Microprocessor cooling in a portable computer

• US 5,430,609 A
• Filed: 09/02/1993
• Issued: 07/04/1995
• Est. Priority Date: 09/02/1993
• Status: Expired due to Fees

• Current Assignee: PDACO LIMITED
• Original Assignee: Elonex Technologies, Inc.
• Inventors: Kikinis, Dan
• Primary Examiner(s): Phillips, Michael W.
• Application Number:
  US08/116,331
• Time in Patent Office: 670 Days
• Field of Search: 364/708.1, 361/680, 361/687, 361/690, 361/698, 361/699, 361/702, 361/707, 361/703, 361/709-711, 361/717-719, 361/722, 62/259.2, 165/80.2-80.4, 165/104.33
• US Class Current: 361/679.09
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H04M 1/725 Cordless telephones user interfaces specially adapted therefor H04M1/724
• CPC Class Codes: H04M 3/42323 PBX's with CTI arrangements

Abstract

A CPU IC package for a computer system is cooled by a layer of compressible, heat-conducting material compressed between the IC package and a heat sink plate. In one embodiment the heat sink plate is a wall element of an access panel providing access to the interior of the computer system. Closing the access panel compresses the heat-conducting material between the IC package and the heat sink plate. To provide mechanical stability, the heat-conducting material is fastened to one of the heat sink plate and the IC package. In alternative embodiments the plate may be mounted outside the enclosure of the system with the heat-conducting material extending through an opening in a wall of the enclosure.

Claims

1. A method for cooling a heat-producing IC package assembly to be mounted within a housing of a portable computer, such as a laptop or notebook computer, comprising steps of:

mounting said IC package assembly within said housing with the package assembly positioned directly below a closed position of a pivoted keyboard assembly comprising a heat sink plate;

affixing a layer of a compressible, heat-conducting material to one of said IC package assembly and said heat-sink plate; and

closing said pivoted keyboard assembly to compress said compressible, heat-conducting material between said heat sink plate and said IC package assembly, such that heat produced by said IC package assembly may be absorbed by said heat sink plate.

2. The method of claim 1 wherein said heat-producing IC package assembly is a microprocessor for providing CPU functions for said computer

3. The method of claim 1 wherein said heat sink plate is configured on at least one surface to increase the surface area of said plate to improve heat transfer away from said plate.

4. The method of claim 1 wherein said heat sink plate comprises extension structures between keys on said keyboard.

5. A method for cooling a heat-producing IC package assembly to be mounted within a housing of a portable computer, such as a laptop or notebook computer, comprising steps of:

mounting said IC package assembly within said housing with the package assembly positioned adjacent to a wall of said housing;

providing an opening in the wall of the housing adjacent to the IC package assembly;

affixing a layer of a compressible, heat-conducting material to one of said IC package assembly and a heat-sink plate; and

mounting said heat sink plate adjacent to said wall outside said housing such that said heat-conducting material extends through said opening and is compressed between said IC package assembly and said heat sink plate.

6. The method of claim 5 wherein said heat sink plate is cooled by an auxiliary cooling system.

7. A heat transfer system for conducting waste heat away from an IC package assembly in a housing of a portable computer, comprising:

a volume of compressible heat-conducting material contacting said IC package assembly; and

a heat-sink plate spaced apart from said IC package assembly such that said compressible heat-conducting material is compressed between said heat-sink plate and said IC package assembly;

wherein the heat sink plate is a part of a hinged keyboard assembly, and the heat-conducting material is compressed between the IC package assembly and the heat sink plate as a result of moving the hinged keyboard assembly to a closed position.

8. A heat transfer system as in claim 7 wherein said heat sink plate comprises extension structures between keys on said keyboard.

9. A heat transfer system as claim 7 wherein said heat-producing IC package assembly is a microprocessor for providing CPU functions for said computer.

10. A heat transfer system as in claim 8 wherein said heat sink plate is configured on at least one surface to increase the surface area of said plate to improve heat transfer away from said plate.

11. A portable computer system, such as a laptop or notebook computer system, comprising:

a housing having a hinged keyboard comprising a heat sink plate;

a printed circuit board having an IC package assembly mounted thereon, said printed circuit board positioned within said housing to place said IC package assembly adjacent to said heat sink plate with said hinged keyboard closed; and

a volume of compressible, heat-conducting material affixed to one of said IC package assembly and said heat sink plate such that said compressible, heat-conducting material is compressed between said heat sink plate and said IC package assembly with said hinged keyboard closed.

12. A computer system as in claim 11 wherein said keyboard comprises extension elements between keys on said keyboard as heat-dissipation elements.