Apparatus for segmenting stacked IC chips

• US 5,432,318 A
• Filed: 01/07/1994
• Issued: 07/11/1995
• Est. Priority Date: 05/15/1992
• Status: Expired due to Term

• Current Assignee: Aprolase Development Co LLC (Intellectual Ventures LLC)
• Original Assignee: Irvine Sensors Corp.
• Inventors: Minahan, Joseph A.
• Primary Examiner(s): Walberg, Teresa J.
• Application Number:
  US08/178,923
• Time in Patent Office: 550 Days
• Field of Search: 219/385, 219/386, 219/521, 392/340, 392/395, 338/203, 156/247, 156/344, 156/584, 29/650, 29/762
• US Class Current: 219/385
• CPC Class Codes: H01L 21/67121 Apparatus for making assemblies not otherwise provided for, e.g. package constructions
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 156/942 with reorientation means
• CPC Class Codes: Y10T 156/1978 Delaminating bending means

Abstract

A tool for segmenting a stack of bonded IC chips into short stacks includes a heat conducting base having at least one cavity in its upper face for receiving a portion of an IC chip stack. The length and width dimensions of the cavity are essentially the same as the corresponding dimensions of the stack. The depth of the cavity is selected to correspond to the desired thickness of the short stack to be formed from the stack. The base is heated to raise the temperature of the cavity walls to heat the stack above the softening point of the bonding material. A driver is movably mounted on the base for contact with a portion of a face of the stack extending above the opening of the cavity, and a threaded rod supported on the base urges the driver against the stack to effect separation of the extending portion of the stack from the segment portion which remains in the cavity. A track in the upper surface of the base is provided for travel of the driver.

Claims

1. An apparatus for segmenting a stack of integrated circuit chips into short stacks, said stack including at least one segmentation plane defined by a pair of contiguous cap chips united by a thermoplastic bonding material, said apparatus comprising:

a. a heat conducting base having a front and rear face and an upper surface, at least one cavity in said base opening on the upper surface, said cavity defining a floor and walls in said base and being proportioned to receive a portion of a stack of integrated circuit chips to be segmented into a short stack, an extending portion of said stack projecting out of the cavity;

b. a compartment in said base having heating means contained therein, the heat generated thereby being conducted to the walls of the cavity;

c. driver means reciprocally mounted on the upper surface of said base for movement over the cavity opening, said base being provided with a track in which said driver means is slidably disposed., said track comprising a groove in the upper surface extending from the front face to the rear face of said base and intersecting the cavity opening;

d. means for applying reciprocal movement to said driver means; and

e. means for controlling said heating means to maintain at least the cavity walls at a desired temperature.

2. The apparatus of claim 1 wherein said means for applying reciprocal movement to said driver means comprises a plate disposed on the rear face of said base extending normally upwardly above the upper surface of said base, said plate having at least one internally threaded opening, a threaded rod extending perpendicularly through the threaded opening, said threaded rod carrying said driver means on one end to act against the extending portion of said stack responsive to the translation of rotation of said rod to linear movement of said driver means.

3. The apparatus of claim 1 wherein said driver means comprises a body reciprocally mounted on the upper surface of said base, said body including a planar contact face for contact with a planar surface of the extending portion of said stack.

4. The apparatus of claim 3 wherein said means for applying reciprocal motion to said driver body includes an upwardly extending plate disposed on the rear face of said base, said back plate being provided with a threaded opening, a threaded rod is disposed in and extends through said threaded opening, said threaded rod carrying a driver body on one end.

5. The apparatus of claim 1 wherein said driver means consists of a block-shaped driver body provided with a lower depending portion having upwardly inwardly biased side surfaces, said groove having corresponding upwardly inwardly biased sides to define a track in which the depending portion of said driver body is received.

6. The apparatus of claim 1 comprising at least a pair of parallel grooves in said upper surface of said base extending from the front face to the rear face of said base and a cavity in each of said grooves opening to the upper surface of said base, and wherein said driver comprises a driver body having a lower depending portion received in each of said grooves and being mounted on the upper surface of said base for reciprocal movement along said grooves.

7. The apparatus of claim 6 wherein the floor of each of the cavities is equally vertically disposed with respect to the upper surface of said base.

8. The apparatus of claim 6 wherein the floor of each of the cavities is disposed at a different vertical distance from the upper surface of said base.

9. The apparatus of claim 1 wherein said heating means is a resistance heating element, and said base further includes a pair of thermocouple-containing compartments in said base, the compartments extending from a side face of said base normal to the longitudinal axes thereof and terminating therein adjacent to and below the cavity.

10. The apparatus of claim 9 wherein a control thermocouple is located in one of the thermocouple compartments and a monitor thermocouple is located in the other thermocouple compartment.

11. An apparatus for segmenting a stack of integrated circuit chips into shorter stacks, said stack including at least one segmentation plane defined by two chips united by a softenable thermoplastic bonding material, said apparatus comprising:

a. a heat conducting base having a planar upper surface, at least one cavity in said upper surface defining a floor and walls in said base and being proportioned to receive a portion of a stack of bonded, integrated circuit chips to be segmented into a shorter stack, an extending portion of said stack projecting out of said cavity;

b. a heater in said base, the heat generated thereby being conducted to the walls and base of said cavity;

c. a driver slidably mounted on said upper surface of said base for movement over the opening of said cavity and within a track in the upper surface of said base comprising a groove in said upper surface intersecting said cavity opening;

d. means for forcing said driver slidably along said track; and

e. a temperature controller for controlling said heater to maintain at least said cavity walls at about a desired temperature.

12. The apparatus defined in claim 11, wherein said driver comprises a driver body comprising a lower depending portion having upwardly, inwardly biased side surfaces, said groove having corresponding upwardly, inwardly biased sides to define a track in which said depending portion of said driver body is retained to prevent tilting of said driver body during its travel along said track.

13. The apparatus defined in claim 11 further comprising a stack of bonded, integrated circuit chips positioned within said cavity, the planes of said circuit chips in said stack being substantially parallel to the plane of said upper surface of said base, the lower chip in said stack being supported by the bottom surface of said cavity, and the lateral dimensions of said chips and said stack within the plane of said base corresponding substantially to the dimensions of said cavity and the plane of said base, the depth of said cavity and the thickness of said chips being such that said driver, when slidably forced along said track, contacts a portion of the face of the stack extending above the opening of said cavity to effect separation of the extending portion of the stack from the segment portion remaining in said cavity.

14. The apparatus defined in claim 13, wherein said segmentation plane is defined by a pair of contiguous cap chips united by said heat-softenable thermoplastic bonding material, and the lower surface of the upper cap chip at said segmentation plane is below the leading edge of said cavity and above the trailing edge of said cavity.