Chipping-resistant composition

• US 5,432,005 A
• Filed: 06/04/1993
• Issued: 07/11/1995
• Est. Priority Date: 06/24/1992
• Status: Expired due to Term

• Current Assignee: Nippon Paint Company Limited (Rainbow Light Limited)
• Original Assignee: Nippon Paint Company Limited (Rainbow Light Limited)
• Inventors: Mashima, Hiroshi, Tanigami, Hajime
• Primary Examiner(s): Marquis, Melvyn I.
• Assistant Examiner(s): AYLWARD, DAVID E
• Application Number:
  US08/071,103
• Time in Patent Office: 767 Days
• Field of Search: 204/181.7, 525/131, 524/507, 524/510, 523/409, 428/414, 428/516, 428/520
• US Class Current: 428/414
• CPC Class Codes: C08L 23/00 Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
• CPC Class Codes: C09D 175/04 Polyurethanes
• CPC Class Codes: Y10T 428/31515 As intermediate layer
• CPC Class Codes: Y10T 428/31913 Monoolefin polymer
• CPC Class Codes: Y10T 428/31928 Ester, halide or nitrile of addition polymer

Abstract

A method for forming a chipping-resistant film, a chipping resistant composition and coated articles containing the chipping-resistant film are disclosed. The method includes applying a water-based chipping-resistant composition in either (1) a coating process including electrodeposition, intermediate coating, and topcoating to form (a) a film disposed between an electrodeposited film and an intermediate-coated film, or (b) a film disposed between an intermediate-coated film and a topcoated film; or (2) a coating process including electrodeposition coating and topcoating to form (c) a film disposed between an electrodeposited film and a topcoated film. The water-based, chipping-resistant composition includes: (A) a modified ethylenical polymer which is obtained from an ethylene monomer and an ethylenically unsaturated monomer containing a carboxyl group and which has been made water-dispersible by the addition of a base, and in which at least the backbone of the ethylenical polymer molecule has carboxyl groups bonded thereto and derived from the ethylenically unsaturated monomer, the total amount of the carboxyl groups being not less than 10% by weight based on the amount of the ethylenical polymer; and (B) a water-based polyurethane resin, where the proportion of component (A) to component (B) is from 10/90 to 50/50 by weight.

Claims

1. A method for forming a chipping-resistant film which comprises applying a water-based chipping-resistant composition in either

(1) a coating process comprising electrodeposition, intermediate coating, and topcoating to form

(a) a film disposed between an electrodeposited film and an intermediate-coated film, or

(b) a film disposed between an intermediate-coated film and a topcoated film, or

(2) a coating process comprising electrodeposition and topcoating to form

(c) a film disposed between an electrodeposited film and a topcoated film,

said water-based, chipping-resistant composition consisting essentially of, as major components

(A) a modified ethylenical polymer which is obtained from ethylene monomer and an ethylenically unsaturated monomer containing a carboxyl group and which has been made water-dispersible by the addition of a base, and in which at least the backbone of the ethylenical polymer molecule has carboxyl groups bonded thereto and derived from the ethylenically unsaturated monomer, the total amount of the carboxyl groups being from 12.5 to 30% by weight based on the amount of the ethylenical polymer, and

(B) a water-based polyurethane resin,

the proportion of component (A) to component (B) being from 10/90 to 50/50 by weight, and wherein said chipping-resistant film has a dry thickness of 4 to 25 μ

m.

4. The method as claimed in claim 1, wherein the total amount of carboxyl groups in said water-based, chipping-resistant composition is from 12.5 to 30% by weight based on the amount of ethylenical polymer.

6. The method as claimed in claim 1 wherein the proportion of component (A) to component (B) in said water-based, chipping-resistant composition is from 15/85 to 40/60 by weight.

8. The method as claimed in claim 1, wherein the proportion of component (A) to component (B) in said water-based, chipping-resistant composition is from 20/80 to 35/65 by weight.

10. The method as claimed in claim 1 wherein said water-based, chipping-resistant composition further comprises at least one resin selected from the group consisting of an epoxy resin, a phenolic resin, a melamine resin, a polyester resin, and an acrylic resin in an amount of from 1 to 20% by weight based on the amount of the composition.

12. The method as claimed in claim 1 wherein said chipping-resistant film is formed by applying said water-based chipping-resistant composition in

(1) a coating process comprising electrodeposition, intermediate coating, and topcoating to form a film disposed between an electrodeposited film and an intermediate-coated film.

13. The method as claimed in claim 1 wherein said chipping-resistant film is formed by applying said water-based chipping-resistant composition in

(1) a coating process comprising electrodeposition, intermediate coating, and topcoating to form a film disposed between an intermediate-coated film and a topcoated film.

16. The method as claimed in claim 1 wherein said chipping-resistant film is formed by applying said water-based chipping-resistant composition in

(1) a coating process comprising electrodeposition coating and topcoating to form a film disposed between an electrodeposited film and a topcoated film.

18. The method as claimed in claim 1, wherein the modified ethylenical polymer is obtained from ethylene monomer and acrylic acid.

20. The method as claimed in claim 1, wherein the modified ethylenical polymer is obtained by continuously introducing ethylene monomer and said ethylenically unsaturated monomer having a carboxyl group into a reaction vessel that is maintained at a pressure of 1,500 to 2,000 atmospheres and at a temperature of 150°

to 250°

C., in a proportion of about from 10,000;

1 to 100;

2 ethylene monomer to ethylenically unsaturated monomer, and in the presence of peroxide.

2. A coated article having a multi-layered film formed by coating on an automotive body with a method for forming a chipping-resistant film which comprises applying a water-based, chipping-resistant composition in either

(1) a coating process comprising electrodeposition, intermediate coating, and topcoating to form

(a) a film disposed between an electrodeposited film and an intermediate-coated film, or

(b) a film disposed between an intermediate-coated film and a topcoated film, or

(2) a coating process comprising electrodeposition and topcoating to form

(c) a film disposed between an electrodeposited film and a topcoated film,

said water-based, chipping-resistant composition consisting essentially of, as major components

(A) a modified ethylenical polymer which is obtained from ethylene monomer and an ethylenically unsaturated monomer containing a carboxyl group and which has been made water-dispersible by the addition of a base, and in which at least the backbone of the ethylenical polymer molecule has carboxyl groups bonded thereto and derived from the ethylenically unsaturated monomer, the total amount of the carboxyl groups being from 12.5 to 30% by weight based on the amount of the ethylenical polymer, and

(B) a water-based polyurethane resin,

the proportion of component (A) to component (B) being from 10/90 to 50/50 by weight, and wherein said chipping-resistant film has a dry thickness of 4 to 25/μ

m.

3. The coated article having a multi-layered film as claimed in claim 2, which comprises an automotive body having, formed thereon, an electrodeposited film, a film of chipping-resistant composition, an intermediate-coated film, and a topcoated film,

said film of chipping-resistant composition disposed between the electrodeposited film and the intermediate-coated film being formed from a water-based, chipping-resistant composition consisting essentially of as major components,

(A) a modified ethylene resin which is obtained from an ethylene monomer and an ethylenically unsaturated monomer containing a carboxyl group and which has been made water-dispersible by the addition of a base, and in which at least the backbone of the ethylenical polymer molecule has carboxyl groups bonded thereto and derived from the ethylenically unsaturated monomer, the total amount of the carboxyl groups being not less than 10% by weight based on the amount of the ethylenical polymer, and

(B) a water-based polyurethane resin,

the proportion of component (A) to component (B) being from 10/90 to 50/50 by weight.

5. The coated article as claimed in claim 2, wherein the total amount of carboxyl groups in said water-based, chipping-resistant composition is from 12.5 to 30% by weight based on the amount of ethylenical polymer.

7. The coated article as claimed in claim 2 wherein the proportion of component (A) to component (B) in said water-based, chipping-resistant composition is from 15/85 to 40/60 by weight.

9. The coated article as claimed in claim 2, wherein the proportion of component (A) to component (B) in said water-based, chipping-resistant composition is from 20/80 to 35/65 by weight.

11. The coated article as claimed in claim 2, wherein said water-based, chipping-resistant composition further comprises at least one resin selected from the group consisting of an epoxy resin, a phenolic resin, a melamine resin, a polyester resin, and an acrylic resin in an amount of from 1 to 20% by weight based on the amount of the composition.

14. The coated article as claimed in claim 2 wherein said chipping-resistant film is formed by applying said water-based chipping-resistant composition in

(1) a coating process comprising electrodeposition, intermediate coating, and topcoating to form a film disposed between an electrodeposited film and an intermediate-coated film.

15. The coated article as claimed in claim 2 wherein said chipping-resistant film is formed by applying said water-based chipping-resistant composition in

(1) a coating process comprising electrodeposition, intermediate coating, and topcoating to form a film disposed between an intermediate-coated film and a topcoated film.

17. The coated article as claimed in claim 2 wherein said chipping-resistant film is formed by applying said water-based chipping-resistant composition in

(1) a coating process comprising electrodeposition coating and topcoating to form a film disposed between an electrodeposited film and a topcoated film.

19. The coated article as claimed in claim 2, wherein the modified ethylenical polymer is obtained from ethylene monomer and acrylic acid.

21. The coated article as claimed in claim 2, wherein the modified ethylenical polymer is obtained by continuously introducing ethylene monomer and said ethylenically unsaturated monomer having a carboxyl group into a reaction vessel that is maintained at a pressure of 1,500 to 2,000 atmospheres and at a temperature of 150°

to 250°

C., in a proportion of about from 10,000;

1 to 100;

2 ethylene monomer to ethylenically unsaturated monomer, and in the presence of peroxide.