Parallel optical interconnect
First Claim
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1. An optoelectronic interconnect comprising:
- a multiple optical fiber connector comprising;
a holder having at least one planar surface,a plurality of optical fibers attached to the holder, each fiber having a first end abutting the first surface so as to expose the first end for receiving or transmitting optical radiation, said first ends of said fibers forming a fiber array having a first pattern, andguiding means disposed in said holder at predetermined positions with respect to said fiber array; and
an optoelectronic board comprising;
a substrate having a first surface and first aligning means,an optoelectronic device array monolithically formed on a first surface of a semiconductor chip, said optoelectronic device array having substantially the same pattern as the first pattern of said fiber array, said chip being disposed on the substrate,second aligning means for aligning said array of optoelectronic devices to said first aligning means,said first aligning means being disposed at substantially the same predetermined positions with respect to said array of optoelectronic devices as the positions of the guiding means relative to said fiber array, andsaid first aligning means receiving said guiding means so as to mechanically align said optoelectronic device array with said fiber array, whereby each optoelectronic device is aligned to an optical fiber, said optoelectronic device array emitting optical radiation into said optical fiber array or receiving optical radiation from said fiber array.
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Abstract
An optical interconnect is disclosed that couples multiple optical fibers to an array of optoelectronic devices. The interconnect includes a multiple optical fiber connector and an optoelectronic board. The multiple fiber connector can be mechanically attached to or detached from the board.
133 Citations
23 Claims
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1. An optoelectronic interconnect comprising:
a multiple optical fiber connector comprising; a holder having at least one planar surface, a plurality of optical fibers attached to the holder, each fiber having a first end abutting the first surface so as to expose the first end for receiving or transmitting optical radiation, said first ends of said fibers forming a fiber array having a first pattern, and guiding means disposed in said holder at predetermined positions with respect to said fiber array; and an optoelectronic board comprising; a substrate having a first surface and first aligning means, an optoelectronic device array monolithically formed on a first surface of a semiconductor chip, said optoelectronic device array having substantially the same pattern as the first pattern of said fiber array, said chip being disposed on the substrate, second aligning means for aligning said array of optoelectronic devices to said first aligning means, said first aligning means being disposed at substantially the same predetermined positions with respect to said array of optoelectronic devices as the positions of the guiding means relative to said fiber array, and said first aligning means receiving said guiding means so as to mechanically align said optoelectronic device array with said fiber array, whereby each optoelectronic device is aligned to an optical fiber, said optoelectronic device array emitting optical radiation into said optical fiber array or receiving optical radiation from said fiber array. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 23)
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22. A method for interconnecting an optical connector with an optoelectronic board comprising the steps of:
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providing a multiple optical fiber connector, said connector comprising; a holder having at least one planar surface, a plurality of optical fibers attached to the holder, each fiber having a first end abutting the first surface so as to expose the first end for receiving or transmitting optical radiation, said first ends of said fibers forming a fiber array having a first pattern, and guiding means disposed in said holder at predetermined positions with respect to said fiber array; providing an optoelectronic board, said board comprising; a substrate having a first surface and a first aligning means, an array of optoelectronic devices monolithically formed on a first surface of a semiconductor chip, said optoelectronic devices having substantially the same pattern as the first pattern of said fiber array, said wafer being disposed on the substrate, second aligning means for aligning said array of optoelectronic devices to said first aligning means, said first aligning means being disposed at substantially the same predetermined positions with respect to said array of optoelectronic devices as the positions of the guiding means relative to said fiber array; and aligning and engaging said guiding means of said connector with said first aligning means so as to mechanically align said array of optoelectronic devices with said fiber array, whereby each optoelectronic device is aligned to an end of a fiber, said array of optoelectronic devices emitting optical radiation into said fiber array or receiving optical radiation emitted from said fiber array.
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Specification