Method of making circuit boards

• US 5,433,819 A
• Filed: 05/26/1993
• Issued: 07/18/1995
• Est. Priority Date: 05/26/1993
• Status: Expired due to Fees

• Current Assignee: Pressac PLC
• Original Assignee: Pressac PLC
• Inventors: McMeen, Mark T.
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/067,732
• Time in Patent Office: 783 Days
• Field of Search: 156/630, 156/632, 156/634, 156/645, 156/656, 156/659.1, 156/666, 156/901, 156/902, 174/250, 428/901, 29/846, 29/852, 427/97
• US Class Current: 216/20
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer etched tri-metal structure H05K2201/0361
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/0394 Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/0397 Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2203/0361 Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 2203/0723 Electroplating, e.g. finish plating
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/061 Etching masks
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/384 by plating
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4084 : by deforming at least one of the conductive layers

Abstract

A method of making circuit boards is disclosed that is suitable for use in a high-volume automated processing plant. The method can be used to produce either single-sided or double-sided circuit boards with access windows allowing electrical access and connection between traces from both sides. In the process, access holes are punched in a coverfilm. A copper sheet having a tin plating on one side is laminated to the coverfilm, with the tin side facing the coverfilm. A pattern representing a circuit is screened on the resulting laminate with a UV-curable resist, developed in a UV dryer, and then the unprotected copper is etched away. The remaining tin is then removed with solder stripping agent, and the resulting circuit is protected with a coverfilm. The process can be applied to large rolls of materials in an automated process, with large numbers of circuits applied to the laminated board. The circuits can then be punched out of the web with a hydraulic press in large numbers. The use of two copper sheets and double-sided covering (i.e., having adhesive on both sides) in a slightly modified process permits the efficient manufacture of double-sided circuit boards.

Claims

1. A method for making a laminated circuit board having at least one access hole through which electrical contact to conductive traces may be made, comprising the steps of:

(a) punching at least one access hole in a first coverfilm;

(b) applying an adhesive system to a side of the first coverfilm;

(c) laminating a copper sheet having a tin coating on one side to the adhesive-coated side of the first coverfilm, wherein the tin coated side of the copper sheet and the adhesive-coated side of the first coverfilm adhere to one another, thereby forming a laminate having a copper side and a first coverfilm side;

(d) applying a protective coating over the copper side of the laminate in a pattern corresponding to a circuit, thereby leaving copper to be removed from the laminate exposed;

(e) removing the exposed copper, thereby exposing the tin coating under the removed copper, and wherein the protected copper remains adhered to the first coverfilm; and

(f) stripping the exposed tin coating.

2. The method of claim 1 further comprising an additional step of applying a protective coating over at least the remaining adhered copper.

3. The method of claim 2, wherein the first coverfilm has a thickness of between about 0.001 inch and about 0.005 inch.

4. The method of claim 2, wherein the first coverfilm comprises polyester and the adhesive system comprises a polyester-based adhesive.

5. The method of claim 2, wherein the first coverfilm comprises polyimid and the adhesive system comprises an acrylic-based adhesive.

6. The method of claim 2, wherein the adhesive system comprises an epoxy adhesive.

7. The method of claim 2, wherein the copper sheet is a sheet of between about 0.5 and about 5 ounces.

8. The method of claim 2, wherein the tin coating is between about 0.00005 inch and about 0.00150 inch thick.

9. The method of claim 8, wherein the tin coating is an electroplated coating.

10. The method of claim 2, wherein the laminating is performed with a hot roll nip laminator.

11. The method of claim 2, wherein the positive image applied by silkscreening a photoresistant, ultraviolet-curable resist onto the copper sheet.

12. The method of claim 11, wherein the resist is cured in a UV dryer.

13. The method of claim 2, wherein a positive image of the circuit is applied by applying a uniform layer of photoresistant material onto the copper sheet and exposing a portion of the uniform layer of photoresistant material to a light energy source having a wavelength selected to develop the photoresistant material, wherein the portion of the uniform layer is selected to cause the positive image of the circuit to remain after the photoresistant material is developed;

and

the photoresistant material is developed to cause the positive image to remain, thereby protecting the portions of the copper sheet where the positive image remains from removal.

14. The method of claim 2 wherein the exposed copper is removed by etching with an ammoniacal etchant.

15. The method of claim 2 wherein the protective coating is adapted to provide at least one access window to provide electrical access to at least a portion of the remaining adhered copper through the at least one access window.

16. The method of claim 15 wherein one of the at least one access windows at least partially overlaps one of the at least one access holes.

17. A method for making a double-sided circuit board having top side access comprising the steps of:

(a) punching at least one access hole in a first coverfilm;

(b) applying an adhesive system to a first and a second side of the coverfilm;

(c) laminating a first copper sheet having a tin coating on one side to the first side of the coverfilm, the tin coating facing the first side of the coverfilm;

(d) laminating a second copper sheet to the second side of the coverfilm;

(e) applying a first protective coating over the first copper side of the resulting laminate in a first pattern corresponding to a first portion of a circuit, thereby dividing the surface into at least a first region of protected copper and at least a first region of exposed copper, wherein the at least a first region of exposed copper is to be removed;

(f) applying a second protective coating over the second copper side of the laminate in a second pattern corresponding to a second portion of a circuit, thereby dividing the surface into at least a second region of protected copper and at least a second region of exposed copper, wherein the at least a second region of exposed copper is to be removed;

(g) removing the at least a first region and the at least a second region of exposed copper, thereby exposing the tin coating under the first copper sheet where the at least a first region was removed, and leaving the at least a first region and the at least a second region of protected copper adhered to the laminate; and

(h) stripping the exposed tin coating.

18. The method of claim 17 and further comprising an additional step of applying a protective coating over each of the first and second regions of adhered protected copper.

19. The method of claim 17 wherein the first coverfilm comprises a material selected from the group consisting of polyester and polyimid.

20. The method of claim 17 wherein the first coverfilm has a thickness of between about 0.001 inch and about 0.005 inch.

21. The method of claim 17 wherein the first coverfilm comprises polyester and the adhesive system comprises a polyester-based adhesive.

22. The method of claim 17 wherein the first coverfilm comprises polyimid and the adhesive system comprises an acrylic-based adhesive.

23. The method of claim 17 wherein the adhesive system comprises an epoxy adhesive.

24. The method of claim 17, wherein the first and second copper sheets are between about 0.5 and about 5 ounces.

25. The method of claim 17, wherein the tin coating is between about 0.00005 and 0.0015 inch thick.

26. The method of claim 25, wherein the tin coating is an electroplated coating.

27. The method of claim 17, wherein the laminating is performed with a hot roll nip laminator.

28. The method of claim 17 wherein the first and second positive images are applied by silkscreening a photoresistant, ultraviolet-curable resist onto the first and second copper sheets.

29. The method of claims 28, wherein the resist is cured in a UV dryer.

30. The method of claim 17, wherein positive images corresponding to the first and the second patterns are applied by applying respective first and second uniform layers of photoresistant material onto the first and second copper sheets and exposing portions of the first and second uniform layers to a light energy source having a wavelength selected to develop the photoresistant material, wherein the portions are selected to cause the positive images to remain after the photoresistant material is developed, and

the photoresistant material is developed to cause the positive images to remain, thereby forming the first and the second protective coatings.