Electronic package clamping arrangement

• US 5,426,565 A
• Filed: 03/26/1993
• Issued: 06/20/1995
• Est. Priority Date: 03/26/1993
• Status: Expired due to Fees

• Current Assignee: Sundstrand Corporation (Rtx Corporation)
• Original Assignee: Sundstrand Corporation (Rtx Corporation)
• Inventors: Anderson, W. Kyle
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US08/037,768
• Time in Patent Office: 816 Days
• Field of Search: 267/150, 267/160, 165/80.3, 165/185, 439/485, 257/706, 257/707, 257/709, 257/712, 257/713, 257/718, 257/719, 361/704, 361/707, 361/708, 361/709, 361/711, 361/713
• US Class Current: 361/711
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 2023/4081 Compliant clamping elements not primarily serving heat-conduction
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A clamping arrangement for an electronic package includes a supporting means for supporting an electronic package and a clamping means for clamping the electronic package to the supporting means. The clamping means includes a plurality of springs between a clamping plate and a load distribution plate for evenly applying forces from the clamping plate to the load distribution plate to press the electronic package against the supporting means.

Claims

1. A clamping arrangement comprising:

an electronic package having first and second surfaces;

supporting means for supporting the electronic package; and

clamping means for clamping the electronic package to the supporting means, the clamping means including a clamping plate, the clamping means having pressure applying means for applying a loading pressure to the electronic package in order to press the second surface of the electronic package against the supporting means and for more evenly distributing the loading pressure over the electronic package, the pressure applying means including (i) a load distribution plate having first and second surfaces, wherein the first surface of the load distribution plate includes a plurality of recesses, and wherein the second surface of the load distribution plate abuts the first surface of the electronic package and (ii) a plurality of Belleville springs for applying a plurality of forces to the first surface of the load distribution plate, each of the Belleville springs being located between a corresponding one of the plurality of recesses in the first surface of the load distribution plate and the clamping plate, the clamping plate being arranged to apply force through the Belleville springs to the load distribution plate in order to press the electronic package against the supporting means.

2. A clamping arrangement comprising:

an electronic package having first and second surfaces;

supporting means for supporting the electronic package; and

clamping means for clamping the electronic package to the supporting means, the clamping means including a clamping plate, the clamping means having pressure applying means for applying a loading pressure to the electronic package in order to press the second surface of the electronic package against the supporting means and for more evenly distributing the loading pressure over the electronic package, the pressure applying means including (i) a load distribution plate having firs and second surfaces, wherein the second surface of the load distribution plate abuts the first surface of the electronic package, and (ii) a dimpled plate located between the clamping plate and the first surface of the load distribution plate, the dimpled plate having a plurality of dimples each of which transfers a force from the clamping plate to the load distribution plate in order to press the electronic package against the supporting means.

3. The clamping arrangement of claim 2 wherein the dimpled plate is compliant.

4. A clamping arrangement comprising:

an electronic package having first and second surfaces;

supporting means for supporting the electronic package, the supporting means including a heat sink having a heat sink surface, the supporting means further including a sheet of compliant and thermally conductive material abutting both the second surface of the electronic package and the heat sink surface, the sheet of compliant and thermally conductive material conforming to the second surface of the electronic package so as to efficiently conduct heat from the electronic package to the heat sink; and

clamping means for clamping the electronic package to the supporting means, the clamping means having pressure applying means for applying a loading pressure to the electronic package in order to press the electronic package against the supporting means and for more evenly distributing the loading pressure over the electronic package, the pressure applying means including (i) a load distribution plate having first and second surfaces, wherein the second surface of the load distribution plate abuts the first surface of the electronic package, and (ii) force applying means for applying a plurality of forces to the first surface of the load distribution plate in order to press the second surface of the electronic package against the supporting means, wherein the force applying means comprises a plurality of springs, and wherein the clamping means comprises a clamping plate, each of the springs acting to transfer a force and being located between the first surface of the load distribution plate and the clamping plate, the clamping plate arranged to apply force through the springs to the load distribution plate in order to press the electronic package against the supporting means.

5. The clamping arrangement of claim 4 wherein the springs comprise a plurality of Belleville springs and the load distribution plate comprises a plurality of recesses in the first surface of the load distribution plate, each of the Belleville springs being located between a corresponding one of the plurality of recesses in the load distribution plate and the clamping plate.

6. A clamping arrangement comprising:

an electronic package having first and second surfaces;

supporting means for supporting the electronic package, the supporting means including a heat sink having a heat sink surface, the supporting means further including a sheet of compliant and thermally conductive material abutting both the second surface of the electronic package and the heat sink surface, the sheet of compliant and thermally conductive material conforming to the second surface of the electronic package so as to efficiently conduct heat from the electronic package to the heat sink; and

clamping means for clamping the electronic package to the supporting means, the clamping means having pressure applying means for applying a loading pressure to the electronic package in order to press the electronic package against the supporting means and for more evenly distributing the loading pressure over the electronic package, the pressure applying means including (i) a load distribution plate having first and second surfaces, wherein the second surface of the load distribution plate abuts the first surface of the electronic package, and (ii) force applying means for applying a plurality of forces to the first surface of the load distribution plate in order to press the second surface of the electronic package against the supporting means, wherein the clamping means comprises a clamping plate, and wherein the force applying means comprises a dimpled plate located between the clamping plate and the first surface of the load distribution plate, the dimpled plate having a plurality of dimples each of which acts to transfer a force from the clamping plate to the load distribution plate in order to press the electronic package against the supporting means.

7. The clamping arrangement of claim 6 wherein the dimpled plate is compliant.

8. A clamping arrangement comprising:

an electronic package wherein the electronic package has first and second oppositely disposed housing surfaces, a plurality of load bearing means for bearing loads exerted on the first and second housing surfaces and for transferring loads between the first and second housing surfaces, and electronic components arranged between the first and second housing surfaces;

supporting means for supporting the electronic package, the supporting means including a heat sink, the supporting means further including a sheet of compliant material abutting the second housing surface of the electronic package, the sheet of compliant material conforming to the second housing surface of the electronic package being thermally conductive so as to efficiently conduct heat from the electronic package to the supporting means; and

clamping means for clamping the electronic package to the supporting means, the clamping means abutting the first housing surface of the electronic package, the clamping means including a plurality of force applying means for applying a corresponding plurality of forces in order to press the electronic package against the supporting means and for more evenly distributing the forces pressing the electronic package against the supporting means, wherein each of the plurality of force applying means is aligned with one of the plurality of load bearing means of the electronic package, wherein the clamping means comprises a load distribution plate having first and second surfaces, wherein the second surface of the load distribution plate abuts the first housing surface of the electronic package, and wherein the force applying means comprises a plurality of springs and a clamping plate, each of the springs being located between the first surface of the load distribution plate and the clamping plate and being aligned with one of the plurality of load bearing means of the electronic package, the clamping plate being arranged to apply force through the springs to the load distribution plate in order to press the electronic package against the supporting means.

9. The clamping arrangement of claim 8 wherein springs comprise a plurality of Belleville springs and the load distribution plate comprises a plurality of recesses in the first surface of the load distribution plate, each of the Belleville springs being located between a corresponding one of the plurality of recesses in the load distribution plate and the clamping plate.

10. A clamping arrangement comprising:

an electronic package wherein the electronic package has first and second oppositely disposed housing surfaces, a plurality of load bearing means for bearing loads exerted on the first and second housing surfaces and for transferring loads between the first and second housing surfaces, and electronic components arranged between the first and second housing surfaces;

supporting means for supporting the electronic package, the supporting means including a heat sink, the supporting means further including a sheet of compliant material abutting the second housing surface of the electronic package, the sheet of compliant material conforming to the second housing surface of the electronic package being thermally conductive so as to efficiently conduct heat from the electronic package to the supporting means; and

clamping means for clamping the electronic package to the supporting means, the clamping means abutting the first housing surface of the electronic package, the clamping means including a plurality of force applying means for applying a corresponding plurality of forces in order to press the electronic package against the supporting means and for more evenly distributing the forces pressing the electronic package against the supporting means, wherein each of the plurality of force applying means is aligned with one of the plurality of load bearing means of the electronic package, wherein the clamping means comprises a load distribution plate having first and second surfaces, wherein the second surface of the load distribution plate abuts the first housing surface of the electronic package, and wherein the force applying means comprises a clamping plate and a compliant dimpled plate located between the clamping plate and the first surface of the load distribution plate, the compliant dimpled plate having a plurality of dimples each of which is aligned with one of the plurality of load bearing means of the electronic package and each of which acts to transfer a force from the clamping plate to the load distribution plate in order to press the electronic package against the supporting means.

11. A clamping arrangement comprising:

an electronic package wherein the electronic package has first and second oppositely disposed housing surfaces, a plurality of load bearing means for bearing loads exerted on the first and second housing surfaces and for transferring loads between the first and second housing surfaces, and electronic components arranged between the first and second housing surfaces;

supporting means for supporting the electronic package, the supporting means abutting the second housing surface of the electronic package; and

clamping means for clamping the electronic package to the supporting means, the clamping means including a load distribution plate having first and second surfaces, wherein the second surface of the load distribution plate abuts the first housing surface of the electronic package, the load distribution plate including a plurality of recesses in the first surface of the load distribution plate, the clamping means further including a plurality of Belleville springs and a clamping plate, each of the Belleville springs being located between a corresponding one of the plurality of recesses in the first surface of the load distribution plate and the clamping plate, each of the Belleville springs being aligned with one of the plurality of load bearing means of the electronic package, the clamping plate being arranged to apply force through the Belleville springs to the load distribution plate in order to press the electronic package against the supporting means and to more evenly distribute the forces pressing the electronic package against the supporting means.