Method and apparatus for a self contained heat exchanger

• US 5,427,174 A
• Filed: 04/30/1993
• Issued: 06/27/1995
• Est. Priority Date: 04/30/1993
• Status: Expired due to Fees

• Current Assignee: Heat Transfer Devices, Inc.
• Original Assignee: Heat Transfer Devices, Inc.
• Inventors: Lean, Grace A., Lomolino, Paul A. Jr., Burns, Patricia L., Lomolino, Paul A. Sr.
• Primary Examiner(s): CHAMBERS, A MICHAEL
• Application Number:
  US08/056,173
• Time in Patent Office: 788 Days
• Field of Search: 165/104.13, 165/104.26, 165/104.33, 165/1, 165/2
• US Class Current: 165/104.13
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure

Abstract

A self contained heat exchanger useful for reducing the operational temperature of a solid state device utilizing mixtures of two or more coolants within a hermetically sealed chamber or chambers. The present invention includes embodiments that are useful for removing heat from a semiconductor electronic device. The present invention provides a low boiling point coolant that boils at the operational temperatures of the semiconductor devices to agitate a higher boiling point coolant that remains in liquid state. Movement of the higher boiling point coolant is instrumental in uniformly transferring heat from the heat source across metal radiator surfaces due to the excellent surface contact of the heat rich high boiling point liquid. The chamber surface then uniformly radiates the heat into the surroundings. At equilibrium, boiling action of the lower point liquid coolant and condensation on the metal surface create recirculation paths within the present invention that enhances heat transfer. The entire device may rest squarely on top of the semiconductor package and does not require any active mechanical components or external power or maintenance.

Claims

1. A method of dissipating heat from a heat source to maintain said heat source within an operational temperature range, said method comprising the step of:

providing a coolant mixture within a hermetically sealed chamber, said coolant mixture comprising a first coolant with a boiling point below said temperature range and a second coolant with a boiling point above said temperature range;

thermally coupling said sealed chamber with said heat source;

providing a plurality of condenser chambers each coupled to said sealed chamber wherein each of said condenser chambers contains a mesh structure;

boiling said first coolant to provide energy to circulate and agitate said second coolant;

transferring heat from said second coolant to said sealed chamber, wherein said second coolant promotes heat transfer;

electing said second coolant from said sealed chamber into said plurality of condenser chambers through individual inlet holes coupling each condenser chamber to said sealed chamber;

reflowing said second coolant from said plurality of condenser chambers back to said sealed chamber using said mesh structure; and

radiating heat from outer surfaces of said sealed chamber.

2. A method of dissipating heat as described in claim 1 wherein said outer surfaces are maintained at substantially uniform heat distribution and wherein said heat source is a solid state electronic component.

3. A method of heat dissipation from a heat source, said method comprising the steps of:

providing a first chamber for thermally coupling with said heat source and providing a second chamber for condensation;

providing a mesh plane within said second chamber;

boiling a first coolant in said first chamber to provide transfer energy, said first coolant having a lower boiling point than an operational temperature range of said heat source;

using said transfer energy, transferring a second coolant from said first chamber to said second chamber through an inlet valve, said second coolant having a higher boiling point than said operational temperature range of said heat source, wherein said second coolant promotes heat transfer and wherein said second coolant has higher molecular density over said first coolant;

reflowing said second coolant from said second chamber back to said first chamber using said mesh plane; and

uniformly radiating heat from said second chamber.

4. A method of heat dissipation from a heat source as described in claim 3 wherein said step of transferring a second coolant comprises the step of carrying said second coolant into said second chamber by boiling action and agitation of said first coolant.

5. A method of heat dissipation from a heat source as described in claim 3 wherein said heat source is a semiconductor device.

6. A method of heat dissipation from a heat source as described in claim 3 wherein said second coolant is water.

7. A method of heat dissipation from a heat source as described in claim 3 wherein said step of uniformly radiating heat from said second chamber comprises the step of transferring heat content of said second coolant, in liquid state, to inner surfaces of said second chamber.

8. A heat exchanging method of regulating the temperature of a solid state device within an operational temperature range, said method comprising the steps of:

providing a first chamber for thermally coupling with said solid state device and providing a second chamber for condensation;

providing said first chamber and said second chamber with a connecting mesh plane;

providing a coolant mixture of a first coolant having a lower boiling point than said operational temperature range and a second coolant having a higher boiling point than said operational temperature range;

boiling said first coolant in said first chamber to agitate said second coolant;

transferring said first coolant and said second coolant into said second chamber through a single inlet valve as a result of agitation of said step of boiling, wherein said second coolant transfers heat out of said coolant mixture to promote heat dissipation; and

reflowing said second coolant from said second chambers back to said first chamber using said mesh plane.

9. A heat exchanging method as described in claim 8 further comprising the steps of:

transferring heat content of said second coolant to surrounding surfaces of said second chamber to provide a substantially uniform heat distribution across outer surfaces of said second chamber; and

radiating heat from said outer surfaces of said second chamber.

10. A heat exchanging method as described in claim 8 further comprising the step of reflowing said coolant mixture from said second chamber to said first chamber forces of said mesh plane.

11. A heat exchanging method as described in claim 8 wherein said solid state device is a microprocessor.

12. A heat exchanging method as described in claim 8 further comprising the step of evacuating any air from said first chamber and from said second chamber before said step of providing said coolant mixture.

13. A self contained heat exchanging apparatus for regulating the temperature of a heat producing device within an operational temperature range, said apparatus comprising:

coolant mixture means for transferring heat content to inner surfaces of said heat exchanging apparatus, said coolant mixture means comprising a first coolant with a boiling point below said operational temperature range and a second coolant with a boiling point above said operational temperature range, wherein said first coolant boils to agitate said second coolant and wherein said second coolant is for transferring heat to said inner surfaces of said heat exchanging apparatus to dissipate said heat and wherein said second coolant is of higher molecular density over said first coolant;

structure means for thermally coupling with said heat producing device and for allowing said first coolant to boil and agitate said second coolant, wherein said coolant mixture is sealed within said inner surfaces of said heat exchanging apparatus; and

condenser means for receiving transferred coolant mixture means ejected from said structure means, said condenser means for uniformly radiating heat transferred thereto by said second coolant, said condenser means coupled to said structure means.

14. A heat exchanging apparatus as described in claim 13 further comprising means for reflowing said coolant mixture means from said condenser means to said structure means.

15. A heat exchanging apparatus as described in claim 14 wherein said condenser means further comprises plate radiator means for radiating heat said plate radiator means having a substantially uniform heat distribution.

16. A heat exchanging apparatus as described in claim 14 wherein said means for reflowing comprises a mesh means for directing coolant mixture by capillary forces.

17. A heat exchanging apparatus as described in claim 15 wherein said second coolant is water and further comprising means for evacuating air from said structure means and from said condenser means.

18. A heat exchanging apparatus as described in claim 15 wherein said second coolant is water.

19. A heat exchanging apparatus as described in claim 15 wherein said heat producing device is a semiconductor device.

20. A heat exchanging apparatus as described in claim 15 wherein said condenser means comprises a plurality of individual condenser chambers coupled to said structure means.

21. A heat exchanging apparatus as described in claim 15 wherein said substantially uniform heat distribution of said plate radiator means results substantially from heat transfer of said second coolant in liquid state.

22. A self contained closed loop heat exchanger for regulating the temperature of a heat producing device within an operational range, said heat exchanger comprising:

a coolant mixture comprising a first coolant with a boiling point below said operational range and a second coolant with a boiling point above said operational range;

a first chamber for thermally coupling with said heat producing device and for providing a boiling location for said first coolant;

a plurality of condenser chambers each individually coupled with said first chamber via an inlet hole, said condenser chambers for receiving ejected hot first and second coolant from said first chamber, wherein said coolant mixture is sealed within an area containing both said plurality of condenser chambers and said first chamber;

outer heat radiation surfaces maintained at substantially uniform heat distribution, said outer heat radiation surfaces coupled to said first chamber and coupled to said plurality of condenser chambers, wherein said first coolant boils to agitate said second coolant and wherein said second coolant is for transferring heat to said outer heat radiation surfaces to promote dissipation of said heat; and

a mesh plane for promoting condensation and for reflowing said coolant mixture from said plurality of condenser chambers to said first chamber, said mesh plane coupled with said first chamber and coupled with said plurality of condenser chambers.