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Integrated circuit card

  • US 5,414,253 A
  • Filed: 02/18/1994
  • Issued: 05/09/1995
  • Est. Priority Date: 12/03/1991
  • Status: Expired due to Term
First Claim
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1. An integrated circuit card, comprising:

  • a substrate having top and bottom surfaces;

    a plurality of first packaged semiconductor devices mounted on said top surface of said substrate;

    a plurality of second packaged semiconductor devices mounted on said bottom surface of said substrate;

    a housing bonded to and covering said first and second packaged semiconductor devices, said housing including a first metal cover having a planar surface bonded to at least selected ones of said first packaged semiconductor devices, a second metal cover having a planar surface bonded to at least selected ones of said second packaged semiconductor devices, metal sidewalls extending between said first and second metal covers, and a metal rear wall extending between said first and second metal covers, said first and second metal covers, metal sidewalls, and metal rear wall forming external surfaces of said integrated circuit card, said metal sidewalls including a first portion extending from said planar surface of said first metal cover and a second portion extending from said planar surface of said second metal cover and said metal rear wall including a first portion extending from said planar surface of said first metal cover and a second portion extending from said planar surface of said second metal cover; and

    a connector attached to said substrate, said first metal cover having a lip that extends from and is substantially planar to said planar surface of said first metal cover bonded to a top surface of said connector, said second metal cover having a lip that extends from and is substantially planar to said planar surface of said second metal cover bonded to a bottom surface of said connector.

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