a metal plate;

    an electronic active semiconductor device mounted to said plate;

    a polymer body totally enclosing said device, and enclosing only part of said plate;

    a first plurality of contact terminals partially embedded in a first face of said body to define, in combination with said first face, a first predetermined standard geometry for harsh-environment electrical connectors,each said contact terminal being operatively electrically connected to a separate respective portion of said device;

    and a second plurality of contact terminals partially embedded in a second face of said bodyto define, in combination with said second face, a second predetermined standard geometry for harsh-environment electrical connectors,each said contact terminal being operatively electrically connected to a separate respective portion of said active semiconductor device;

    wherein said plate extends laterally away from said body to provide through holes in said plate for mounting.

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