Reworkable high density interconnect structure incorporating a release layer

• US 5,434,751 A
• Filed: 04/11/1994
• Issued: 07/18/1995
• Est. Priority Date: 04/11/1994
• Status: Expired due to Term

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Martin Marietta Corporation
• Inventors: Lupinski, John H., Wojnarowski, Robert J., Cole, Herbert S. Jr., Sitnik-Nieters, Theresa A.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): SPARKS, DONALD ALAN
• Application Number:
  US08/225,876
• Time in Patent Office: 463 Days
• Field of Search: 25/846, 25/623.3, 156/289, 156/239, 156/230, 174/250, 174/255, 174/256, 174/258, 174/259, 174/260, 257/684, 257/700, 257/723, 257/724, 361/792, 361/795, 439/68, 439/44, 439/47, 428/40, 428/352, 428/901, 428/202
• US Class Current: 361/792
• CPC Class Codes: H01L 21/485 Adaptation of interconnections, e.g. engineering charges, repair techniques
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01018 Argon [Ar]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H05K 1/0286 : Programmable, customizable or modifiable circuits by programmable non-printed jumper connections H05K3/222
• CPC Class Codes: H05K 3/4676 : Single layer compositions
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer bonding the two portions together and allowing for easy removal of the HDI structure from the substrate of the module by immersion in an appropriate solvent for the release layer.

Claims

1. An electronics module, incorporating a high density interconnect structure, comprising:

a first portion having a substrate with a plurality of electronic component chips, each of said plurality of chips having contact pads disposed thereon;

a second portion comprising at least one stratum of said high density interconnect structure with a conductive segment which is electrically connected to at least some of said contact pads disposed on said plurality of chips; and

a release layer of a solvent-soluble material which bonds together said first portion and said second portion and allows separation of said first portion and said second portion responsive to immersion of said release layer in a solvent which dissolves the material of said release layer.

2. The electronics module according to claim 1, wherein said first portion includes at least one stratum of said high density interconnect structure with another conductive segment which is electrically connected to a selected set of said contact pads.

3. The electronics module according to claim 2, wherein said release layer is fabricated from a material selected from the group consisting of polyesters, polyimides, polysulfones, and acrylates.

4. The electronics module according to claim 2, wherein said dielectric layer in said second stratum comprises:

an upper sublayer; and

a lower sublayer of a high T_g material.

5. The electronics module according to claim 4, wherein said lower sublayer of said second stratum is a free standing, B-staged, hot melt adhesive comprising a mixture of a polyimide and an epoxy.

6. The electronics module according to claim 1, wherein said release layer is fabricated from a material selected from the group consisting of polyesters, polyimides, polysulfones, and acrylates.

7. The electronics module according to claim 1, wherein the fabrication and rework process is carried out at temperatures not exceeding 200°

C.

8. In combination, at least one electronics module according to claim 1, and at least one other module;

each of said at least one module and said at least one other module having a selected surface bounded by an edge;

each pair of said modules positioned with said selected surfaces thereof substantially parallel to one another and with said edges in alignment; and

another solvent-soluble release layer located between said selected surfaces of each adjacent pair of modules for bonding together said pair of modules, and allowing separation of the modules from one another responsive to immersion of said another release layer in a solvent which (a) dissolves the material of said another release layer, and (b) does not dissolve said solvent-soluble release layer.

9. The combination of claim 8, wherein all modules of the combination include said first and second portion and said release layer therebetween.

10. The combination according to claim 9, wherein said another release layer is different from said solvent-soluble release layer and both are fabricated from a material selected from the group consisting of polyesters, polyimides, polysulfones, and acrylates.

11. An electronics assembly comprising:

a plurality of electronics modules according to claim 1, each having a selected surface bounded by an edge, each pair of said modules positioned with said selected surfaces thereof substantially parallel to one another and with said edges in alignment; and

another layer of the material of said solvent-soluble release layer located between said selected surfaces of each adjacent pair of modules for bonding said plurality of modules together, and allowing separation of each of said modules from one another, responsive to immersion of said another layer in a solvent which dissolves the material of said another layer.

16. A electronics module according to claim 1 bonded to a base with another solvent soluble release layer, in conjunction with an epoxy.

17. The electronics module according to claim 16, wherein said another release layer is different from said solvent-soluble release layer and both are fabricated from a material selected from the group consisting of polyesters, polyimides, polysulfones, and acrylates.

12. An electronics assembly, comprising:

a first portion having a plurality of multichip modules, each module having

at least one integrated circuit thereon in electrical contact with at least some of a plurality of edge contact pads disposed at an edge of each of said plurality of modules;

a high density interconnect structure;

a selected surface bounded by said edge, each of said modules positioned with said selected surface substantially parallel to one another and with said edges in alignment;

a release layer located between said selected surfaces of each adjacent pair of modules for bonding together said plurality of modules, and allowing separation each of said plurality of modules responsive to immersion of said release layer in a solvent which dissolves the material of said release layer;

a second portion comprising at least one side stratum of a side high density interconnect structure disposed on at least one side of said first portion, where said side high density interconnect structure has at least one conductive segment which is electrically connected to at least some of said edge contact pads disposed on said modules; and

another release layer of a solvent-soluble material which bonds together said first portion and said second portion and allows separation of said first portion and said second portion responsive to immersion of said another release layer in a solvent which dissolves the material of said another release layer.

13. The stack of assembled electronics modules according to claim 12, wherein both of said release layer and said another release layer are fabricated from a material selected from the group consisting of polyesters, polyimides, polysulfones, and acrylates.

14. The stack of assembled electronics modules according to claim 12, wherein said solvent-soluble release layer and said another solvent-soluble release layer are substantially identical.

15. The stack of assembled electronics modules according to claim 12, wherein said solvent-soluble release layer and said another solvent-soluble release layer are substantially different.