Ammonia-free deposition of copper by disproportionation

• US 5,419,926 A
• Filed: 11/22/1993
• Issued: 05/30/1995
• Est. Priority Date: 11/22/1993
• Status: Expired due to Term

• Current Assignee: Lilly Industries Limited
• Original Assignee: Lilly London, Inc.
• Inventors: Soltys, Joseph
• Primary Examiner(s): PIANALTO, BERNARD D
• Application Number:
  US08/153,548
• Time in Patent Office: 554 Days
• Field of Search: 427/305, 427/443.1, 106/1.18, 106/1.23
• US Class Current: 427/305
• CPC Class Codes: C23C 18/38 Coating with copper
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387

Abstract

An ammonia-free reducer is added to cupric ions to achieve reduction to cuprous hydroxide in a process for the deposition of metallic copper on a catalytically activated surface by rapidly reducing cupric ions in aqueous solution to cuprous hydroxide, without substantial reduction to elemental or metallic copper, and thereafter effecting controlled disproportionation of the resultant cuprous hydroxide to bring about the deposition of metallic copper. The ammonia-free reducer is preferably hydroxylamine or its salts in the presence of a water soluble alkali metal- or alkaline earth metal- hydroxide, more preferably sodium hydroxide. The process of reduction of cupric ions is further effected by adding to the solution an antiagglomerating agent for controlling the dispersion of the cuprous hydroxide, preferably a polyol such as sorbose or invert sugar. The process of disproportionation of the cuprous hydroxide is further effected by adding an activator comprising a hydroxycarboxylic acid or salt thereof, preferably citric acid or malic acid with sulfuric acid, to bring about the deposition of metallic copper principally on the catalytically activated surface, wherein the hydroxycarboxylic acid or salt activator is present in solution in an amount no greater than about one mole per mole of cuprous hydroxide.

Claims

1. A process for the deposition of metallic copper on a catalytically activated surface comprising providing cupric ions in aqueous solution, adding to said cupric ions an ammonia-free reducer to rapidly reduce said cupric ions to cuprous hydroxide, and thereafter effecting disproportionation of the resultant cuprous hydroxide to bring about the deposition of metallic copper principally on said surface.

2. The process of claim 1 wherein said ammonia-free reducer comprises hydroxylamine or its salts.

3. The process of claim 1 wherein said ammonia-free reducer comprises hydroxylamine or its salts, and further including adding a water soluble alkali metal- or alkaline earth metal- hydroxide to reduce said cupric ions to cuprous hydroxide.

4. The process of claim 1 wherein said reduction of cupric ions is further effected by adding to said solution an antiagglomerating agent for controlling the dispersion of said cuprous hydroxide.

5. The process of claim 4 wherein said antiagglomerating agent is a polyol.

6. The process of claim 4 wherein said antiagglomerating agent is selected from the group consisting of dextrose, fructose, glucono-delta-lactone, sodium glucoheptonate, L-sorbose, invert sugar, sucrose, D-galactono-gamma-lactone, 2-keto-D-gluconic acid, glycine, D-mannose, and D-galactose.

7. The process of claim 4 wherein said antiagglomerating agent is sorbose.

8. The process of claim 4 wherein said antiagglomerating agent is invert sugar.

9. The process of claim 1 wherein said disproportionation of said cuprous hydroxide is effected by adding an activator comprising a hydroxycarboxylic acid or salt thereof to bring about the deposition of metallic copper principally on said catalytically activated surface, the improvement wherein said hydroxycarboxylic acid or salt activator is present in solution in an amount less than about one mole per mole of cuprous hydroxide.

10. The process of claim 1 wherein said disproportionation of said cuprous hydroxide is effected by adding an activator comprising a hydroxycarboxylic acid or salt thereof to bring about the deposition of metallic copper principally on said catalytically activated surface, the improvement wherein a rate modifier selected from the group consisting of Surfine, Rochelle salt (potassium-sodium tartrate), glycine, and is added to said hydroxycarboxylic acid or salt activator.

11. A process for the deposition of metallic copper on a catalytically activated surface by providing cupric ions in aqueous solution, adding a substantially ammonia-free reducer to rapidly reduce said cupric ions in aqueous solution substantially completely to cuprous hydroxide, and thereafter effecting disproportionation of the resultant cuprous hydroxide by adding an activator comprising a hydroxycarboxylic acid or salt thereof, which activator brings about the deposition of metallic copper principally on said catalytically activated surface, said hydroxycarboxylic acid or salt activator being present in solution in an amount no greater than about one mole per mole of cuprous hydroxide.

12. The process of claim 11 wherein said substantially ammonia-free reducer comprises hydroxylamine or its salts, and further including adding a water soluble alkali metal- or alkaline earth metal- hydroxide to reduce said cupric ions to cuprous hydroxide.

13. The process of claim 12 wherein said hydroxycarboxylic acid or salt activator-modifier further contains a mineral acid.

14. The process of claim 13 wherein said hydroxycarboxylic acid or salt activator-modifier is citric acid.

15. The process of claim 13 wherein said hydroxycarboxylic acid or salt activator-modifier is malic acid.

16. The process of claim 13 wherein said hydroxycarboxylic acid or salt activator-modifier is tartaric acid.

17. The process of claim 11 wherein said reduction of cupric ions is further effected by adding to said solution an antiagglomerating agent for controlling the dispersion of said cuprous hydroxide.

18. The process of claim 17 wherein said antiagglomerating agent is a polyol.

19. The process of claim 17 wherein said antiagglomerating agent is selected from the group consisting of dextrose, fructose, glucono-delta-lactone, sodium glucoheptonate, L-sorbose, invert sugar, sucrose, D-galactono-gamma-lactone, 2-keto-D-gluconic acid, glycine, D-mannose, and D-galactose.

20. The process of claim 17 wherein said antiagglomerating agent is present in an amount insufficient to effect reduction of said cupric hydroxide.

21. The process of claim 11 wherein a rate modifier selected from the group consisting of Surfine, Rochelle salt (potassium-sodium tartrate), glycine, and triethylenetetramine, is added to said hydroxycarboxylic acid or salt activator.

22. A system for depositing copper on a substrate by disproportionation of cuprous ions comprising the combination of:

an aqueous solution containing cupric ions,

an aqueous, ammonia-free cupric reducer solution containing a nitrogenous compound in a minimum concentration of about 25 g/l for reducing the cupric ions to a cuprous state,

an aqueous alkali metal or alkaline earth metal solution for precipitating cuprous ions as a cuprous precipitate, and

an aqueous activator solution containing a hydroxycarboxylic acid or salt thereof, an amine, or a mineral acid in combination with a hydroxycarboxylic acid or salt or amine, for disproportionation of the cuprous precipitate and deposition of copper on a substrate.

23. The system of claim 22 wherein said ammonia-free reducer comprises hydroxylamine or its salts.

24. The system of claim 22 wherein said ammonia-free reducer comprises hydroxylamine or its salts, and further including adding a water soluble alkali metal- or alkaline earth metal- hydroxide to reduce said cupric ions to cuprous hydroxide.

25. The system of claim 22 wherein said cupric solution, reducer solution or alkaline metal or alkaline earth metal solution further contains an antiagglomerating agent for controlling the dispersion of said cuprous hydroxide.

26. The system of claim 25 wherein said antiagglomerating agent is a polyol.

27. The system of claim 25 wherein said antiagglomerating agent is selected from the group consisting of dextrose, fructose, glucono-delta-lactone, sodium glucoheptonate, L-sorbose, invert sugar, sucrose, D-galactono-gamma-lactone, 2-keto-D-gluconic acid, glycine, D-mannose, and D-galactose.

28. The system of claim 25 wherein said antiagglomerating agent is present in an amount insufficient to effect reduction of said cupric ions.

29. The system of claim 25 wherein said antiagllomerating agent is sorbose.

30. The system of claim 22 wherein said aqueous activator solution comprises a hydroxycarboxylic acid or salt thereof in an amount no greater than about one mole per mole of cuprous hydroxide.

31. The system of claim 22 wherein said aqueous activator solution contains a rate modifier selected from the group consisting of Surfine, Rochelle salt (potassium-sodium tartrate), glycine, and triethylenetetramine.

32. A system for depositing copper on a substrate by disproportionation of cuprous ions comprising the combination of:

an aqueous solution containing cupric ions,

a substantially ammonia-free cupric reducer solution containing a nitrogenous compound in a minimum concentration of about 25 g/l for reducing the cupric ions to a cuprous state,

an aqueous alkali metal or alkaline earth metal hydroxide solution for precipitating cuprous ions as cuprous hydroxide, and

an aqueous activator solution containing a hydroxycarboxylic acid or salt thereof, said hydroxycarboxylic acid or salt thereof being present in an amount no greater than about one mole per mole of cuprous hydroxide, for disproportionation of the cuprous hydroxide and deposition of copper on a substrate.

33. The system of claim 32 wherein said alkali metal- or alkaline earth metal-hydroxide comprises sodium hydroxide.

34. The system of claim 32 wherein said hydroxycarboxylic acid or salt activator further contains a mineral acid.

35. The system of claim 32 wherein said hydroxycarboxylic acid or salt activator-modifier is citric acid.

36. The system of claim 32 wherein said hydroxycarboxylic acid or salt activator-modifier is malic acid.

37. The system of claim 32 wherein said hydroxycarboxylic acid or salt activator-modifier is tartaric acid.

38. The system of claim 32 wherein said cuprous reducer solution further contains an antiagglomerating agent for controlling the dispersion of said cuprous hydroxide.

39. The system of claim 38 wherein said antiagglomerating agent is a polyol.

40. The system of claim 38 wherein said antiagglomerating agent is selected from the group consisting of dextrose, fructose, glucono-delta-lactone, sodium glucoheptonate, L-sorbose, invert sugar, sucrose, D-galactono-gamma-lactone, 2-keto-D-gluconic acid, glycine, D-mannose, and D-galactose.

41. The system of claim 38 wherein said antiagglomerating agent is present in an amount insufficient to effect reduction of said cupric ions.

42. The system of claim 32 wherein said aqueous activator solution contains a rate modifier selected from the group consisting of Surfine, Rochelle salt (potassium-sodium tartrate), glycine, and triethylenetetramine.

43. The system of claim 42 wherein said aqueous activator solution further contains an additive selected from the group consisting of antioxidants, acidic complexers, boric acid, and surface active agents.