Multilayer printed circuit board and method of manufacturing same

• US 5,414,224 A
• Filed: 01/29/1993
• Issued: 05/09/1995
• Est. Priority Date: 04/01/1991
• Status: Expired due to Fees

• Current Assignee: Aktsionernoe Obschestvo Otkrytogo Tipa "Vniieto"
• Original Assignee: Filial Vsesojuznogo Nauchno-Issledovatelskogo Instituta
• Inventors: Slonimsky, Alexandr D., Piliposian, Pogos M., Tikhonov, Vladimir I., Seliverstov, Lev A., Vardenburg, Arnold K., Emelyanov, Viktor L., Emelyanov, Alexandr L., Adasko, Vladimir I., Rogozhin, Jury F., Sklyarov, Nikolai A.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Figlin, Cheryl R.
• Application Number:
  US07/972,450
• Time in Patent Office: 830 Days
• Field of Search: 174/250, 174/255, 174/262, 174/263, 174/264, 174/265, 174/266, 428/901
• US Class Current: 174/262
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2201/09563 Metal filled via
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2203/105 Using an electrical field; Special methods of applying an electric potential
• CPC Class Codes: H05K 2203/1355 Powder coating of insulating material
• CPC Class Codes: H05K 3/0023 by exposure and development of a photosensitive insulating layer
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: H05K 3/4076 by thin-film techniques
• CPC Class Codes: H05K 3/445 having insulated holes or insulated via connections through the metal core
• CPC Class Codes: H05K 3/4608 comprising an electrically conductive base or core
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 3/467 Adding a circuit layer by thin film methods H05K3/4647 takes precedence

Abstract

A metal base (1), and holes (12) therein, of a printed circuit board are given an insulating coat (2) produced from an epoxy compound in particulate form which is deposited and machined successively at either side. An insulating topology (16) in a photoresist imposed on the insulating coat (2) is metal-plated in vacuum. On removing the metal from the prominent portions of the topology (16) tracks (4) and connecting pads (5) of a layer (3) of conducting pattern are left. An insulating topology (18) consistent with the disposition of connecting pads (11) and connecting posts (10) interconnecting the layers (3, 6) of conducting patterns is formed and metal-plated. On removing the metal from the prominent portions an insulating layer (9) with connecting posts (10) and connecting pads (11) is left. Next, an insulating topology (19) consistent with the topology of the layer (6) of conducting pattern is formed and metal-plated. After machining, tracks (7) with connecting pads (8) of the layer (6) of conducting pattern are left.

Claims

1. A multilayer printed circuit board comprising:

a metal base,

said base having a plurality of through holes in a pattern for accommodating leads of radio components,

an insulating layer applied to at least one side of said base and to walls of said holes, said insulating layer and said base having substantially the same thickness,

a first layer of electrically conductive material arranged in a pattern on said insulating layer and comprising a group of electrically conductive sections insulated from each other by insulating sections, said electrically conductive sections and said insulating section being of the same thickness,

said electrically conductive sections comprising a group of tracks and a group of connecting pads, each pad of said group surrounding a corresponding through hole, some of said connecting pads being electrically coupled to other said connecting pads by tracks of said group,

an insulating layer located on said pattern of said first layer of said conductive material and comprising a group of insulating sections and a group of electrically conductive sections in the form of a plurality of switching posts and connecting pads surrounding corresponding through holes of said group, said electrically conductive sections and said insulating sections being of identical thickness,

said plurality of switching posts providing electrical connection of said tracks and said connecting pads in said pattern in said first layer of conductive material,

an outer layer of conductive material arranged in a pattern on said insulating layer and including electrically conductive sections insulated from each other by insulating sections, said insulating sections and said electrically conductive sections being of the same thickness,

said electrically conductive sections of the outer layer of the conductive pattern comprising a plurality of tracks and first and second groups of connecting pads, said first group of connecting pads surrounding corresponding through holes, said second group of connecting pads being connectable to surface-mounted radio components,

the connecting pads surrounding the through holes having a thickness equal to the sum of the thicknesses of said layers of the conductive material and said insulating layers, and

end faces of the superimposed connecting pads surrounding said through holes having projections, and end faces of corresponding insulating sections having indentations located opposite said projections and contacting the projections over the entire surface thereof.

2. The multilayer printed circuit board of claim 1, comprising a second layer of conductive material located on said insulating layer and a second insulating layer located on said second layer of conductive material.

3. The multilayer printed circuit board of claim 1, comprising at least one additional layer of conductive material located on said insulating layer and at least one additional insulating layer located on said additional layer of conductive material.

4. The multilayer printed circuit board of claim 3, comprising a group of strips arranged contiguous to an edge of each said layer of conductive material and each said insulating layer and electrically coupled by means of corresponding tracks from among said plurality of tracks connected to corresponding connecting pads.

5. The multilayer printed circuit board of claim 4, wherein said group of strips have end faces with projections, corresponding insulating sections have end faces with indentations located opposite said projections and in contact therewith over the entire surface thereof.

6. The multilayer printed circuit board of claim 5, wherein the thickness of said insulating layer has a deviation from a nominal value within the range of +5%, while the thickness of said layers of conductive material and said insulating layers has a deviation from a nominal value within the range of +10%.

7. The multilayer printed circuit board of claim 3, wherein the thickness of said insulating layer on said base and on said walls of the holes is the same.

8. The multilayer printed circuit board of claim 3, wherein said metal base is made of magnetic electrical-sheet steel.

9. The multilayer printed circuit board of claim 3, wherein said insulating sections are made of a photopolymer composition material.