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Method of planarizing microstructures

  • US 5,419,803 A
  • Filed: 11/17/1993
  • Issued: 05/30/1995
  • Est. Priority Date: 11/17/1993
  • Status: Expired due to Term
First Claim
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1. A method of planarizing a microstructure having a plurality of features extending from a surface thereof, said method comprising the steps of:

  • providing a layer of material over said microstructure such that an overcoating surface is formed;

    measuring the thickness of said layer across the surface thereof;

    forming a dwell time versus position map for said surface; and

    removing material from said layer of material by use of a plasma assisted chemical etching tool, said material removal being in accordance with said dwell time versus position map.

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