Cathode targets of silicon and transition metal

• US 5,417,827 A
• Filed: 03/31/1993
• Issued: 05/23/1995
• Est. Priority Date: 11/29/1991
• Status: Expired due to Term

• Current Assignee: Vitro Flat Glass LLC (Compagnie De Saint-Gobain)
• Original Assignee: PPG Industries Incorporated (Nouryon BV)
• Inventors: Finley, James J.
• Primary Examiner(s): Breneman, R. Bruce
• Assistant Examiner(s): MCDONALD, RODNEY GLENN
• Application Number:
  US08/041,015
• Time in Patent Office: 783 Days
• Field of Search: 204/192.15, 204/192.22, 204/192.23, 204/192.26, 204/192.27, 204/192.28, 204/298.13
• US Class Current: 204/192.28
• CPC Class Codes: C03C 17/225 Nitrides
• CPC Class Codes: C03C 17/245 by deposition from the vapour phase
• CPC Class Codes: C03C 17/3435 comprising a nitride, oxynitride, boronitride or carbonitride
• CPC Class Codes: C03C 17/3441 comprising carbon, a carbide or oxycarbide
• CPC Class Codes: C03C 17/36 at least one coating being a metal
• CPC Class Codes: C03C 17/3605 Coatings of the type glass/metal/inorganic compound
• CPC Class Codes: C03C 17/3607 Coatings of the type glass/inorganic compound/metal
• CPC Class Codes: C03C 17/3615 Coatings of the type glass/metal/other inorganic layers, at least one layer being non-metallic
• CPC Class Codes: C03C 17/3618 Coatings of type glass/inorganic compound/other inorganic layers, at least one layer being metallic
• CPC Class Codes: C03C 17/3626 one layer at least containing a nitride, oxynitride, boronitride or carbonitride
• CPC Class Codes: C03C 17/3642 the multilayer coating containing a metal layer
• CPC Class Codes: C03C 17/3652 the coating stack containing at least one sacrificial layer to protect the metal from oxidation
• CPC Class Codes: C03C 17/3689 one oxide layer being obtained by oxidation of a metallic layer
• CPC Class Codes: C03C 17/40 all coatings being metal coatings
• CPC Class Codes: C03C 2217/23 Mixtures
• CPC Class Codes: C03C 2217/27 Mixtures of metals, alloys
• CPC Class Codes: C03C 2217/281 Nitrides
• CPC Class Codes: C23C 14/0641 Nitrides C23C14/0617 takes precedence
• CPC Class Codes: C23C 14/0676 Oxynitrides
• CPC Class Codes: C23C 14/08 Oxides C23C14/10 takes precedence
• CPC Class Codes: C23C 14/185 : by cathodic sputtering

Abstract

Silicon-nickel cathode targets comprising 3 to 18 weight percent nickel are disclosed for sputtering low absorbance coatings of silicon-nickel alloy in atmospheres comprising reactive gases such as nitrogen, oxygen and mixtures thereof which may further comprise inert gas such as argon to form nitrides, oxides, and oxynitrides as well as metallic films. The presence of nickel in the cathode target in the range of 3 to 18 weight percent provides target stability and enhanced sputtering rates over targets of silicon alone or alloyed with aluminum, while maintaining a low coating refractive index and low absorbance, not only when sputtering in oxygen to produce an oxide coating, but also when sputtering in nitrogen or a mixture of nitrogen and oxygen to produce coatings of silicon-nickel nitride or oxynitride respectively.

Claims

1. A cathode target comprising:

a. silicon; and

b. 3 to 18 weight percent nickel based on the total weight of silicon and nickel.

2. A method for depositing coatings comprising silicon and nickel comprising the steps of:

a. maintaining a nonmetallic substrate in an evacuated chamber;

b. maintaining an atmosphere comprising a gas selected from the group consisting of nitrogen, oxygen, inert gases, and mixtures thereof; and

c. sputtering a cathode target comprising silicon and 3 to 18 weight percent nickel based on the total weight of silicon and nickel to deposit a coating on a surface of the substrate.

3. A method according to claim 2, wherein the substrate is glass.

4. A method according to claim 3, wherein the atmosphere consists essentially of inert gas, and the coating consists essentially of silicon and 3 to 18 weight percent nickel based on the total weight of silicon and nickel.

5. A cathode target comprising:

a. at least 82 weight percent silicon; and

b. from 3 to 18 weight percent nickel.

6. A cathode target according to claim 5, wherein the weight percent nickel is from 5 to 16 percent.

7. A cathode target according to claim 6, wherein the weight percent nickel is from 7 to 15 percent.

8. A method for depositing coatings comprising silicon and nickel comprising the steps of:

a. maintaining a nonmetallic substrate in an evacuated chamber;

b. maintaining an atmosphere comprising a gas selected from the group consisting of nitrogen, oxygen, inert gases, and mixtures thereof; and

c. sputtering a cathode target comprising at least 82 weight percent silicon and from 3 to 18 weight percent nickel based on the total weight of silicon and nickel to deposit a coating on a surface of the substrate.

9. A method according to claim 8, wherein the coating consists of 5 to 16 weight percent nickel.

10. A method according to claim 9, wherein the coating consists of 7 to 15 weight percent nickel.

11. A method according to claim 8, wherein the atmosphere comprises nitrogen, and the coating comprises silicon-nickel nitride.

12. A method according to claim 8, wherein the atmosphere comprises nitrogen and oxygen, and the coating comprises silicon-nickel oxynitride.