×

Electronic package clamping arrangement

  • US 5,426,565 A
  • Filed: 03/26/1993
  • Issued: 06/20/1995
  • Est. Priority Date: 03/26/1993
  • Status: Expired due to Fees
First Claim
Patent Images

1. A clamping arrangement comprising:

  • an electronic package having first and second surfaces;

    supporting means for supporting the electronic package; and

    clamping means for clamping the electronic package to the supporting means, the clamping means including a clamping plate, the clamping means having pressure applying means for applying a loading pressure to the electronic package in order to press the second surface of the electronic package against the supporting means and for more evenly distributing the loading pressure over the electronic package, the pressure applying means including (i) a load distribution plate having first and second surfaces, wherein the first surface of the load distribution plate includes a plurality of recesses, and wherein the second surface of the load distribution plate abuts the first surface of the electronic package and (ii) a plurality of Belleville springs for applying a plurality of forces to the first surface of the load distribution plate, each of the Belleville springs being located between a corresponding one of the plurality of recesses in the first surface of the load distribution plate and the clamping plate, the clamping plate being arranged to apply force through the Belleville springs to the load distribution plate in order to press the electronic package against the supporting means.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×