Attachment of nozzle plate to flexible circuit for facilitating assembly of printhead

• US 5,434,607 A
• Filed: 05/14/1993
• Issued: 07/18/1995
• Est. Priority Date: 04/02/1992
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Keefe, Brian J.
• Primary Examiner(s): Fuller, Benjamin R.
• Assistant Examiner(s): Barlow, Jr., John E.
• Application Number:
  US08/062,976
• Time in Patent Office: 795 Days
• Field of Search: 347/13, 347/50, 347/67, 347/87, 347/47, 439/67, 439/77, 439/83, 439/329
• US Class Current: 347/50
• CPC Class Codes: B41J 2/04543 Block driving
• CPC Class Codes: B41J 2/04546 Multiplexing
• CPC Class Codes: B41J 2/0458 controlling heads based on heating elements forming bubbles
• CPC Class Codes: B41J 2/14024 Assembling head parts
• CPC Class Codes: B41J 2/1404 Geometrical characteristics
• CPC Class Codes: B41J 2/14072 Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
• CPC Class Codes: B41J 2/14129 Layer structure
• CPC Class Codes: B41J 2/1433 Structure of nozzle plates
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1634 laser machining
• CPC Class Codes: B41J 2/1643 thin film formation by plating

Abstract

In a printhead assembly, a nozzle plate is bonded directly to special traces formed on a flexible tape automated bonding (TAB) circuit, using a commercially available automatic lead bonder, to retain the nozzle plate in place on the TAB circuit. The TAB circuit is handled in a reel-to-reel film format which is commonly used for electronic chip packaging. In a next step of the reel-to-reel process, an automatic bonder manipulates individual substrates, aligns each substrate to an associated nozzle plate, and bonds electrodes on the substrate to corresponding leads formed on the TAB circuit. In the process of the automated bonder aligning the substrate to the nozzle plate, the substrate is automatically aligned with respect to the leads on the TAB circuit. Commercially available automatic bonding equipment can be used to perform the alignment and bonding steps.

Claims

1. A method for forming an inkjet printhead assembly comprising the steps of:

providing a flexible insulating tape having a first set of conductive traces formed thereon, for conducting energization signals, and having securing traces formed thereon, portions of said first set of conductive traces and portions of said securing traces located proximate to an opening formed in said flexible insulating tape;

positioning a nozzle plate, having nozzles formed therein, within said opening;

bonding said portions of said securing traces to said nozzle plate;

aligning a substrate with said nozzle plate, said substrate having a plurality of ink ejection means formed thereon, each ink ejection means being paired with an associated one of said nozzles formed in said nozzle plate; and

bonding said portions of said first set of conductive traces to associated electrodes formed on said substrate.

2. The method of claim 1 wherein said securing traces comprise a second set of conductive traces formed on said flexible insulating tape during a same process used to form said first set of conductive traces.

3. The method of claim 1 further comprising the step of adhesively securing said nozzle plate to said substrate to physically bond together opposing surfaces of said substrate and said nozzle plate.

4. The method of claim 1 wherein said steps of positioning said nozzle plate within said opening and bonding said portions of said securing traces to said nozzle plate are performed by an automated bonder which optically aligns a target pattern on said nozzle plate to a target pattern on said tape and, after aligning, bonds said portions of said securing traces to said nozzle plate.

5. The method of claim 1 wherein said steps of aligning said substrate with said nozzle plate and bonding said portions of said first set of conductive traces to associated electrodes formed on said substrate are performed by an automated bonder which optically aligns a target pattern on said nozzle plate to a target pattern on said substrate and, after aligning, bonds said portions of said first set of conductive traces to said associated electrodes on said substrate.

6. The method of claim 1 wherein said nozzle plate is a metal nozzle plate and said securing traces are metal conductors.

7. The method of claim 1 wherein said ink ejection means comprise thin film resistors.

8. The method of claim 1 wherein said substrate is substantially rectangular and said nozzle plate overhangs two or more edges of said substrate, and wherein said substrate electrodes are exposed through said opening after said step of aligning said substrate with said nozzle plate.

9. The method of claim 1 wherein said method is conducted in a step-and-repeat process where said flexible insulating tape is provided on a reel, and a plurality of printhead assemblies are formed on a continuous strip of said flexible insulating tape prior to segmenting said tape into individual printhead assembly portions.

10. A printing structure comprising:

a strip of flexible insulating tape having a first set of conductive traces formed thereon for conducting energization signals and having securing traces formed thereon, portions of said first set of conductive traces and portions of said securing traces located proximate to an opening formed in said tape;

a nozzle plate, formed of a different material than said tape, being secured to said portions of said securing traces; and

a substrate being aligned with and secured to said nozzle plate, said substrate having ink ejection means formed thereon, each ink ejection means being paired with a nozzle formed in said nozzle plate, said substrate having electrodes formed thereon bonded to said portions of said first set of conductive traces.

11. The structure of claim 10 wherein said securing traces are formed of a conductive material and are formed along with said first set of conductive traces on said tape.

12. The structure of claim 10 wherein said nozzle plate is secured to said tape by said securing traces prior to said substrate being secured to said nozzle plate.

13. The structure of claim 10 further comprising a print cartridge body secured to said tape, said print cartridge body providing an ink supply to said ink ejection means.

14. The structure of claim 10 wherein said ink ejection means are thin film resistors.

15. The structure of claim 10 wherein said nozzle plate is formed of a metal and said securing traces are metal conductors.

16. The structure of claim 10 wherein said substrate is substantially rectangular and said nozzle plate overhangs two or more edges of said substrate, said nozzle plate not overlying said electrodes formed on said substrate.

17. A method for forming an inkjet printhead assembly comprising the steps of:

providing a flexible insulating tape having a set of conductive traces formed thereon, for conducting energization signals, said tape having an opening;

positioning a nozzle plate, having nozzles formed therein, within said tape opening;

bonding said nozzle plate to said tape proximate to said tape opening;

aligning a substrate with said nozzle plate, said substrate having a plurality of ink ejection means formed thereon, each ink ejection means being paired with an associated one of said nozzles formed in said nozzle plate; and

bonding portions of said set of conductive traces to associated electrodes formed on said substrate.

18. The method of claim 17 further comprising, after the aligning step, the step of adhesively securing said nozzle plate to said substrate to physically bond together opposing surfaces of said substrate and said nozzle plate.

19. The method of claim 17 wherein said substrate is substantially rectangular and said nozzle plate overhangs two or more edges of said substrate, and wherein said substrate electrodes are exposed through said opening after said step of aligning said substrate with said nozzle plate.

20. A printing structure comprising:

a strip of flexible insulating tape having an opening and a set of conductive traces formed on the tape for conducting energization signals, portions of said set of conductive traces located proximate to the tape opening;

a nozzle plate, formed of a different material than said tape, within said tape opening and being secured to portions of the tape surrounding the tape opening; and

a substrate being aligned with and secured to said nozzle plate, said substrate having ink ejection means formed thereon, each ink ejection means being paired with a nozzle formed in said nozzle plate, said substrate having electrodes formed thereon bonded to said portions of said set of conductive traces.

21. The structure of claim 20 further comprising a print cartridge body secured to said tape, said print cartridge body providing an ink supply to said ink ejection means.

22. The structure of claim 20 wherein said substrate is substantially rectangular and said nozzle plate overhangs two or more edges of said substrate, said nozzle plate not overlying said electrodes formed on said substrate.