Method of micromachining an integrated sensor on the surface of a silicon wafer

• US 5,427,975 A
• Filed: 05/10/1993
• Issued: 06/27/1995
• Est. Priority Date: 05/10/1993
• Status: Expired due to Term

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delco Electronics Corporation (General Motors Company)
• Inventors: Christenson, John C., Sparks, Douglas R., Brown, Ronald E., Healton, Robert L.
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): CHAUDHARI, CHANDRA P
• Application Number:
  US08/059,222
• Time in Patent Office: 778 Days
• Field of Search: 437/79, 437/203, 437/901, 437/927, 156/644, 148/DIG. 73
• US Class Current: 438/52
• CPC Class Codes: B81C 1/00246 Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
• CPC Class Codes: B81C 2203/0735 Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
• CPC Class Codes: G01J 5/045 Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements getter arrangements per se H01L23/26 and H01L21/3221
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/764 Air gaps H01L21/76264 takes precedence

Abstract

A method for micromachining the surface of a silicon substrate which encompasses a minimal number of processing steps. The method involves a preferential etching process in which a chlorine plasma etch is capable of laterally etching an N+ buried layer beneath the surface of the bulk substrate. Such a method is particularly suitable for forming sensing devices which include a small micromachined element, such as a bridge, cantilevered beam, membrane, suspended mass or capacitive element, which is supported over a cavity formed in a bulk silicon substrate. The method also permits the formation of such sensing devices on the same substrate as their controlling integrated circuits. This invention also provides novel methods by which such structures can be improved, such as through optimizing the dimensional characteristics of the micromachined element or by encapsulating the micromachined element.

Claims

1. A method for micromachining a surface of a silicon substrate so as to form therein a micromachined element of a semiconductor device, the method comprising the steps of:

forming an N+ region in the surface of the substrate;

growing an epitaxial silicon layer over the surface of the substrate so as to form an N+ buried layer beneath the epitaxial silicon layer;

etching at least one trench through the epitaxial silicon layer and into the N+ buried layer; and

laterally etching a cavity beneath the epitaxial silicon layer, the lateral etching step being conducted with chlorine gas at a pressure of about 100 to about 1000 mTorr and with the substrate at a temperature of at least about 35°

C. so as to preferentially etch the N+ buried layer

and thereby form the micromachined element between the cavity and the epitaxial silicon layer, the micromachined element being a component of the semiconductor device.

2. A method as recited in claim 1 further comprising the step of sealing the trench with a polysilicon film such that the cavity is sealed from the surface of the epitaxial silicon layer, the cavity forming a sealed reference chamber for a pressure sensing device.

3. A method as recited in claim 1 wherein the etching step forms a second trench through the epitaxial silicon layer and into the N+ buried layer, and wherein the method further comprises the step of sealing the second trench with a polysilicon film such that the micromachined element forms a membrane for a pressure sensing device.

4. A method as recited in claim 1 wherein the etching step forms the trench as an elongate trench which extends through the epitaxial silicon layer and into the N+ buried layer so as to form the micromachined element as a cantilevered beam which extends over the cavity, the cantilevered beam defining a suspended mass for a motion sensing device.

5. A method as recited in claim 1 wherein the etching step forms a second trench through the epitaxial silicon layer and into the N+ buried layer such that the micromachined element is a bridge over the cavity.

6. A method as recited in claim 1 wherein the etching step forms at least two elongate trenches which extend through the epitaxial silicon layer and into the N+ buried layer, the at least two elongate trenches defining the micromachined element as a mass which is suspended by at least two beams over the cavity.

7. A method as recited in claim 1 wherein:

the etching and lateral etching steps form a capacitor such that the trench defines opposing plates of the capacitor; and

the method further comprises the steps of;

depositing a conductive film on the opposing plates of the capacitor so as to reduce the distance between the opposing plates; and

etching back the conductive film so as to isolate the opposing plates from each other.

8. A method as recited in claim 1 further comprising the steps of:

forming an oxide layer on the epitaxial silicon layer prior to etching the trench;

applying a polysilicon layer on a surface of the oxide layer after etching the trench;

doping the polysilicon layer with a dopant;

masking a region of the polysilicon layer with a masking material;

etching exposed portions of the polysilicon layer from the surface of the oxide layer so as to leave at least one remaining polysilicon region on the oxide layer;

removing the masking material; and

activating the dopant in the remaining polysilicon region;

whereby the remaining polysilicon region defines an active integrated circuit device.

9. A method as recited in claim 1 further comprising the steps of:

filling the cavity and the trench with polyimide such that the micromachined element is immobilized;

depositing over the polyimide a first layer of material selected from the group consisting of silicon nitride and silicon dioxide;

annealing the first layer of material at a temperature and for a duration which are sufficient to relieve stress in the first layer of material;

forming at least one opening in the first layer of material;

etching the polyimide through the opening in the first layer of material so as to release the micromachined element; and

depositing over the first layer of material a second layer of material so as to seal the opening in the first layer of material and form an encapsulating layer over the micromachined element;

whereby the micromachined element is free to respond to motion of the substrate while being protected by the encapsulating layer.

10. A method as recited in claim 1 wherein the N+ buried layer is a first N+ buried layer formed by doping the substrate with a first n-type species, and wherein the epitaxial silicon layer is a first epitaxial silicon layer, the method further comprising the steps of:

forming a second N+ region in the surface of the first epitaxial silicon layer by doping a region of the first epitaxial silicon layer with a second n-type species which diffuses relatively slowly in silicon as compared to the first n-type species;

forming a third N+ region within a portion of the second N+ region and above a portion of the first N+ buried layer, the third N+ region being doped with an n-type species which diffuses relatively quickly in silicon as compared to the second n-type species;

growing a second epitaxial silicon layer over the first epitaxial silicon layer so as to form second and third N+ buried layers beneath the second epitaxial silicon layer and above the first N+ buried layer;

heat treating the substrate sufficiently to diffuse a portion of the n-type species of the third N+ buried layer into a portion of the first N+ buried layer, the heat treatment being insufficient to diffuse the first n-type species of the first N+ buried layer into any portion of the second N+ buried layer and being insufficient to diffuse the second n-type species of the second N+ buried layer into any portion of the first N+ buried layer, such that a portion of the first epitaxial silicon layer remains between a portion of the first N+ buried layer and a portion of the second N+ buried layer;

etching at least one trench through the second epitaxial silicon layer and into at least one of the first, second and third N+ buried layers; and

laterally etching a cavity beneath the second epitaxial silicon layer, the lateral etching step being conducted with chlorine gas at a pressure of about 100 to about 1000 mTorr and with the substrate at a temperature of at least about 35°

C. so as to preferentially etch the first, second and third N+ buried layers

and thereby form the micromachined element between an upper portion of the cavity and a lower portion of the cavity, the micromachined element being a component of the semiconductor device.

11. A method for micromachining a surface of a silicon substrate so as to form a sensing device in the same substrate as at least one semiconductor device, the method comprising the steps of:

forming an N+ region in the surface of the substrate;

forming a silicon layer over the surface of the substrate so as to form an N+ buried layer beneath the silicon layer;

forming an etch mask on the silicon layer;

etching a plurality of trenches into the substrate and into the N+ buried layer;

laterally etching the N+ buried layer so as to form a cavity beneath the silicon layer, the lateral etching step being conducted with chlorine gas at a pressure of about 100 to about 1000 mTorr and with the substrate at a temperature of at least about 35°

C. so as to preferentially etch the N+ buried layer;

forming an oxide layer on the substrate and on the surfaces defined by the trenches and the cavity; and

depositing a polysilicon layer over the oxide layer so as to seal the trenches, such that the cavity is a sealed cavity beneath the surface of the substrate;

whereby a micromachined element is formed between the sealed cavity and the surface of the substrate, the micromachined element being a component of the sensing device.

12. A method as recited in claim 11 wherein the semiconductor device is formed on the substrate after the sensing device has been formed.

13. A method as recited in claim 11 wherein the semiconductor device is formed on the substrate prior to the sensing device being formed.

14. A method as recited in claim 11 wherein the lateral etching step forms at least two cavities beneath the surface of the substrate.

15. A method as recited in claim 14 wherein the step of depositing the polysilicon layer seals at least one of the at least two cavities to form a sealed reference chamber beneath the surface of the substrate, such that at least one of the at least two cavities remains vented to a surface of the substrate, each of the at least two cavities forming reference chambers for the sensing device.

16. A method as recited in claim 15 wherein the sealed reference chamber is sealed under a vacuum.

17. A method as recited in claim 14 wherein the step of depositing the polysilicon layer seals each of the two cavities so as to form two sealed reference chambers for the pressure sensing device.

18. A method as recited in claim 14 wherein the step of depositing the polysilicon layer seals each of the two cavities at the surface of the substrate, the method further comprising the step of:

masking an opposite surface of the substrate;

etching the opposite surface of the substrate so as to etch the substrate to the oxide layer formed on a first of the two cavities;

etching through the oxide layer of the first of the two cavities to the polysilicon layer deposited on the first of the two cavities; and

etching the polysilicon layer of the first of the two cavities so as to vent the first of the two cavities to the opposite surface of the substrate;

whereby the first of the two cavities forms a first sensing device for sensing pressure at the opposite surface of the substrate and the other of the two cavities forms a second sensor for sensing pressure at the surface of the substrate, such that the first and second sensing devices serve as references to each other.

19. A method as recited in claim 18 wherein the step of etching the opposite surface of the substrate is a wet silicon etch.

20. A method as recited in claim 18 wherein the step of etching the opposite surface of the substrate is an anisotropic etch.

21. A method for micromachining a surface of a silicon substrate so as to form a sensing device therein, the method comprising the steps of:

forming a first N+ region in the surface of the substrate by doping the substrate with a first n-type species;

growing a first epitaxial silicon layer over the surface of the substrate so as to form a first N+ buried layer beneath the first epitaxial silicon layer;

forming a second N+ region in the first epitaxial silicon layer by doping a region of the first epitaxial silicon layer with a second n-type species which diffuses relatively slowly in silicon as compared to the first n-type species;

forming a third N+ region within a portion of the second N+ region and above a portion of the first N+ buried layer, the third N+ region being doped with an n-type species which diffuses relatively quickly in silicon as compared to the second n-type species;

growing a second epitaxial silicon layer over the first epitaxial silicon layer so as to form second and third N+ buried layers beneath the second epitaxial silicon layer and above the first N+ buried layer;

heat treating the substrate sufficiently to diffuse a portion of the n-type species of the third N+ buried layer into a portion of the first N+ buried layer, the heat treatment being insufficient to diffuse the first n-type species of the first N+ buried layer into any portion of the second N+ buried layer and being insufficient to diffuse the second n-type species of the second N+ buried layer into any portion of the first N+ buried layer, such that a portion of the first epitaxial silicon layer remains between a portion of the first N+ buried layer and a portion of the second N+ buried layer;

etching at least one trench through the second epitaxial silicon layer and into at least one of the first, second and third N+ buried layers; and

laterally etching a cavity beneath the second epitaxial silicon layer, the lateral etching step being conducted with a chlorine-containing gas so as to preferentially etch the first, second and third N+ buried layers;

whereby a micromachined element is formed between an upper portion of the cavity and a lower portion of the cavity, the micromachined element being a component of the sensing device.

22. A method as recited in claim 21 wherein the first and second N+ buried layers are each doped with arsenic and the third N+ buried layer is doped with phosphorus.

23. A method as recited in claim 21 wherein at least one trench is etched into each of the second and third N+ buried layers.

24. A method as recited in claim 21 wherein at least one trench is etched into each of the first, second and third N+ buried layers.

25. A method as recited in claim 21 wherein the upper portion of the cavity is defined by the second N+ buried layer, the lower portion of the cavity is defined by the first N+ buried layer, and an intermediate portion of the cavity is defined by the third N+ buried layer.

26. A method for encapsulating a structure formed on a surface of a semiconductor material, the method comprising the steps of:

selectively patterning polyimide on the surface of the semiconductor material so as to cover the structure;

depositing over the polyimide a first layer of material selected from the group consisting of silicon nitride and silicon dioxide;

annealing the first layer of material at a temperature and for a duration which are sufficient to relieve stress in the first layer of material;

forming at least one opening in the first layer of material;

etching the polyimide through the opening in the first layer of material such that at least a portion of the first layer of material is suspended over the structure on the surface of the semiconductor material; and

depositing over the first layer of material a second layer of material, the second layer of material sealing the opening in the first layer of material so as to form an encapsulating layer over the structure.

27. A method as recited in claim 26 wherein the polyimide is photosensitive.

28. A method as recited in claim 26 wherein the structure comprises a sensing element which is free to respond to stimuli applied to the semiconductor material while being protected by the encapsulating layer.

29. A method as recited in claim 26 wherein the structure further comprises integrated circuit elements.

30. A method for micromachining a surface of a silicon substrate so as to form a capacitor therein, the method comprising the steps of:

forming an N+ region in the surface of the substrate;

growing an epitaxial silicon layer over the surface of the substrate so as to form an N+ buried layer beneath the epitaxial silicon layer;

masking the epitaxial silicon layer;

etching at least one trench through the epitaxial silicon layer and into the N+ buried layer, the trench defining opposing plates of the capacitor;

laterally etching a cavity beneath the epitaxial silicon layer, the lateral etching step being conducted with chlorine-containing gas such that the N+ buried layer is preferentially etched;

depositing a conductive film on the opposing plates of the capacitor so as to reduce the distance between the opposing plates; and

etching back the conductive film so as to isolate the opposing plates from each other.

31. A method as recited in claim 30 wherein the conductive film is polycrystalline silicon.