Semiconductor device package with shaped parts for direct coupling to standard connectors
First Claim
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1. An electronic device package, comprising:
- a metal plate;
an electronic active semiconductor device mounted to said plate;
a polymer body totally enclosing said device, and enclosing only part of said plate;
a first plurality of contact terminals partially embedded in a first face of said body to define, in combination with said first face, a first predetermined standard geometry for harsh-environment electrical connectors,each said contact terminal being operatively electrically connected to a separate respective portion of said device;
and a second plurality of contact terminals partially embedded in a second face of said bodyto define, in combination with said second face, a second predetermined standard geometry for harsh-environment electrical connectors,each said contact terminal being operatively electrically connected to a separate respective portion of said active semiconductor device;
wherein said plate extends laterally away from said body to provide through holes in said plate for mounting.
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Abstract
A packaging structure is disclosed for a semiconductor device, having a body configured to include at least one part provided with contact terminals and shaped to form a connector member for direct coupling to a standard connector member from an external circuit. A connector assembly is also disclosed which is fully sealed from moisture and comprises the packaging structure.
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Citations
25 Claims
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1. An electronic device package, comprising:
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a metal plate; an electronic active semiconductor device mounted to said plate; a polymer body totally enclosing said device, and enclosing only part of said plate; a first plurality of contact terminals partially embedded in a first face of said body to define, in combination with said first face, a first predetermined standard geometry for harsh-environment electrical connectors, each said contact terminal being operatively electrically connected to a separate respective portion of said device; and a second plurality of contact terminals partially embedded in a second face of said body to define, in combination with said second face, a second predetermined standard geometry for harsh-environment electrical connectors, each said contact terminal being operatively electrically connected to a separate respective portion of said active semiconductor device; wherein said plate extends laterally away from said body to provide through holes in said plate for mounting. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An electronic device package, comprising:
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a metal plate including mounting holes; an electronic active semiconductor device mounted to said plate; a polymer body totally enclosing said device, and enclosing pan of said plate, but not covering said mounting holes; a first plurality of contact terminals partially embedded in a first face of said body to define, in combination with said first face, a first predetermined standard geometry for harsh-environment electrical connectors, each said contact terminal being operatively electrically connected to a separate respective portion of said device; and a second plurality of contact terminals partially embedded in a second face of said body to define, in combination with said second face, a second predetermined standard geometry for harsh-environment electrical connectors, each said contact terminal being operatively electrically connected to a separate respective portion of said device; and a respective substantially tubular elastomeric boot surrounding each said plurality of contact terminals. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification