Thin film DC plasma processing system
First Claim
1. An enhanced DC plasma processing system comprising:
- a. a coating chamber;
b. a material target disposed to expose coating material within said chamber;
c. a means for causing deposition of said coating material upon a substrate wherein said means for causing deposition comprises an anode and a cathode;
d. a DC power source wherein said DC power source has a direct current power output and first and second leads which are connected across a plasma load to establish a circuit;
e. an inductor means connected in series along said first lead between said direct current power output and said plasma load and having first and second inductor portions wherein said first and second portions are magnetically coupled; and
f. a switch connected from said second lead to said first lead at a point in between said first and second inductor portions.
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Accused Products
Abstract
An enhanced DC plasma processing system which acts to immediately stop current from flowing through the plasma allows a variety of alternative embodiments for varying applications. In one embodiment, a tapped inductor is switched to ground to achieve substantial voltage reversal of about 10% upon detection of an arc condition through voltage and/or rate of voltage change techniques. This reversal of voltage is maintained long enough to allow restoration of uniform charge density within the plasma prior to restoration of the initial driving condition. A technique for preventing arc discharges involving periodically applying a reverse voltage is effected through a timer system in the power supply.
165 Citations
8 Claims
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1. An enhanced DC plasma processing system comprising:
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a. a coating chamber; b. a material target disposed to expose coating material within said chamber; c. a means for causing deposition of said coating material upon a substrate wherein said means for causing deposition comprises an anode and a cathode; d. a DC power source wherein said DC power source has a direct current power output and first and second leads which are connected across a plasma load to establish a circuit; e. an inductor means connected in series along said first lead between said direct current power output and said plasma load and having first and second inductor portions wherein said first and second portions are magnetically coupled; and f. a switch connected from said second lead to said first lead at a point in between said first and second inductor portions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification