Modem backplane techniques

• US 5,416,776 A
• Filed: 05/27/1994
• Issued: 05/16/1995
• Est. Priority Date: 05/27/1994
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: US Robotics Incorporated
• Inventors: Panzarella, Russell C., Salzman, Scot W.
• Primary Examiner(s): Safourek, Benedict V.
• Application Number:
  US08/250,276
• Time in Patent Office: 354 Days
• Field of Search: 375/7, 375/8, 375/36, 375/38, 375/121, 379/93, 361/393, 361/394, 361/413, 361/415, 370/33, 370/84, 370/85.9, 370/85.11, 370/119
• US Class Current: 370/463
• CPC Class Codes: G06F 13/409 Mechanical coupling back panels H05K7/1438
• CPC Class Codes: H04L 27/00 Modulated-carrier systems
• CPC Class Codes: H04M 11/06 Simultaneous speech and data transmission, e.g. telegraphic transmission over the same conductors

Abstract

An improved backplane apparatus for transmitting signals to and from a modem system. The modem system includes more than one modem for transmitting data via at least one telephone line and via at least one network. The modem system has a first bus for management signal communication with the modems at a predetermined first data rate, and a second bus for transmitting data between the telephone line and the modems at a predetermined second data rate greater than the first data rate. The modem system also has a third bus for transmitting data between the modems and the network at a predetermined third data rate greater than the second data rate, and a fourth bus for distributing DC power and ground potential. The modem system defines a first impedance for terminating the first bus, a second impedance for terminating the second bus, and a third impedance for terminating the third bus. Finally, the modem system has structure for spacing the busses in layers in the backplane dependent on the data rate of the bus, and a plurality of connector assemblies for interconnecting circuit boards with the busses. Each connector assembly comprises an array of connectors arranged in rows and columns. The connectors are coupled to the busses according to a predetermined pattern dependent on the data rate of the bus, whereby the number of connector assemblies coupled to the first, second and third busses can be increased.

Claims

1. In a modem system comprising a plurality of modems for modulating and demodulating data, transmitting said data via at least one telephone line and via at least one network, improved backplane apparatus for transmitting signals to and from said modems comprising in combination:

first bus means for management signal communication with said modems at a predetermined first data rate;

second bus means for transmitting data between said telephone line and said modems at a predetermined second data rate greater than said first data rate;

third bus means for transmitting data between said modems and said network at a predetermined third data rate greater than said second data rate;

fourth bus means for distributing DC power and ground potential;

first impedance means for terminating said first bus means;

second impedance means for terminating said second bus means;

third impedance means for terminating said third bus means;

means for spacing said first bus means, said second bus means, said third bus means and said fourth bus means in layers in said backplane dependent on the data rate of said bus means;

a plurality of connector means for interconnecting circuit boards with said first bus means, said second bus means, said third bus means and said fourth bus means, each said connector means comprising an array of connectors arranged in rows and columns;

means for coupling said connectors to said first bus means, said second bus means, said third bus means and said fourth bus means according to a predetermined pattern dependent on the data rate of said bus means, whereby the number of connector means coupled to said first, second and third bus means can be increased.

2. Apparatus, as claimed in claim 1, wherein one of said columns of said connectors excludes connections to one of said first, second and third bus means, whereby a connector of a circuit board requiring no connection to said one bus means can omit a column of connectors corresponding to said one column.

3. Apparatus, as claimed in claim 1, wherein said second bus means is segmented, whereby the bandwidth of said second bus means is increased.

4. Apparatus, as claimed in claim 1, and further comprising fifth bus means capable of transmitting data at a predetermined fourth data rate greater than said second data rate.

5. Apparatus, as claimed in claim 4, wherein said fifth bus means is segmented, whereby the bandwidth of said fifth bus means is increased.

6. Apparatus, as claimed in claim 1, wherein said first impedance means comprises pairs of resistors, one resistor in each pair having a value between 300 and 400 ohms and the other resistor in each pair having a value between 400 and 500 ohms.

7. Apparatus, as claimed in claim 6, wherein said second impedance means comprises pairs of resistors, one resistor in each pair having a value between 200 and 300 ohms and the other resistor is each pair having a value between 400 and 500 ohms.

8. Apparatus, as claimed in claim 7, wherein said third impedance means comprises a first set of pairs of resistors, each resistor in said pairs of said first set having a value between 200 and 300 ohms, said third impedance means also comprising a second set of pairs of resistors, one resistor in each pair of said second set having a value between 200 and 300 ohms and the other resistor in each pair of said second set having a value between 300 and 400 ohms.

9. Apparatus, as claimed in claim 1, wherein said means for spacing comprises:

first layer means for carrying external components and signal traces of said backplane;

second layer means for carrying at least a portion of said fourth bus means;

third layer means for carrying a first portion of said first bus means;

fourth layer means for carrying at least a portion of said fourth bus means;

fifth layer means for carrying a first portion of said third bus means;

sixth layer means for carrying at least a portion of said fourth bus means;

seventh layer means for carrying a second portion of said third bus means;

eighth layer means for carrying at least a portion of said fourth bus means;

ninth layer means for carrying said second bus means;

tenth layer means for carrying at least a portion of said fourth bus means;

eleventh layer means for carrying a second portion of said first bus means; and

twelfth layer means for enabling solder connections.

10. Apparatus, as claimed in claim 9, wherein said means for spacing comprises:

a first insulating dielectric layer located between said first and second layer means;

a second insulating dielectric layer located between said second and third layer means;

a third insulating dielectric layer located between said third and fourth layer means;

a fourth insulating dielectric layer located between said fourth and fifth layer means;

a fifth insulating dielectric layer located between said fifth and sixth layer means;

a sixth insulating dielectric layer located between said sixth and seventh layer means;

a seventh insulating dielectric layer located between said seventh and eighth layer means;

an eighth insulating dielectric layer located between said eighth and ninth layer means;

a ninth insulating dielectric layer located between said ninth and tenth layer means;

a tenth insulating dielectric layer located between said tenth and eleventh layer means; and

an eleventh insulating dielectric layer located between said eleventh and twelfth layer means.

11. Apparatus, as claimed in claim 10, wherein said third, fourth, fifth, sixth, seventh and eighth insulating dielectric layers each comprise a dielectric layer between 0.025 and 0.027 inch thick, wherein said ninth insulating dielectric layer comprises a dielectric layer between 0.016 and 0.018 inch thick, and wherein said first, second, tenth and eleventh insulating dielectric layers each comprise a dielectric layer between 0.005 and 0.007 inch thick.

12. Apparatus, as claimed in claim 4, wherein said array of connectors comprises a first column, a second column, a third column and a fourth column and wherein said first column comprises connectors coupled to said third bus means and said fourth bus means and excludes connectors coupled to said first, second and fifth bus means.

13. Apparatus, as claimed in claim 12, wherein said second column comprises connectors coupled to said second, third, fourth and fifth bus means and excludes connectors coupled to said first bus means.

14. Apparatus, as claimed in claim 13, wherein said third column comprises connectors coupled to said first, third and fifth bus means and excludes connectors coupled to said second and fourth bus means.

15. Apparatus, as claimed in claim 14, wherein said fourth column comprises connectors coupled to said fourth and fifth bus means and excludes connectors coupled to said first, second and third bus means.