Anti-stick electrostatic chuck for a low pressure environment

• US 5,426,558 A
• Filed: 03/14/1994
• Issued: 06/20/1995
• Est. Priority Date: 11/07/1991
• Status: Expired due to Fees

• Current Assignee: Varian Semiconductor Equipment Associates Incorporated (Applied Materials Incorporated)
• Original Assignee: Varian Associates, Inc.
• Inventors: Sherman, Arthur
• Primary Examiner(s): Gaffin, Jeffrey A.
• Application Number:
  US08/213,459
• Time in Patent Office: 463 Days
• Field of Search: 361/230, 361/231, 361/235, 269/8, 269/903, 279/128
• US Class Current: 361/234
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: Y10S 269/903 Work holder for electrical circuit assemblages or wiring systems
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means

Abstract

An electrostatic chuck for releasably holding a workpiece comprising a substrate formed by a pair of dielectric elements, each being a single crystal, with at least one electrode embedded therebetween, and a voltage source coupled to each electrode. The chuck is preferably fabricated from two substantially planar dielectric members sandwiched around a brazing compound which become electrodes after the assembly is heated and then cooled.

Claims

1. An electrostatic chuck for holding an electrically conductive workpiece on the chuck in a low pressure environment, said chuck comprising:

a substrate comprising first and second dielectric plates,

said first dielectric plate having an upper and lower surface, said upper surface having at least one recess formed thereon, said first dielectric plate forming a single crystal;

at least one electrode, said electrode placed within said recess of said first dielectric plate;

said second dielectric plate having an upper surface for supporting the workpiece and a lower surface, said second dielectric plate forming a single crystal, said second dielectric plate mounted by its lower surface contiguously and coextensively to the upper surface of said first dielectric plate;

a voltage source for applying a voltage to at least one of said electrodes; and

means for coupling at least one of said conductive electrodes to said voltage source.

2. The chuck of claim 1, wherein said first dielectric plate is thicker than said second dielectric plate.

3. The chuck of claim 2, wherein said first dielectric plate further comprises at least one opening extending through the lower surface of said first plate into said recess for accommodating said means for coupling said electrode to said voltage source.

4. The chuck of claim 1 wherein the substrate is fabricated of a material from the group of materials comprising quartz and magnesium oxide.

5. The chuck of claim 1 wherein a single electrically conductive electrode is embedded in the substrate, and the workpiece is coupled to ground.

6. The chuck of claim 1 wherein there are two electrically conductive electrodes embedded within the substrate:

a first electrode coupled to a voltage of +V and a second electrode coupled to a voltage of -V.