Thermal-ink heater array using rectifying material

• US 5,414,245 A
• Filed: 08/03/1992
• Issued: 05/09/1995
• Est. Priority Date: 08/03/1992
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Company (HP Inc.)
• Original Assignee: HP Inc.
• Inventors: Hackleman, David E.
• Primary Examiner(s): Walberg, Teresa J.
• Application Number:
  US07/925,355
• Time in Patent Office: 1,009 Days
• Field of Search: 219/543, 219/548, 219/549, 219/528, 346/76 PH
• US Class Current: 219/548
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/164 thin film formation
• CPC Class Codes: B41J 2/34 comprising semiconductors
• CPC Class Codes: B41J 2202/03 Specific materials used

Abstract

A heater array for an ink jet printhead includes an insulating substrate, which can be a layer of ceramic, flexible plastic, insulated flexible metal, polysilicon, or single crystalline silicon. A first material layer is deposited atop the insulating substrate and patterned in parallel stripes. A first insulating layer is deposited atop the first material layer and patterned with contact windows above the first material layer in corresponding desired heating locations, usually in a symmetrical grid. A second material layer is deposited atop the first insulating layer and pattern in parallel stripes orthogonal to those in the first material layer. The first and second material layers are in physical and electrical contact with each other through the contact windows in the first insulating layer to form a resistive diode junction at each desired heating location. The entire surface of the heating array is covered with a second insulating layer, with contacts provided to the first and second material layers.

Claims

1. A heater array for heating ink in an ink jet printhead comprising:

an insulating substrate;

a first material layer atop the insulting substrate having a first predetermined pattern;

a first insulating layer atop the first material layer having a plurality of contact windows above the first material layer pattern in corresponding desired heating locations;

a second material layer atop the first insulating layer having a second predetermined pattern, the first and second material layers being in physical contact with each other through the contact windows in the first insulating layer;

means for contacting the first material layer; and

means for contacting the second material layer,

wherein each physical contact region between the first and second material layers forms a merged resistive diode junction at each desired heating location, the physical contact region of the resistive diode junction transferring conductive heat directly to ink in an ink jet printhead.

2. A heater array as in claim 1 in which the substrate comprises a ceramic layer.

3. A heater array as in claim 2 in which the first and second material layers each comprise a crystalline silicon layer.

4. A heater array as in claim 1 in which the substrate comprises an insulated flexible metal layer.

5. A heater array as in claim 1 in which the first material layer comprises a semiconductor material layer of a first doping type and the second material layer comprises a semiconductor material layer of a second doping type.

6. A heater array as in claim 1 in which the substrate comprises a flexible plastic layer.

7. A heater array as in claim 1 in which the first and second material layers each comprise materials that form a resistive diode junction of sufficient resistance to boil the ink when said diode junction is in a forward biased condition while at the same time limiting forward current in said diode junction.

8. A heater array as in claim 1 in which the first material layer comprises a metal layer and the second material layer comprises a semiconductor material layer.

9. A heater array as in claim 8 in which the first metal layer comprises an iron layer and the second semiconductor layer comprises an iron oxide layer.

10. A heater array as in claim 1 in which the first material layer comprises a semiconductor layer and the second material layer comprises a metal layer.

11. A heater array as in claim 10 in which the first semiconductor layer comprises an iron oxide layer and the second metal layer comprises an iron layer.

12. A heater array as in claim 1 in which the first material layer is arranged into a plurality of stripes and the second material layer is arranged into a plurality of stripes orthogonal to the stripes of the first material layer.

13. A heater array as in claim 1 in which the forward conduction current of each resistive diode junction is self-limited to a predetermined maximum current.

14. A heater array as in claim 1 further comprising a second insulating layer atop the patterned second material layer, the second insulating layer completely covering and conforming around the resistive diode junction.

15. A heater array according to claim 1 wherein the ink jet printhead includes a reservoir retaining the ink completely around said heater array and multiple apertures, each aperture positioned immediately above a corresponding resistive diode junction thereby directing dispersion of the ink onto a print medium after being boiled by the corresponding resistive diode junction.

16. A heater array according to claim 15 wherein each physical contact region forms a diode junction while a resistive portion is formed vertically across the first and second material layers immediately below the associated printhead aperture.