Method and apparatus for recovering power from semiconductor circuit using thermoelectric device

• US 5,419,780 A
• Filed: 04/29/1994
• Issued: 05/30/1995
• Est. Priority Date: 04/29/1994
• Status: Expired due to Term

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: AST Research, Inc. (Samsung Electronics Co. Ltd.)
• Inventors: Suski, Edward D.
• Primary Examiner(s): Walsh, Donald P.
• Assistant Examiner(s): CARROLL, CHRISMAN DION
• Application Number:
  US08/235,679
• Time in Patent Office: 396 Days
• Field of Search: 136/201, 136/203, 136/204, 136/205, 136/207, 136/211, 136/212, 136/224, 136/225, 136/242, 62/3.2, 62/3.3, 62/3.7
• US Class Current: 136/205
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction

Abstract

An apparatus and method for recovering power dissipated by a semiconductor integrated circuit includes a thermoelectric generator which converts the heat generated by the integrated circuit into electrical energy. The electrical energy is used to drive a fan or other airflow generating device to cause heated air to be moved away from the integrated circuit and cooler air to be drawn to the integrated circuit to absorb further heat from the integrated circuit. In the described embodiment, the thermoelectric generator is a Peltier cooler positioned between the integrated circuit and a heatsink. The Peltier cooler is operated in the Seebeck mode to generate power in response to the temperature differential between the integrated circuit and the heatsink. The fan is positioned proximate to the heatsink to cause air flow over the heatsink thereby reducing the temperature of the heatsink and thus reducing the temperature of the integrated circuit by causing more heat to be transferred from the integrated circuit to the heatsink.

Claims

1. An apparatus that removes heat from a semiconductor device, comprising:

a thermoelectric generator that converts heat energy to electrical energy, said thermoelectric generator positioned on said semiconductor device to receive heat generated by said semiconductor device, said thermoelectric generator producing an output voltage in response to said heat; and

an airflow generating device electrically connected to receive said output voltage from said thermoelectric generator and responsive to said output voltage to cause air to flow, said airflow generating device positioned proximate to said semiconductor device so that air caused to flow by said airflow generating device removes heat from said semiconductor device to thereby reduce the temperature of said semiconductor device.

2. The apparatus as defined in claim 1, wherein said airflow generating device is a fan.

3. The apparatus as defined in claim 1, further including a heatsink that increases the rate at which heat is conducted away from said semiconductor device, said thermoelectric generator positioned between said heatsink and said semiconductor device, said airflow generating device positioned to cause air to flow over said heatsink.

4. The apparatus as defined in claim 1, wherein said thermoelectric generator comprises a Peltier cooler operating in the Seebeck mode wherein the power generated by the thermoelectric generator is responsive to the temperature difference across the thermoelectric generator.

5. A method for cooling a semiconductor device comprising the steps of:

positioning a thermoelectric generator proximate to the semiconductor device;

generating electrical power by said thermoelectric generator in response to heat generated by said semiconductor device;

connecting said electrical power generated by said thermoelectric generator to an airflow generating device; and

generating an airflow to remove heat from said semiconductor device in response to said electrical power generated by said thermoelectric generator.

6. The method as defined in claim 5, wherein said airflow generating device comprises a fan.

7. The method as defined in claim 5, wherein said thermoelectric generator comprises a Peltier cooler operating in the Seebeck mode to generate electrical power from a temperature differential across the thermoelectric generator.

8. The method as defined in claim 5, further including the step of positioning the thermoelectric generator between said semiconductor device and a heatsink.

9. A method for utilizing the heat energy generated by a semiconductor circuit in an electronic system, comprising the steps of:

positioning a thermoelectric generator proximate to the semiconductor circuit so that the heat generated by the semiconductor circuit is transferred to said thermoelectric generator;

generating electrical energy by said thermoelectric generator responsive to said heat transferred from said semiconductor circuit;

transferring said electrical energy to an electrically operated device; and

operating said electrically operated device in response to said electrical energy.

10. The method as defined in claim 9, wherein said electrically operated device comprises a cooling device that reduces the temperature of said semiconductor circuit.

11. The method as defined in claim 10, wherein said cooling device comprises a airflow generating device.

12. The method as defined in claim 11, wherein said airflow generating device comprises a fan.

13. The method as defined in claim 9, wherein said thermoelectric generator comprises a Peltier module operating in the Seebeck mode.

14. The method as defined in claim 9, further comprising the step of positioning a heatsink proximate to said thermoelectric generator so that heat transferred from said semiconductor circuit to said thermoelectric generator is further transferred through said thermoelectric generator to said heatsink, said heatsink thereby increasing the flow of heat to said thermoelectric generator from said semiconductor circuit.

15. The method as defined in claim 14, wherein said electrically operated device comprises a fan positioned proximate to said heatsink, and wherein said step of further comprising a electrically powered airflow generating device, said airflow generating device operating in response to said electrical energy transferred from said thermoelectric generator to cause air to flow proximate to said heatsink, said air dissipating heat transferred to said heatsink.