Contactless test method and system for testing printed circuit boards

• US 5,424,633 A
• Filed: 09/30/1992
• Issued: 06/13/1995
• Est. Priority Date: 01/22/1991
• Status: Expired due to Fees

• Current Assignee: Jacob Soiferman
• Original Assignee: Advanced Test Technologies, Inc.
• Inventors: Soiferman, Jacob
• Primary Examiner(s): Karlsen, Ernest F.
• Application Number:
  US07/953,845
• Time in Patent Office: 986 Days
• Field of Search: 324/158 R, 324/158 F, 324/73.1, 324/501, 324/439, 324/537, 324/538, 324/639, 324/642, 324/655, 324/675, 324/519, 324/158.1
• US Class Current: 324/754.21
• CPC Class Codes: G01R 31/2812 Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance of connections G01R31/66
• CPC Class Codes: G01R 31/309 of printed or hybrid circuits or circuit substrates
• CPC Class Codes: G01R 31/315 by inductive methods

Abstract

This application describes a method of testing for manufacturing faults and quality of unpopulated or inactive populated electronic printed circuit boards (PCB). This method can be used to develop a new contactless test system (CTS). An electromagnetic field is generated by an energizing plate connected to an AC signal. When a board under test (BUT) is placed within the electromagnetic field, perturbation of the original field by conducting elements on the BUT is solely a function of the geometrical layout of the conducting elements on the BUT. Therefore, measurement of the perturbed electromagnetic field produces a characteristic pattern for the BUT. Such a pattern can then be compared to a known pattern for the same type of board to determine whether the BUT is faulty (shorts or opens) or not faulty. The most distinctive feature of this method is that testing PCBs by this method requires no electrical contact with the BUT due to the use of the energizing plate.

Claims

1. A method for testing an unpopulated circuit board including electrically conductive paths, parts, and surfaces whose electrical and physical continuity and conformance to a known standard is to be verified, the method comprising providing a signal applying conductor;

providing an array of non-contact sensors;

placing an unpopulated circuit board under test between the signal applying conductor and the array such that the board under test is free from direct electrical contact with the signal applying conductor and with the array;

powering the signal applying conductor by an AC electrical signal independent of geometric layout of the conductive material on the board under test to generate an original electromagnetic near field which is transmitted from the signal applying conductor to the array for detection thereby;

using the said array of non-contact sensors, without direct electrical contact with the board under test, to detect a pattern of perturbation of the original electromagnetic near field of the signal applying conductor caused by the board under test, said pattern of perturbation therefore defining a test pattern representative of the circuit board under test;

making a comparison of the said test pattern with a known pattern; and

determining from the said comparison whether the board under test is in conformance to the known standard.

2. The method according to claim 1 wherein the signal applying conductor comprises a plate made of a high conducting metal material and wherein the plate is brought to a position closely adjacent one face of the circuit board under test to apply said electromagnetic near field to the board evenly over the face of the circuit board under test.

3. The method according to claim 2 including providing on the plate insulator means to prevent direct electrical contact with the board.

4. The method according to claim 3 wherein the insulator means comprises an insulating layer covering one face of the plate.

5. The method according to claim 1 wherein each sensor of the array comprises a planar printed spiral loop antenna.

6. The method according to claim 5 wherein the antenna has a transverse dimension of the order of 0.5 cm.

7. The method according to claim 1 including receiving a signal from each sensor and measuring the peak value of the signal, converting the analogue peak value to digital form and transferring the digital form to a central computer system.

8. A method for testing an inactive populated circuit board including electrically conductive paths, parts, and surfaces whose electrical and physical continuity and conformance to a known standard is to be verified, the method comprising providing a signal applying conductor;

providing an array of non-contact sensors;

placing an inactive populated circuit board under test between the signal applying conductor and the arrayarray such that the board under test is free from direct electrical contact with the signal applying conductor and with the array;

powering the signal applying conductor by an AC electrical signal independent of geometric layout of the conductive material on the board under test to generate an original electromagnetic near field which is transmitted from the signal applying conductor to the array for detection thereby;

using the said array of non-contact sensors, without direct electrical contact with the board under test, to detect a pattern of perturbation of the original electromagnetic near field of the signal applying conductor caused by the board under test, said pattern of perturbation therefore defining a test pattern representative of the circuit board under test;

making a comparison of the said test pattern with a known pattern; and

determining from the said comparison whether the board under test is in conformance to the known standard.

9. The method according to claim 8 wherein the signal applying conductor comprises a plate made of a high conducting metal material and wherein the plate is brought to a position closely adjacent one face of the circuit board under test to apply said electromagnetic near field to the board evenly over the face of the circuit board under test.

10. The method according to claim 9 including providing om the plate insulator means to prevent direct electrical contact with the board.

11. The method according to claim 10 wherein the insulator means comprises an insulating layer covering one face of the plate.

12. The method according to claim 8 wherein each sensor of the array comprises a planar printed spiral loop antenna.

13. The method according to claim 12 wherein the antenna has a transverse dimension of the order of 0.5 cm.

14. The method according to claim 8 including receiving a signal from each sensor and measuring the peak value of the signal, converting the analogue peak value to digital form and transferring the digital form to a central computer system.