Method and apparatus for a self contained heat exchanger
First Claim
1. A method of dissipating heat from a heat source to maintain said heat source within an operational temperature range, said method comprising the step of:
- providing a coolant mixture within a hermetically sealed chamber, said coolant mixture comprising a first coolant with a boiling point below said temperature range and a second coolant with a boiling point above said temperature range;
thermally coupling said sealed chamber with said heat source;
providing a plurality of condenser chambers each coupled to said sealed chamber wherein each of said condenser chambers contains a mesh structure;
boiling said first coolant to provide energy to circulate and agitate said second coolant;
transferring heat from said second coolant to said sealed chamber, wherein said second coolant promotes heat transfer;
electing said second coolant from said sealed chamber into said plurality of condenser chambers through individual inlet holes coupling each condenser chamber to said sealed chamber;
reflowing said second coolant from said plurality of condenser chambers back to said sealed chamber using said mesh structure; and
radiating heat from outer surfaces of said sealed chamber.
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Accused Products
Abstract
A self contained heat exchanger useful for reducing the operational temperature of a solid state device utilizing mixtures of two or more coolants within a hermetically sealed chamber or chambers. The present invention includes embodiments that are useful for removing heat from a semiconductor electronic device. The present invention provides a low boiling point coolant that boils at the operational temperatures of the semiconductor devices to agitate a higher boiling point coolant that remains in liquid state. Movement of the higher boiling point coolant is instrumental in uniformly transferring heat from the heat source across metal radiator surfaces due to the excellent surface contact of the heat rich high boiling point liquid. The chamber surface then uniformly radiates the heat into the surroundings. At equilibrium, boiling action of the lower point liquid coolant and condensation on the metal surface create recirculation paths within the present invention that enhances heat transfer. The entire device may rest squarely on top of the semiconductor package and does not require any active mechanical components or external power or maintenance.
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Citations
22 Claims
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1. A method of dissipating heat from a heat source to maintain said heat source within an operational temperature range, said method comprising the step of:
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providing a coolant mixture within a hermetically sealed chamber, said coolant mixture comprising a first coolant with a boiling point below said temperature range and a second coolant with a boiling point above said temperature range; thermally coupling said sealed chamber with said heat source; providing a plurality of condenser chambers each coupled to said sealed chamber wherein each of said condenser chambers contains a mesh structure; boiling said first coolant to provide energy to circulate and agitate said second coolant; transferring heat from said second coolant to said sealed chamber, wherein said second coolant promotes heat transfer; electing said second coolant from said sealed chamber into said plurality of condenser chambers through individual inlet holes coupling each condenser chamber to said sealed chamber; reflowing said second coolant from said plurality of condenser chambers back to said sealed chamber using said mesh structure; and radiating heat from outer surfaces of said sealed chamber. - View Dependent Claims (2)
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3. A method of heat dissipation from a heat source, said method comprising the steps of:
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providing a first chamber for thermally coupling with said heat source and providing a second chamber for condensation; providing a mesh plane within said second chamber; boiling a first coolant in said first chamber to provide transfer energy, said first coolant having a lower boiling point than an operational temperature range of said heat source; using said transfer energy, transferring a second coolant from said first chamber to said second chamber through an inlet valve, said second coolant having a higher boiling point than said operational temperature range of said heat source, wherein said second coolant promotes heat transfer and wherein said second coolant has higher molecular density over said first coolant; reflowing said second coolant from said second chamber back to said first chamber using said mesh plane; and uniformly radiating heat from said second chamber. - View Dependent Claims (4, 5, 6, 7)
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8. A heat exchanging method of regulating the temperature of a solid state device within an operational temperature range, said method comprising the steps of:
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providing a first chamber for thermally coupling with said solid state device and providing a second chamber for condensation; providing said first chamber and said second chamber with a connecting mesh plane; providing a coolant mixture of a first coolant having a lower boiling point than said operational temperature range and a second coolant having a higher boiling point than said operational temperature range; boiling said first coolant in said first chamber to agitate said second coolant; transferring said first coolant and said second coolant into said second chamber through a single inlet valve as a result of agitation of said step of boiling, wherein said second coolant transfers heat out of said coolant mixture to promote heat dissipation; and reflowing said second coolant from said second chambers back to said first chamber using said mesh plane. - View Dependent Claims (9, 10, 11, 12)
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13. A self contained heat exchanging apparatus for regulating the temperature of a heat producing device within an operational temperature range, said apparatus comprising:
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coolant mixture means for transferring heat content to inner surfaces of said heat exchanging apparatus, said coolant mixture means comprising a first coolant with a boiling point below said operational temperature range and a second coolant with a boiling point above said operational temperature range, wherein said first coolant boils to agitate said second coolant and wherein said second coolant is for transferring heat to said inner surfaces of said heat exchanging apparatus to dissipate said heat and wherein said second coolant is of higher molecular density over said first coolant; structure means for thermally coupling with said heat producing device and for allowing said first coolant to boil and agitate said second coolant, wherein said coolant mixture is sealed within said inner surfaces of said heat exchanging apparatus; and condenser means for receiving transferred coolant mixture means ejected from said structure means, said condenser means for uniformly radiating heat transferred thereto by said second coolant, said condenser means coupled to said structure means. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A self contained closed loop heat exchanger for regulating the temperature of a heat producing device within an operational range, said heat exchanger comprising:
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a coolant mixture comprising a first coolant with a boiling point below said operational range and a second coolant with a boiling point above said operational range; a first chamber for thermally coupling with said heat producing device and for providing a boiling location for said first coolant; a plurality of condenser chambers each individually coupled with said first chamber via an inlet hole, said condenser chambers for receiving ejected hot first and second coolant from said first chamber, wherein said coolant mixture is sealed within an area containing both said plurality of condenser chambers and said first chamber; outer heat radiation surfaces maintained at substantially uniform heat distribution, said outer heat radiation surfaces coupled to said first chamber and coupled to said plurality of condenser chambers, wherein said first coolant boils to agitate said second coolant and wherein said second coolant is for transferring heat to said outer heat radiation surfaces to promote dissipation of said heat; and a mesh plane for promoting condensation and for reflowing said coolant mixture from said plurality of condenser chambers to said first chamber, said mesh plane coupled with said first chamber and coupled with said plurality of condenser chambers.
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Specification