Integrated circuit card

• US 5,414,253 A
• Filed: 02/18/1994
• Issued: 05/09/1995
• Est. Priority Date: 12/03/1991
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Carpenter, Alton, Baudouin, Daniel
• Primary Examiner(s): HAJEC, DONALD T
• Assistant Examiner(s): Chin, Esther H.
• Application Number:
  US08/198,653
• Time in Patent Office: 445 Days
• Field of Search: 235/492, 235/441, 361/395, 361/392, 361/394, 361/399, 361/736, 361/728, 361/730, 361/752, 361/757, 361/737, 361/758, 361/742, 361/748, 902/26, 439/76
• US Class Current: 235/492
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier

Abstract

An integrated circuit card includes packaged semiconductor devices mounted on a substrate. The integrated circuit card also includes a housing bonded by sheet adhesives to the semiconductor devices or substrate. The housing includes top and bottom metal covers and may include spacers positioned between the sheet adhesives and semiconductor devices or substrate.

Claims

1. An integrated circuit card, comprising:

a substrate having top and bottom surfaces;

a plurality of first packaged semiconductor devices mounted on said top surface of said substrate;

a plurality of second packaged semiconductor devices mounted on said bottom surface of said substrate;

a housing bonded to and covering said first and second packaged semiconductor devices, said housing including a first metal cover having a planar surface bonded to at least selected ones of said first packaged semiconductor devices, a second metal cover having a planar surface bonded to at least selected ones of said second packaged semiconductor devices, metal sidewalls extending between said first and second metal covers, and a metal rear wall extending between said first and second metal covers, said first and second metal covers, metal sidewalls, and metal rear wall forming external surfaces of said integrated circuit card, said metal sidewalls including a first portion extending from said planar surface of said first metal cover and a second portion extending from said planar surface of said second metal cover and said metal rear wall including a first portion extending from said planar surface of said first metal cover and a second portion extending from said planar surface of said second metal cover; and

a connector attached to said substrate, said first metal cover having a lip that extends from and is substantially planar to said planar surface of said first metal cover bonded to a top surface of said connector, said second metal cover having a lip that extends from and is substantially planar to said planar surface of said second metal cover bonded to a bottom surface of said connector.

2. The integrated circuit card of claim 1 in which said first metal cover is bonded to said first packaged semiconductor devices by a first sheet adhesive and said second metal cover is bonded to said second packaged semiconductor devices by a second sheet adhesive.

3. The integrated circuit card of claim 1, in which said housing includes a spacer bonded to nonselected ones of said packaged semiconductor devices and to one of said first and second metal covers.

4. The integrated circuit card of claim 1, in which said first and second metal covers are connected to a ground lead on said substrate.

5. The integrated circuit card of claim 1 in which said first metal cover, second metal cover, metal sidewalls, and metal rear wall are integrally formed.

6. An integrated circuit card, comprising:

a substrate having top and bottom surfaces;

a plurality of packaged semiconductor devices mounted on one of said top and bottom surfaces of said substrate;

a housing having first and second portions, said first portion bonded to and covering said packaged semiconductor devices, said second portion bonded to the other of said top and bottom surfaces, said first portion including a first metal cover having a planar surface bonded to at least selected ones of said packaged semiconductor devices, said second portion including a spacer bonded to the other of said top and said bottom surfaces of said substrate and a second metal cover having a planar surface bonded to said spacer, said housing further including metal sidewalls extending between said first and second metal covers and a metal rear wall extending between said first and second metal covers, said first and second metal covers, metal sidewalls, and metal rear wall forming external surfaces of said integrated circuit card, said metal sidewalls including a first portion extending from said planar surface of said first metal cover and a second portion extending from said planar surface of said second metal cover and said metal rear wall including a first portion extending from said planar surface of said first metal cover and a second portion extending from said planar surface of said second metal cover; and

a connector attached to said substrate, said first metal cover having a lip that extends from and is substantially planar to said planar surface of said first metal cover bonded to a top surface of said connector, said second metal cover having a lip that extends from and is substantially planar to said planar surface of said second metal cover bonded to a bottom surface of said connector.

7. The integrated circuit card of claim 6 in which said first metal cover is bonded to said packaged semiconductor devices by a first sheet adhesive and said second metal cover is bonded to said spacer by a second sheet adhesive.

8. The integrated circuit card of claim 6, in which said housing includes a spacer bonded to nonselected ones of said packaged semiconductor devices and to said first metal cover.

9. The integrated circuit card of claim 6, in which said first and second metal covers are connected to a ground lead on said substrate.

10. The integrated circuit card of claim 6 in which said first metal cover, second metal cover, metal sidewalls, and metal rear wall are integrally formed.