In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing

• US 5,433,651 A
• Filed: 12/22/1993
• Issued: 07/18/1995
• Est. Priority Date: 12/22/1993
• Status: Expired due to Term

• Current Assignee: Ebara Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Saenger, Katherine L., Tong, Ho-Ming, Lustig, Naftali E.
• Primary Examiner(s): Kisliuk, Bruce M.
• Assistant Examiner(s): LEE, JOHN D
• Application Number:
  US08/173,294
• Time in Patent Office: 573 Days
• Field of Search: 451/6, 451/7, 437/7, 437/225, 156/626, 156/636
• US Class Current: 451/6
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24D 7/12 with apertures for inspecting the surface to be abraded
• CPC Class Codes: G01B 11/0683 measurement during deposition or removal of the layer

Abstract

An in-situ chemical-mechanical polishing process monitor apparatus for monitoring a polishing process during polishing of a workpiece in a polishing machine, the polishing machine having a rotatable polishing table provided with a polishing slurry, is disclosed. The apparatus comprises a window embedded within the polishing table, whereby the window traverses a viewing path during polishing and further enables in-situ viewing of a polishing surface of the workpiece from an underside of the polishing table during polishing as the window traverses a detection region along the viewing path. A reflectance measurement means is coupled to the window on the underside of the polishing table for measuring a reflectance, the reflectance measurement means providing a reflectance signal representative of an in-situ reflectance, wherein a prescribed change in the in-situ reflectance corresponds to a prescribed condition of the polishing process.

Claims

1. An in-situ chemical-mechanical polishing process monitor apparatus for monitoring a polishing process during polishing of a workpiece in a polishing machine, the polishing machine having a rotatable polishing table provided with a polishing slurry, said apparatus comprising:

a) a window embedded within the polishing table, said window traversing a viewing path during polishing and further enabling in-situ viewing of a polishing surface of the workpiece from an underside of the polishing table during polishing as said window traverses a detection region along the viewing path; and

b) means coupled to said window on the underside of the polishing table for measuring a reflectance, said reflectance measurement means providing a reflectance signal representative of an in-situ reflectance, wherein a prescribed change in the in-situ reflectance corresponds to a prescribed condition of the polishing process.

2. The apparatus of claim 1, wherein:

said window further being embedded within the table wherein a top surface of said window is substantially flush with a top surface of the table.

3. The apparatus of claim 1, wherein:

said reflectance measurement means comprises i) a light source for providing an incident light beam incident upon an underside of said window and transmitted therethrough at a prescribed incident angle, ii) a first detector for detecting an amount of incident light provided by said light source, said first detector providing a first signal representative of the amount of incident light, iii) a second detector for detecting an amount of a reflected light reflected back through said window, said second detector providing a second signal representative of the amount of reflected light, and iv) means responsive to said first and second signals, respectively, for providing the reflectance signal, the reflectance signal corresponding to a ratio of the reflected light to the incident light.

4. The apparatus of claim 3, further wherein:

i) said light source comprises a laser, the laser providing a well-collimated incident light beam incident upon the underside of said window along an incident light beam path,

ii) said first detector comprises a beam splitter and a photodiode, wherein the beam splitter is arranged in the path of the incident light beam for reflecting a portion of the light beam to the photodiode and transmitting a remainder portion of the incident light beam therethrough along the incident light beam path to the underside of said window, and

iii) said second detector comprises a photodiode.

5. The apparatus of claim 4, still further wherein:

the laser is positioned distant from the rotating table, said light source further comprises an optical means for guiding and directing the incident light beam to be incident upon the underside of said window along the incident light beam path.

6. The apparatus of claim 1, further comprising:

c) means responsive to reflectance signal for detecting the prescribed change in the in-situ reflectance in real-time, said detection means providing an output signal indicative of the detection of the prescribed change in the in-situ reflectance.

7. The apparatus of claim 6, wherein:

said window further being embedded within the table wherein a top surface of said window is substantially flush with a top surface of the table.

8. The apparatus of claim 6, wherein:

said reflectance measurement means comprises i) a light source for providing an incident light beam incident upon an underside of said window and transmitted therethrough at a prescribed incident angle, ii) a first detector for detecting an amount of incident light provided by said light source, said first detector providing a first signal representative of the amount of incident light, iii) a second detector for detecting an amount of a reflected light reflected back through said window, said second detector providing a second signal representative of the amount of reflected light, and iv) means responsive to said first and second signals, respectively, for providing the reflectance signal, the reflectance signal corresponding to a ratio of the reflected light to the incident light.

9. The apparatus of claim 8, further wherein:

i) said light source comprises a laser, the laser providing a well-collimated incident light beam incident upon the underside of said window along an incident light beam path,

ii) said first detector comprises a beam splitter and a photodiode, wherein the beam splitter is arranged in the path of the incident light beam for reflecting a portion of the light beam to the photodiode and transmitting a remainder portion of the incident light beam therethrough along the incident light beam path to the underside of said window, and

iii) said second detector comprises a photodiode.

10. The apparatus of claim 9, still further wherein:

the laser is positioned distant from the rotating table, said light source further comprises an optical means for guiding and directing the incident light beam to be incident upon the underside of said window along the incident light beam path.

11. The apparatus of claim 6, further wherein:

said detection means further comprises means responsive the output signal for controlling the polishing process.

12. The apparatus of claim 11, wherein:

said window further being embedded within the table wherein a top surface of said window is substantially flush with a top surface of the table.

13. The apparatus of claim 11, wherein:

said reflectance measurement means comprises i) a light source for providing an incident light beam incident upon an underside of said window and transmitted therethrough at a prescribed incident angle, ii) a first detector for detecting an amount of incident light provided by said light source, said first detector providing a first signal representative of the amount of incident light, iii) a second detector for detecting an amount of a reflected light reflected back through said window, said second detector providing a second signal representative of the amount of reflected light, and iv) means responsive to said first and second signals, respectively, for providing the reflectance signal, the reflectance signal corresponding to a ratio of the reflected light to the incident light.

14. The apparatus of claim 13, further wherein:

i) said light source comprises a laser, the laser providing a well-collimated incident light beam incident upon the underside of said window along an incident light beam path,

ii) said first detector comprises a beam splitter and a photodiode, wherein the beam splitter is arranged in the path of the incident light beam for reflecting a portion of the light beam to the photodiode and transmitting a remainder portion of the incident light beam therethrough along the incident light beam path to the underside of said window, and

iii) said second detector comprises a photodiode.

15. The apparatus of claim 14, still further wherein:

the laser is positioned distant from the rotating table, said light source further comprises an optical means for guiding and directing the incident light beam to be incident upon the underside of said window along the incident light beam path.

16. The apparatus of claim 11, still further wherein:

said detection means detects a polishing endpoint corresponding to the prescribed change in the in-situ reflectance, and further wherein said detection means controls the polishing process for terminating the polishing of the workpiece in response to the detection of the polishing endpoint.

17. The apparatus of claim 11, still further wherein:

said detection means detects a polishing non-uniformity corresponding to the prescribed change in the in-situ reflectance, and further wherein said detection means controls the polishing process for terminating the polishing of the workpiece in response to the detection of the polishing non-uniformity.

18. An in-situ chemical-mechanical polishing process monitor method for monitoring a polishing process during polishing of a workpiece in a polishing machine, the polishing machine having a rotatable polishing table provided with a polishing slurry, said method comprising the steps of:

a) providing a window embedded within the polishing table, the window traversing a viewing path during polishing and further enabling in-situ viewing of a polishing surface of the workpiece from an underside of the polishing table during polishing as the window traverses a detection region along the viewing path; and

b) providing a means coupled to the window on the underside of the polishing table for measuring a reflectance, the reflectance measurement means providing a reflectance signal representative of an in-situ reflectance, wherein a prescribed change in the in-situ reflectance corresponds to a prescribed condition of the polishing process.

19. The method of claim 18, wherein:

providing the window further comprises being embedded within the table wherein a top surface of the window is substantially flush with a top surface of the table.

20. The method of claim 18, wherein:

providing the reflectance measurement means comprises providing;

i) a light source for providing an incident light beam incident upon an underside of the window and transmitted therethrough at a prescribed incident angle, ii) a first detector for detecting an amount of incident light provided by the light source, the first detector providing a first signal representative of the amount of incident light, iii) a second detector for detecting an amount of a reflected light reflected back through the window, the second detector providing a second signal representative of the amount of reflected light, and iv) means responsive to the first and second signals, respectively, for providing the reflectance signal, the reflectance signal corresponding to a ratio of the reflected light to the incident light.

21. The method of claim 20, further wherein:

i) the light source comprises a laser, the laser providing a well-collimated incident light beam incident upon the underside of the window along an incident light beam path,

ii) the first detector comprises a beam splitter and a photodiode, wherein the beam splitter is arranged in the path of the incident light beam for reflecting a portion of the light beam to the photodiode and transmitting a remainder portion of the incident light beam therethrough along the incident light beam path to the underside of the window, and

iii) the second detector comprises a photodiode.

22. The method of claim 21, still further wherein:

the laser is positioned distant from the rotating table and the light source further comprises an optical means for guiding and directing the incident light beam to be incident upon the underside of the window along the incident light beam path.

23. The method of claim 18, further comprising:

c) providing a means responsive to reflectance signal for detecting the prescribed change in the in-situ reflectance in real-time, the detection means providing an output signal indicative of the detection of the prescribed change in the in-situ reflectance.

24. The method of claim 23, wherein:

providing the window further comprises being embedded within the table wherein a top surface of said window is substantially flush with a top surface of the table.

25. The method of claim 23, wherein:

providing the reflectance measurement means comprises providing;

i) a light source for providing an incident light beam incident upon an underside of the window and transmitted therethrough at a prescribed incident angle, ii) a first detector for detecting an amount of incident light provided by the light source, the first detector providing a first signal representative of the amount of incident light, iii) a second detector for detecting an amount of a reflected light reflected back through the window, the second detector providing a second signal representative of the amount of reflected light, and iv) means responsive to the first and second signals, respectively, for providing the reflectance signal, the reflectance signal corresponding to a ratio of the reflected light to the incident light.

26. The method of claim 25, further wherein:

i) the light source comprises a laser, the laser providing a well-collimated incident light beam incident upon the underside of the window along an incident light beam path,

ii) the first detector comprises a beam splitter and a photodiode, wherein the beam splitter is arranged in the path of the incident light beam for reflecting a portion of the light beam to the photodiode and transmitting a remainder portion of the incident light beam therethrough along the incident light beam path to the underside of the window, and

iii) the second detector comprises a photodiode.

27. The method of claim 26, still further wherein:

the laser is positioned distant from the rotating table, the light source further comprises an optical means for guiding and directing the incident light beam to be incident upon the underside of the window along the incident light beam path.

28. The method of claim 23, further wherein:

the detection means further comprises means responsive the output signal for controlling the polishing process.

29. The method of claim 28, wherein:

providing the window further comprises being embedded within the table wherein a top surface of the window is substantially flush with a top surface of the table.

30. The method of claim 28, wherein:

providing the reflectance measurement means comprises providing;

i) a light source for providing an incident light beam incident upon an underside of the window and transmitted therethrough at a prescribed incident angle, ii) a first detector for detecting an amount of incident light provided by the light source, the first detector providing a first signal representative of the amount of incident light, iii) a second detector for detecting an amount of a reflected light reflected back through the window, the second detector providing a second signal representative of the amount of reflected light, and iv) means responsive to the first and second signals, respectively, for providing the reflectance signal, the reflectance signal corresponding to a ratio of the reflected light to the incident light.

31. The method of claim 30, further wherein:

i) the light source comprises a laser, the laser providing a well-collimated incident light beam incident upon the underside of the window along an incident light beam path,

ii) the first detector comprises a beam splitter and a photodiode, wherein the beam splitter is arranged in the path of the incident light beam for reflecting a portion of the light beam to the photodiode and transmitting a remainder portion of the incident light beam therethrough along the incident light beam path to the underside of the window, and

iii) the second detector comprises a photodiode.

32. The method of claim 31, still further wherein:

the laser is positioned distant from the rotating table, the light source further comprises a optical means for guiding and directing the incident light beam to be incident upon the underside of the window along the incident light beam path.

33. The method of claim 28, still further wherein:

the detection means detects a polishing endpoint corresponding to the prescribed change in the in-situ reflectance, and further wherein the detection means controls the polishing process for terminating the polishing of the workpiece in response to the detection of the polishing endpoint.

34. The method of claim 28, still further wherein:

the detection means detects a polishing non-uniformity corresponding to the prescribed change in the in-situ reflectance, and further wherein the detection means controls the polishing process for terminating the polishing of the workpiece in response to the detection of the polishing non-uniformity.

35. A polishing machine having in-situ polishing process monitor control of a polishing process during polishing of a workpiece on a rotatable polishing table provided with a polishing slurry, said polishing machine comprising:

a) a window embedded within the polishing table, said window traversing a viewing path during polishing and further enabling in-situ viewing of a polishing surface of the workpiece from an underside of the polishing table during polishing as said window traverses a detection region along the viewing path;

b) means coupled to said window on the underside of the polishing table for measuring a reflectance, said reflectance measurement means providing a reflectance signal representative of an in-situ reflectance, wherein a prescribed change in the in-situ reflectance corresponds to a prescribed condition of the polishing process.

36. The polishing machine of claim 35, wherein:

said window further being embedded within the table wherein a top surface of said window is substantially flush with a top surface of the table.

37. The polishing machine of claim 35, wherein:

said reflectance measurement means comprises i) a light source for providing an incident light beam incident upon an underside of said window and transmitted therethrough at a prescribed incident angle, ii) a first detector for detecting an amount of incident light provided by said light source, said first detector providing a first signal representative of the amount of incident light, iii) a second detector for detecting an amount of a reflected light reflected back through said window, said second detector providing a second signal representative of the amount of reflected light, and iv) means responsive to said first and second signals, respectively, for providing the reflectance signal, the reflectance signal corresponding to a ratio of the reflected light to the incident light.

38. The apparatus of claim 37, further wherein:

i) said light source comprises a laser, the laser providing a well-collimated incident light beam incident upon the underside of said window along an incident light beam path,

ii) said first detector comprises a beam splitter and a photodiode, wherein the beam splitter is arranged in the path of the incident light beam for reflecting a portion of the light beam to the photodiode and transmitting a remainder portion of the incident light beam therethrough along the incident light beam path to the underside of said window, and

iii) said second detector comprises a photodiode.

39. The apparatus of claim 38, still further wherein:

the laser is positioned distant from the rotating table, said light source further comprises an optical means for guiding and directing the incident light beam to be incident upon the underside of said window along the incident light beam path.

40. The polishing machine of claim 35, further comprising:

c) means responsive to the reflectance signal for detecting the prescribed change in the in-situ reflectance in real-time, said detection means providing an output signal representative of the detection of the prescribed change in the in-situ reflectance.

41. The polishing machine of claim 40, further wherein:

said window further being embedded within the table wherein a top surface of said window is substantially flush with a top surface of the table.

42. The polishing machine of claim 40, further wherein:

said reflectance measurement means comprises i) a light source for providing an incident light beam incident upon an underside of said window and transmitted therethrough at a prescribed incident angle, ii) a first detector for detecting an amount of incident light provided by said light source, said first detector providing a first signal representative of the amount of incident light, iii) a second detector for detecting an amount of a reflected light reflected back through said window, said second detector providing a second signal representative of the amount of reflected light, and iv) means responsive to said first and second signals, respectively, for providing the reflectance signal, the reflectance signal corresponding to a ratio of the reflected light to the incident light.

43. The apparatus of claim 42, further wherein:

i) said light source comprises a laser, the laser providing a well-collimated incident light beam incident upon the underside of said window along an incident light beam path,

ii) said first detector comprises a beam splitter and a photodiode, wherein the beam splitter is arranged in the path of the incident light beam for reflecting a portion of the light beam to the photodiode and transmitting a remainder portion of the incident light beam therethrough along the incident light beam path to the underside of said window, and

iii) said second detector comprises a photodiode.

44. The apparatus of claim 43, still further wherein:

the laser is positioned distant from the rotating table, said light source further comprises an optical means for guiding and directing the incident light beam to be incident upon the underside of said window along the incident light beam path.

45. The polishing machine of claim 40, further wherein:

said detection means further comprises means responsive to the output signal for controlling the polishing process.

46. The polishing machine of claim 45, still further wherein:

said window further being embedded within the table wherein a top surface of said window is substantially flush with a top surface of the table.

47. The polishing machine of claim 45, still further wherein:

said reflectance measurement means comprises i) a light source for providing an incident light beam incident upon an underside of said window and transmitted therethrough at a prescribed incident angle, ii) a first detector for detecting an amount of incident light provided by said light source, said first detector providing a first signal representative of the amount of incident light, iii) a second detector for detecting an amount of a reflected light reflected back through said window, said second detector providing a second signal representative of the amount of reflected light, and iv) means responsive to said first and second signals, respectively, for providing the reflectance signal, the reflectance signal corresponding to a ratio of the reflected light to the incident light.

48. The apparatus of claim 47, further wherein:

i) said light source comprises a laser, the laser providing a well-collimated incident light beam incident upon the underside of said window along an incident light beam path,

ii) said first detector comprises a beam splitter and a photodiode, wherein the beam splitter is arranged in the path of the incident light beam for reflecting a portion of the light beam to the photodiode and transmitting a remainder portion of the incident light beam therethrough along the incident light beam path to the underside of said window, and

iii) said second detector comprises a photodiode.

49. The apparatus of claim 48, still further wherein:

the laser is positioned distant from the rotating table, said light source further comprises an optical means for guiding and directing the incident light beam to be incident upon the underside of said window along the incident light beam path.

50. The polishing machine of claim 45, still further wherein:

said detection means detects a polishing endpoint corresponding to the prescribed change in the in-situ reflectance, and further wherein said detection means controls the polishing process for terminating the polishing of the workpiece in response to the detection of the polishing endpoint.

51. The polishing machine of claim 45, still further wherein:

said detection means detects a polishing non-uniformity corresponding to the prescribed change in the in-situ reflectance, and further wherein said detection means controls the polishing process for terminating the polishing of the workpiece in response to the detection of the polishing non-uniformity.