Pacitive electrode system for detecting open solder joints in printed circuit assemblies

• US 5,420,500 A
• Filed: 11/25/1992
• Issued: 05/30/1995
• Est. Priority Date: 11/25/1992
• Status: Expired due to Term

• Current Assignee: Keysight Technologies, Inc.
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Kerschner, Ronald K.
• Primary Examiner(s): Wieder, Kenneth A.
• Assistant Examiner(s): Solis, Jose M.
• Application Number:
  US07/981,665
• Time in Patent Office: 916 Days
• Field of Search: 324/72.5, 324/457, 324/458, 324/158 R, 324/158 F, 324/519, 324/530, 324/688
• US Class Current: 324/72.5
• CPC Class Codes: G01R 31/2812 Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance of connections G01R31/66
• CPC Class Codes: G01R 31/312 by capacitive methods

Abstract

Disclosed is a system for testing continuity that determines whether input and output leads of semiconductor components are present and properly soldered to a printed circuit board. The system includes a signal source stimulus which is connected to a wiring trace on the printed circuit board, which is soldered to the lead being tested. A capacitive test probe is placed on top of the component. The stimulus signal is capacitively coupled through the lead of the integrated circuit package being tested to the capacitive test probe, so if a predetermined signal level is detected by the capacitance test probe, the lead is connected to the circuit assembly. As the capacitances involved are small, the capacitive test probe includes an amplifier, a shield or guard and a buffer circuit to reduce stray fields pick up effects.

Claims

1. A test probe for testing an electrical component to determine whether a connector lead of said electrical component is conductively connected to a trace of a printed circuit board, said test probe comprising:

a thin conductive plate for capacitively detecting an electrical field generated by said connector lead of said electrical component whenever said connector lead is conductively connected to said trace producing a test signal, whereby said conductive plate is substantially planar enough such that said conductive plate can be used to test varying shapes and sizes of electrical components;

a substantially planar thin guard plate disposed in close physical proximity with and substantially parallel to said substantially planar conductive plate for providing shielding from electrical noise;

signal amplification means electrically coupled to and in close physical proximity with said substantially planar conductive plate for amplifying said test signal to increase the signal to noise ratio of said test signal to said electrical noise, said signal amplification means and said shielding means being disposed in sufficient proximity to said substantially planar conductive plate means to generate a test signal that has a sufficient signal to noise ratio to determine whether said connector lead is conductively connected to said trace; and

a thin dielectric material disposed between said substantially planar thin conductive plate and said substantially planar guard plate, creating a sandwich probe structure comprising said substantially planar thin conductive plate, said thin dielectric material and said substantially planar thin guard plate respectively, said sandwich structure being substantially planar and thin such as to enable a user to cut said sandwich probe structure to a desired size and shape.

2. The test probe of claim 1 wherein said substantially planar thin conductive plate comprises a metal plate.

3. The test probe of claim 2 wherein said metal plate comprises copper.

4. The test probe of claim 3 wherein said substantially planar thin guard plate comprises a substantially planar thin copper plate.

5. The test probe of claim 1 wherein said substantially planar thin guard plate is disposed approximately 0.04 inches above said substantially planar conductive plate.

6. The test probe of claim 1 wherein said signal amplification means comprises a buffer circuit disposed on top of said dielectric material, said dielectric material being disposed on top of said substantially planar thin conductive plate and below said substantially planar thin guard plate.

7. The test probe of claim 6 wherein said substantially planar thin guard plate has an aperture in which said signal amplification means is disposed on top of said dielectric material such that said substantially planar thin guard plate substantially surrounds said amplification means.

8. The test probe of claim 1 wherein said substantially planar thin conductive plate comprises a physically deformable conductive material, such that said conductive plate conforms to the surface of said electrical component under test when said test probe is brought into close proximity with said electrical component under test.

9. The test probe of claim 1 wherein said substantially planar thin conductive plate and said substantially planar thin guard plate are substantially the same size and shape as a top surface of said electrical component, said electrical component comprising an integrated circuit disposed inside a package, such that when said test probe is brought into close proximity with a top surface of said integrated circuit, said conductive plate of said test probe is dielectrically separated from said integrated circuit via said package of said integrated circuit.

10. The test probe of claim 1 wherein said electrical component comprises an integrated circuit having a package and a plurality of conductive plates connecting said integrated circuit within said package to a plurality of connector leads outside of said package, wherein said substantially planar thin conductive plate and said substantially planar thin guard plate of said test probe are substantially the same size and shape as a top surface of a conductive plate of said electrical component such that when said test probe is brought into close proximity with one of said conductive plates of said integrated circuit, said substantially planar thin conductive plate of said test probe is dielectrically separated from said conductive plate of said integrated circuit via said package of said integrated circuit.

11. The test probe of claim 1 wherein said dielectric material comprises glass filled plastic.