Apparatus and method for cooling heat generating electronic components in a cabinet

• US 5,422,787 A
• Filed: 03/21/1994
• Issued: 06/06/1995
• Est. Priority Date: 09/28/1992
• Status: Expired due to Fees

• Current Assignee: Energy Innovations, Inc.
• Original Assignee: Energy Innovations, Inc.
• Inventors: Gourdine, Meredith C.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/215,376
• Time in Patent Office: 442 Days
• Field of Search: 361/687-697
• US Class Current: 361/697
• CPC Class Codes: H05K 7/20154 Heat dissipaters coupled to components

Abstract

Electronic components in a cabinet are cooled by enclosing and isolating predetermined heat generating electronic components which may include those with heat sinks from other electronic components in the cabinet and providing a dedicated air flow pathway to conduct a stream of air from the cabinet exterior, across the isolated electronic components, and exhaust it to the cabinet exterior. The dedicated air flow is isolated from the ambient air in the cabinet such that the isolated heat generating components are cooled independently of the non-isolated components and the heat generated by the isolated components and non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet. Cooling efficiency is increased by creating turbulence in the dedicated stream of air which passes across the isolated heat generating component or the fins of the heat sink before being exhausted and by providing specially designed inlet and outlet conduits to improve the flow rate and to reduce the pressure drop across the heat generating electronic component.

Claims

1. A method of cooling electronic components within a cabinet comprising the steps of:

enclosing at least one predetermined heat generating electronic component inside a cabinet to isolate it from other electronic components in the cabinet;

providing an isolated air flow pathway to conduct air from the cabinet exterior, across the enclosed heat generating electronic component, and exhaust the air to the cabinet exterior, said isolated air flow pathway being isolated from ambient air inside the cabinet;

providing turbulence inducing means in said isolated air flow pathway at one end of the enclosed heat generating electronic component, and

conducting air through said isolated air flow pathway and across said turbulence inducing means such that the turbulent air flows across the enclosed heat generating electronic component, whereby

the enclosed heat generating electronic component is cooled independently of the non-isolated components and the heat generated by the enclosed heat generating electronic component and the non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet, and

the turbulent air flow prevents the formation of a laminar boundary layer of air on the surface of the enclosed heat generating electronic component to maximize heat transfer.

2. The method of cooling electronic components according to claim 1 wherein;

said turbulence inducing means includes a plurality of perforations configured to convert the air flow in the isolated air flow pathway into a multiplicity of small vortices, and

said step of conducting air through said isolated air flow pathway and across said turbulence inducing means causes the turbulent air to flow across the enclosed heat generating electronic component in a multiplicity of small vortices.

3. The method of cooling electronic components according to claim 1 wherein;

said enclosed heat generating electronic component includes a heat sink member in thermal contact therewith having heat conduction means for conducting heat generated by the enclosed heat generating electronic component, and

said step of conducting air through said isolated air flow pathway and across said turbulence inducing means causes the turbulent air to flow across the heat sink member.

4. The method of cooling electronic components according to claim 1 wherein;

said enclosed heat generating electronic component includes a heat sink member in thermal contact therewith having a series of parallel spaced longitudinal fins for conducting heat generated by the enclosed heat generating electronic component, and

said step of conducting air through said isolated air flow pathway and across said turbulence inducing means causes the turbulent air to flow between said fins.

5. The method of cooling electronic components according to claim 4 wherein;

said turbulence inducing means includes a plurality of perforations configured to convert the air flow in the isolated air flow pathway into a multiplicity of small vortices, and

said step of conducting air through said isolated air flow pathway and across said turbulence inducing means causes the turbulent air to flow between said fins in a multiplicity of small vortices.

6. The method of cooling electronic components according to claim 4 wherein;

said step of providing turbulence inducing means includes directing the-air flowing through said isolated air flow pathway at opposite ends of said fins to flow transverse to the longitudinal axis of said fins to convert the air flowing between said fins into a plurality of small eddies.

7. The method of cooling electronic components according to claim 6 wherein;

said step of providing turbulence inducing means includes directing the transverse air flow at said opposite ends of said fins through a tapered inlet at one end and a tapered outlet at the opposite end of said fins, and

said inlet and outlet being tapered relative to the longitudinal axis of said fins to make the air speed entering and exiting between each of said fins substantially uniform and convert the air entering and exiting between said fins into a plurality of small eddies of substantially uniform turbulence.

8. The method of cooling electronic components according to claim 6 wherein;

said step of providing turbulence inducing means includes directing the transverse air flow at said opposite ends of said fins through an inlet at one end and an outlet at the opposite end of said fins, and

said inlet being gradually reduced in cross sectional area such that the transverse air speed remains substantially constant and converts the air entering between each of said fins into a plurality of small eddies of substantially uniform turbulence.

9. The method of cooling electronic components according to claim 8 wherein;

said outlet being gradually increased in cross sectional area to minimize the turbulence of said pluralities of small eddies exiting from between each of said fins and associated pressure loss as air flows out of said fins.

10. The method of cooling electronic components according to claim 6 wherein;

said step of providing turbulence inducing means includes aligning the opposite ends of each one of said plurality of fins at an angle relative to the transverse air flow at said opposite ends of said fins to make the air speed entering and exiting between each of said fins substantially uniform and convert the air entering and exiting between said fins into a plurality of small eddies of substantially uniform turbulence.

11. A method of cooling electronic components within a cabinet comprising the steps of:

enclosing at least one predetermined heat generating electronic component inside a cabinet to isolate it from other electronic components in the cabinet;

providing an isolated air flow pathway to conduct air from the cabinet exterior, across the enclosed heat generating electronic component, and exhaust the air to the cabinet exterior, said isolated air flow pathway being isolated from ambient air inside the cabinet;

providing inlet means upstream from said enclosed heat generating electronic component and outlet means downstream from said heat generating electronic component in said isolated air flow pathway, said inlet means having a cross sectional area gradually reduced in the direction of air flow and said outlet means having a cross sectional area gradually increased in the direction of air flow, said cross sectional areas being sized to reduce the pressure drop across said enclosed heat generating electronic component; and

conducting air through said isolated air flow pathway through said inlet means, across said heat generating electronic component, and through said outlet means;

whereby

the enclosed heat generating electronic component is cooled independently of the non-isolated components and the heat generated by the enclosed heat generating electronic component and the non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet; and

the cross sectional areas of said inlet means and said outlet means reduce the pressure drop across the enclosed heat generating electronic component.

12. The method of cooling electronic components according to claim 11 wherein;

said enclosed heat generating electronic component includes a heat sink member in thermal contact therewith having heat conduction means for conducting heat generated by the enclosed heat generating electronic component, and

said step of conducting air through said isolated air flow pathway through said inlet means, across said heat generating electronic component, and through said outlet means includes conducting air across said heat sink member.

13. Apparatus for cooling electronic components within a cabinet comprising:

an enclosure formed of electrically non-conductive material having an interior cavity configured to enclose at least one predetermined heat generating electronic component and isolate it from other electronic components in the cabinet;

air inlet means on said enclosure adapted to be connected with the cabinet exterior and air outlet means on said enclosure adapted to be connected with the cabinet exterior to define an isolated air flow pathway from the cabinet exterior, across the enclosed heat generating electronic component, and to the cabinet exterior, said isolated air flow pathway being isolated from ambient air inside the cabinet, and said inlet and outlet means adapted to be connected with a fan for conducting air through said isolated air flow pathway;

turbulence inducing means in said isolated air flow pathway closely adjacent a surface of the enclosed heat generating electronic component, and

the fan in operation conducting air through said isolated air flow pathway and across said turbulence inducing means such that the turbulent air flows across the enclosed heat generating electronic component, whereby

the enclosed heat generating electronic component is cooled independently of the non-isolated components and the heat generated by the enclosed heat generating electronic component and the non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet, and

the turbulent air flow substantially reduces the formation of a thick laminar boundary layer of air on the surface of the enclosed heat generating electronic component to maximize heat transfer.

14. The apparatus according to claim 13 in which;

said turbulence inducing means includes a plurality of perforations configured to convert the air flow in the isolated air flow pathway into a multiplicity of small vortices which flow across the enclosed heat generating electronic component in a multiplicity of small vortices.

15. The apparatus according to claim 13 in which;

said enclosed heat generating electronic component includes a heat sink member in thermal contact therewith having heat conduction means for conducting heat generated by the enclosed heat generating electronic component, and

said turbulence inducing means is configured to cause the turbulent air to flow across the heat sink member.

16. The apparatus according to claim 13 in which;

said enclosed heat generating electronic component includes a heat sink member in, thermal contact therewith having a series of parallel spaced longitudinal fins for conducting heat generated by the enclosed heat generating electronic component, and

said turbulence inducing means is configured to cause the turbulent air to flow between said fins.

17. The apparatus according to claim 16 in which;

said turbulence inducing means includes a plurality of perforations configured to convert the air flow in said isolated air flow pathway into a multiplicity of small vortices which flow between said fins in a multiplicity of small vortices.

18. The apparatus according to claim 16 in which;

said inlet and outlet means is configured to direct the air flowing through said isolated air flow pathway at opposite ends of said fins to flow transverse to the longitudinal axis of said fins to convert the air flowing between said fins into a plurality of small eddies.

19. The apparatus according to claim 18 in which;

said inlet and outlet means are tapered relative to the longitudinal axis of said fins to make the air speed entering and exiting between each of said fins substantially uniform and convert the air entering and exiting between said fins into a plurality of small eddies of substantially uniform turbulence.

20. The apparatus according to claim 16 in which;

said inlet means is gradually reduced in cross sectional area such that the transverse air speed remains substantially constant and converts the air entering between each of said fins into a plurality of small eddies of substantially uniform turbulence.

21. The apparatus according to claim 20 in which;

said outlet means is gradually increased in cross sectional area to minimize the turbulence of said pluralities of small eddies exiting from between each of said fins and associated pressure loss as air flows out of said fins.

22. The apparatus according to claim 16 in which;

the opposite ends of said parallel spaced longitudinal fins are aligned at an angle relative to the transverse air flow at said opposite ends to make the air speed entering and exiting between each of said fins substantially uniform and convert the air entering and exiting between said fins into a plurality of small eddies of substantially uniform turbulence. rate.

23. The apparatus according to claim 13 wherein;

said air inlet means and said air outlet means include an air inlet port and an air outlet port on said enclosure each in fluid communication with said interior cavity for directing air through said interior cavity of said enclosure, and

conduit means connecting said air inlet port and said outlet port with the exterior of the cabinet and with the fan to isolate said isolated air flow pathway from the ambient air inside the cabinet.

24. The apparatus according to claim 23 further comprising

connector means for connecting at least one end of said conduit means with the the fan top to conduct air through said conduit to the exterior of the cabinet.

25. The apparatus according to claim 23 wherein;

said conduit means is formed of corrugated tubing having a smooth interior surface.

26. The apparatus according to claim 23 wherein;

said conduit means is formed of flexible corrugated tubing having a interior grooves filled with elastomeric material to provide a smooth interior surface.

27. The apparatus according to claim 13 wherein

said enclosure, said air inlet means, and said air outlet means are an integral unit formed of a single length of conduit having an aperture through its side wall which is configured to receive and surround said at least one predetermined heat generating electronic component and isolate it from other electronic components in the cabinet;

and

said single length of conduit adapted to be connected at opposite ends with the cabinet exterior to define said isolated air flow pathway and at least one of said opposite ends adapted to be connected with the fan for conducting air through said isolated air flow pathway.

28. The apparatus according to claim 27 wherein

said turbulence inducing means comprises a tapered surface on the interior of said single length of conduit closely adjacent a surface of the enclosed heat generating electronic component.

29. Apparatus for cooling electronic components within a cabinet comprising:

an enclosure formed of electrically non-conductive material having an interior cavity configured to enclose at least one predetermined heat generating electronic component and isolate it from other electronic components in the cabinet;

air inlet means on said enclosure adapted to be connected with the cabinet exterior and air outlet means on said enclosure adapted to be connected with the cabinet exterior to define an isolated air flow pathway from the cabinet exterior, across the enclosed heat generating electronic component, and to the cabinet exterior, said isolated air flow pathway being isolated from ambient air inside the cabinet, and said inlet and outlet means adapted to be connected with a fan for conducting air through said isolated air flow pathway;

said air inlet means having a gradually reduced cross sectional area upstream from said heat generating electronic component and said air outlet means having a gradually increased cross sectional area downstream from said heat generating electronic component, and said cross sectional areas being sized to reduce the pressure drop across said enclosed heat generating electronic component;

the fan in operation conducting air through said isolated air flow pathway, through said inlet means reduced cross sectional area, across said heat generating electronic component, and through said outlet means increased cross sectional area, whereby

said enclosed heat generating electronic component is cooled independently of the non-isolated components and the heat generated by said enclosed heat generating electronic component and the non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet, and the cross sectional areas of said inlet means and said outlet means substantially reduces the pressure drop across said enclosed heat generating electronic component.

30. A cabinet for containing and cooling heat generating electronic components comprising:

a cabinet housing having mounting means for mounting electronic components thereon;

a plurality of electronic components including heat generating electronic components mounted on said mounting means;

an enclosure formed of electrically non-conductive material having an interior cavity configured to enclose at least one predetermined heat generating electronic component and isolate it from other electronic components in said cabinet housing;

air inlet means and air outlet means on said enclosure each connected with the exterior of said cabinet housing to define an isolated air flow pathway from said cabinet housing exterior, across said enclosed heat generating electronic component, and to said cabinet housing exterior, said isolated air flow pathway being isolated from ambient air inside said cabinet housing, and said inlet and outlet means adapted to be connected to a fan for conducting air through said isolated air flow pathway;

turbulence inducing means in said isolated air flow pathway closely adjacent a surface of said enclosed heat generating electronic component; and

the fan in operation conducting air through said isolated air flow pathway and across said turbulence inducing means such that the turbulent air flows across said enclosed heat generating electronic component;

whereby

said enclosed heat generating electronic component is cooled independently of the non-isolated components and the heat generated by said enclosed heat generating electronic component and the non-isolated components is not mixed within said cabinet housing to maximize cooling of all components within said cabinet housing; and

the turbulent air flow substantially reduces the formation of a thick laminar boundary layer of air on the surface of the enclosed heat generating electronic component to maximize heat transfer.

31. The cabinet according to claim 30 wherein

said air inlet means has a gradually reduced cross sectional area upstream from said heat generating electronic component and said air outlet means has a gradually increased cross sectional area downstream from said heat generating electronic component, and the cross sectional areas of said inlet means and said outlet means are sized to substantially reduce the pressure drop across said enclosed heat generating electronic component.