Integrated microvalve structures with monolithic microflow controller

• US 5,417,235 A
• Filed: 07/28/1993
• Issued: 05/23/1995
• Est. Priority Date: 07/28/1993
• Status: Expired due to Fees

• Current Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Ji, Jin, Robertson, Janet K., Wise, Kensall D.
• Primary Examiner(s): Michalsky, Gerald A.
• Application Number:
  US08/098,738
• Time in Patent Office: 664 Days
• Field of Search: 251/129.01, 251/368, 251/129.06, 251/129.17, 251/11, 251/331, 156/644, 137/1
• US Class Current: 137/1
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/008 Multi-layer fabrications
• CPC Class Codes: F16K 2099/0082 Microvalves adapted for a particular use
• CPC Class Codes: F16K 2099/0086 Medical applications
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0007 of cantilever type
• CPC Class Codes: F16K 99/0051 using electrostatic means
• CPC Class Codes: Y10T 137/0318 Processes

Abstract

Micromachined microvalves are held both open and closed electrostatically to maintain uniform gas microflow and improve closure characteristics. A microflow controller containing such a valve is combined with a predetermined restricted flow path. Multiple valve/restrictive flow path combinations are integrated on a binary flow path basis. Single and/or multiple valve actuation provides precise but variable flow control. Temperature and pressure sensors can be integrally included. Various valve and controller configurations, and methods of controlling them and forming them, are disclosed.

Claims

1. A micromachined valve apparatus comprising:

a valve unit substrate;

a micromachined electrically conductive housing having a coefficient of expansion at least generally matching that of said substrate;

one of said substrate and said housing having a recess therein;

a bond between facing surfaces of said housing and said substrate that encircles said recess and forms a substantially closed chamber between said substrate and said housing;

an opening in one of said housing and said substrate providing access to said chamber;

a micromachined electrically conductive beam element disposed wholly within said chamber, said beam element having a fixed portion and a suspended portion;

said fixed portion secured to one of said substrate and said housing within said chamber and said suspended portion movable into a position in said chamber such that the suspended portion can contact and substantially close said opening in said chamber; and

electrostatic means for moving said suspended beam portion with respect to said opening, effective to change closure disposition of said suspended portion with respect to said opening.

2. The micromachined valve apparatus of claim 1 wherein the bond between said facing surfaces of the housing and said substrate is continuous, and the electrostatic means includes first electrostatic means for moving said suspended beam portion towards said opening for restricting flow therethrough, and second electrostatic means for moving said suspended beam portion away from said opening for unrestricting flow therethrough.

3. A micromachined valve system comprising:

a valve unit substrate having at least an insulating and flat surface portion and a selected metallization pattern thereon;

a micromachined electrically conductive housing having a recess portion, said recess portion of said housing having a periphery hermetically bonded to said flat and insulating surface portion, forming a substantially closed chamber with said substrate over a portion of said metallization pattern;

first and second openings to said chamber for gas flow through said chamber, one said openings including an orifice on a wall of said chamber;

a micromachined electrically conductive beam supported within said housing, wherein said beam is supported at one end by a relatively thick bonded portion of said second member and is free to move at the other end, wherein movement of said free end in one direction substantially closes said recess orifice, and movement of said free end in an opposite direction substantially opens said orifice, for controlling gas flow through said housing;

means for maintaining said suspended beam electrically insulated from said orifice and said housing, even when said suspended beam portion is moved into gas flow inhibiting disposition at said orifice;

means for applying a first electrical potential between said housing and said suspended beam, effective to electrostatically move said suspended beam portion into gas flow inhibiting disposition at said orifice; and

means for discontinuing said electrical potential between said housing and said suspended beam, and for applying a second electrical potential between said beam and an electrode disposed within said chamber adjacent said suspended beam but opposite from said orifice;

means for maintaining said beam electrically insulated from said electrode; and

means for maintaining said second electrical potential between said beam and said electrode, so long as gas flow is desired through said orifice.

4. The micromachined valve assembly as described in claim 3 wherein said chamber orifice is a periphery of a chamber opening, and said suspended other end of said beam has a substantially rigid integral projection thereon for closure cooperation with said recess orifice, which projection requires other parts of the suspended other end to bend before making contact with chamber portions surrounding the recess orifice.

5. The micromachined valve assembly as described in claim 4 wherein said projection has a substantially flat surface for closing said recess orifice.

6. The micromachined valve assembly as described in claim 4 wherein said projection has a substantially hemispherical surface for closing said recess orifice.

7. A micromachined valve assembly having an electrostatically movable portion of a suspended beam as a gate element for closing an aperture to a housing, comprising:

a substrate having a substantially flat and insulating surface portion;

a relatively thick electrically conductive first member of monocrystalline semiconductor material, said member having a recess therein and an aperture in said recess;

a substantially flat periphery on said recess bonded to said substrate surface portion, whereby said recess forms a substantially closed chamber with said substrate;

a second member of electrically conductive monocrystalline semiconductor material disposed wholly within said chamber, said second member having at least one relatively thick support portion bonded to said substrate surface portion within said chamber and also having a suspended beam portion that is integral with said support portion and provides a closure member for said recess aperture;

electrodes on said substrate surface portion for oppositely electrically charging said first semiconductor member and said second member, effective to pull said beam closure member into closing engagement with said recess aperture.

8. The micromachined valve assembly as described in claim 7 wherein both ends of said suspended beam portion are integral to one or more of said support portions of said second member, and a central part of said suspended beam portion is movable into closure position with said recess aperture.

9. The micromachined valve assembly as described in claim 8 wherein said substrate is an electrically nonconductive glass plate, said glass plate has at least one additional electrode thereon, and said additional electrode is disposed under said suspended beam portion for pulling said suspended beam portion away from said recess aperture when a voltage is applied between said additional electrode and said suspended beam portion.

10. The micromachined valve assembly as described in claim 8 wherein said semiconductor material is silicon, said substrate is an electrically nonconductive glass plate, said glass plate has a thermal expansion coefficient generally matching that of monocrystalline silicon and has at least one additional electrode thereon, and said additional electrode has a beam actuation portion that is disposed between said suspended beam portion and said glass plate in position opposite from said recess aperture, effective to permit a voltage to be applied between said electrode and said second member that pulls said suspended beam portion away from said recess aperture.

11. The micromachined valve assembly as described in claim 8 wherein said suspended beam portion has a length that is generally parallel said flat substrate surface portion, the length has a center, and at least parts of said suspended beam portion are non-linear in a plane parallel to said flat substrate surface.

12. The micromachined valve assembly as described in claim 11 wherein said nonlinear parts have an undulated configuration in a plane parallel to said substrate surface portion.

13. The micromachined valve assembly as described in claim 11 wherein said nonlinear parts are non-linear in a plane parallel to said substrate surface portion and are symmetrical with respect to the center of said suspended beam portion length.

14. The micromachined valve assembly as described in claim 11 wherein the nonlinear parts form an interdigitated spiral.

15. The micromachined valve assembly as described in claim 8 wherein both of said first and second semiconductor members are primarily formed of silicon.

16. The micromachined valve assembly as described in claim 8 wherein both of said first and second semiconductor members are of silicon, and said relatively thick bonded support portion of said second member is generally C-shaped in the plane of the substrate.

17. The micromachined valve assembly as described in claim 8 wherein an additional electrode is disposed on said substrate insulating surface portion, said additional electrode being located under said suspended beam portion area and opposite from said recess aperture, said additional electrode has an extension on said substrate insulating surface portion leading away from said suspended beam portion area, the extension has a part that passes between facing end portions of said bonded thick support portion of said second member into an area of said chamber beside said second member, and the extension also has a part that passes outside said chamber through a channel between facing bonded portions of said substrate and said first member, whereby the extension provides means for external electrical connection to said additional electrode, and said channel is externally blocked to close said channel.

18. A method of controlling a micromachined valve comprising the steps of:

providing a micromachined suspended silicon beam on a glass plate within an electrically conductive silicon hollow housing electrostatically sealed to the glass plate, said plate having two electrodes thereon for applying a voltage between said beam and said housing that moves a portion of the beam into disposition that closes an aperture in said housing;

providing a third electrode within said housing, adjacent a surface of said suspended beam opposite from said aperture;

applying a voltage between said two electrodes to produce an electrostatic attraction between said housing and said beam that moves said beam portion into disposition that closes said aperture in said housing;

discontinuing application of said voltage between said two electrodes and applying a voltage between said third electrode and one of said two electrodes, effective to apply a voltage between said beam and said third electrode in a predetermined manner that moves said beam portion away from said aperture in a predetermined manner; and

maintaining application of said last mentioned voltage substantially continuously, so long as gas flow through said aperture is desired.

19. A microflow controller comprising:

a microflow controller substrate;

a micromachined electrically conductive housing;

one of said housing and said substrate having a recess therein, said recess having a micromachined valve portion and an integrally connected restricted gas flow portion;

a bond between said substrate and said housing that closes said recess and forms a substantially closed chamber between said substrate and said housing, which chamber includes a valve portion and an integrally connected restricted gas flow portion;

a first opening in one of said substrate and said housing providing direct access to said valve portion of said chamber;

a second opening in one of said housing and said substrate providing direct access to said restricted gas flow portion of said chamber at a part thereof removed from said valve portion;

a micromachined electrically conductive beam supported within said housing, said beam having a suspended portion movable into disposition that substantially closes said first opening;

first electrostatic means for pulling said movable suspended beam portion to said opening, effective to block said opening; and

second electrostatic means for pulling said movable beam portion away from said opening housing, effective to maintain the opening unblocked.

20. The microflow controller as described in claim 19 in which said chamber also includes an integrated pressure sensing unit.

21. The microflow controller as described in claim 20 in which said chamber also includes an integrated temperature sensing unit, effective to provide a mass gas flow meter.

22. The microflow controller as described in claim 20 in which said microflow controller cooperates with associated control circuitry to comprise a mass gas flow meter.

23. A micromachined valve apparatus comprising:

a valve unit substrate;

a micromachined electrically conductive housing;

one of said substrate and housing having a recess therein;

a bond between said housing and said substrate that closes said recess and forms a substantially closed chamber between said substrate and said housing;

an opening in one of said housing and said substrate providing access to said chamber;

a micromachined electrically conductive beam supported within said housing, said beam having a suspended portion movable into disposition that contacts and substantially closes said opening;

a boss on the suspended portion of the beam that preferentially makes contact with the housing surrounding the opening in the housing recess, and spaces the balance of the suspended portion of the beam from contact with the housing unless extended flexing of the beam occurs; and

electrostatic means for attracting said movable beam portion to said opening, effective to substantially block said opening.

24. A micromachined valve apparatus comprising:

a valve unit substrate having a substantially flat and insulating surface portion having a metallization pattern thereon for cooperation with micromachined valve components;

a micromachined electrically conductive housing having a recess therein and a substantially planar edge surrounding said recess;

a continuous bond between said housing planar edge and said substrate portion that closes said recess and forms a substantially closed chamber between said housing and said substrate;

an aperture in one of said substrate and said housing providing access to said chamber;

a micromachined suspended electrically conductive beam supported within said housing, said suspended beam having a beam portion movable into a position where said beam portion contacts and substantially closes said aperture;

said beam portion including a projection arranged for interaction with said aperture and which spaces the balance of said movable portion of said suspended beam from contact with the member having the aperture except for extreme flexure of the beam; and

electrostatic means for moving said projection on said suspended beam portion to said aperture, effective to substantially close said aperture.

25. In a micromachined valve having an aperture member and a suspended beam that forms a movable aperture closure member, which movable aperture closure member is electrostatically actuated to or from said aperture member, the improvement which comprises projections on at least one of said suspended beam and a second surface the beam contacts when the beam is electrostatically actuated.

26. The micromachined valve of claim 25 in which the projections are of a patterned coating of a material selected from the group consisting of metal and dielectric.

27. In a micromachined valve having an aperture member, a substrate member, and a suspended beam that includes a movable portion for closure of an aperture in said aperture member, which movable aperture closure portion is electrostatically actuated to and away from said aperture member, the improvement which comprises projections on said aperture member to reduce the area of contact between contacting parts of said movable beam portion and said aperture member;

and projections on at least one of said movable beam portion and said substrate member to reduce the area of contact between contacting parts of said movable beam portion and said substrate member;

said projections being respectively effective when said movable beam portion is electrostatically actuated to or away from said aperture.

28. The micromachined valve of claim 27 in which the projections are of a patterned coating of a material selected from the group consisting of metal and dielectric, the coating is disposed on the aperture member surface facing the beam, the coating is also disposed on the beam surface facing the substrate, and no such coating is present on the beam surface facing the aperture or the substrate surface under the movable beam portion.

29. A micromachined valve apparatus comprising:

a valve unit substrate of an electrically nonconductive glass plate, said glass plate having a thermal expansion coefficient generally matching that of single-crystal silicon;

a micromachined electrically conductive housing of single crystal silicon;

one of said substrate and said housing having a recess therein;

a bond between facing surfaces of said housing and said substrate that encircles said recess and forms a substantially closed chamber between said substrate and said housing;

an opening in one of said housing and said substrate providing access to said chamber;

a micromachined electrically conductive beam supported on one of said substrate and said housing within said chamber, said beam having a movable suspended portion for contacting and substantially closing said opening;

first electrostatic means for moving said movable beam portion towards said opening, effective to substantially block said opening; and

second electrostatic means for moving said movable beam portion away from said opening, effective to unblock said opening; and

one of said electrostatic means includes an electrode on said glass substrate that has a beam actuation portion that is disposed between said suspended beam portion and said glass plate in line with said recess opening, effective to permit a voltage to be applied between said electrode and said second member that moves said suspended beam portion away from said recess opening.