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Apparatus for segmenting stacked IC chips

  • US 5,432,318 A
  • Filed: 01/07/1994
  • Issued: 07/11/1995
  • Est. Priority Date: 05/15/1992
  • Status: Expired due to Term
First Claim
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1. An apparatus for segmenting a stack of integrated circuit chips into short stacks, said stack including at least one segmentation plane defined by a pair of contiguous cap chips united by a thermoplastic bonding material, said apparatus comprising:

  • a. a heat conducting base having a front and rear face and an upper surface, at least one cavity in said base opening on the upper surface, said cavity defining a floor and walls in said base and being proportioned to receive a portion of a stack of integrated circuit chips to be segmented into a short stack, an extending portion of said stack projecting out of the cavity;

    b. a compartment in said base having heating means contained therein, the heat generated thereby being conducted to the walls of the cavity;

    c. driver means reciprocally mounted on the upper surface of said base for movement over the cavity opening, said base being provided with a track in which said driver means is slidably disposed., said track comprising a groove in the upper surface extending from the front face to the rear face of said base and intersecting the cavity opening;

    d. means for applying reciprocal movement to said driver means; and

    e. means for controlling said heating means to maintain at least the cavity walls at a desired temperature.

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