Temperature measurement using ion implanted wafers

• US 5,435,646 A
• Filed: 11/09/1993
• Issued: 07/25/1995
• Est. Priority Date: 11/09/1993
• Status: Expired due to Fees

• Current Assignee: Hughes Aircraft Company (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Session, Fred C., McArthur, Warren F.
• Primary Examiner(s): GUTIERREZ, DIEGO F
• Application Number:
  US08/149,600
• Time in Patent Office: 623 Days
• Field of Search: 374/178, 374/185, 374/1, 374/183, 257/467, 338/22 SD, 338/25
• US Class Current: 374/185
• CPC Class Codes: G01K 7/22 the element being a non-linear resistance, e.g. thermistor G01K7/26 takes precedence

Abstract

The value of an unknown test temperature is measured by heating a test wafer (58) to the unknown temperature, measuring the surface electrical resistivity of the test wafer (58), and determining the value of the unknown temperature from the measured surface electrical resistivity. The test wafer (58) is prepared by providing an initial wafer (50), first ion implanting the initial wafer (50) with a first dose of an ionic species, and annealing the ion implanted initial wafer (50) at an annealing temperature. The preparation is completed by second ion implanting the annealed wafer with a second dose of the same ionic species as used in the first dose to form a test wafer, the second dose being lower than the first dose.

Claims

1. A method for measuring the value of an unknown temperature, comprising the steps of:

providing an initial wafer;

first ion implanting the initial wafer with a first dose of an ionic species;

annealing the ion implanted initial wafer at an annealing temperature;

second ion implanting the annealed wafer with a second dose of the same ionic species as used in the first dose to form a test wafer, the second dose being lower than the first dose;

heating the wafer to the unknown temperature;

discontinuing the step of heating;

measuring the surface electrical resistivity of the test wafer after the step of discontinuing; and

determining the value of the unknown temperature from the measured surface electrical resistivity.

2. The method of claim 1, wherein the initial wafer is doped with a first type dopant, and the ionic species is of an opposite type dopant.

3. The method of claim 1, wherein the step of first ion implanting includes the step of first implanting at a first energy and the step of second ion implanting includes the step of second implanting at a second energy, wherein the second energy is less than the first energy.

4. The method of claim 1, wherein the second dose is at least about two orders of magnitude smaller than the first dose.

5. The method of claim 1, wherein the ionic species is a p-type dopant.

6. The method of claim 1, wherein the ionic species is an n-type dopant.

7. The method of claim 1, wherein the step of determining the value of the unknown temperature includes the steps of

preparing a series of wafers identical to the test wafer,

heating the series of wafers to a series of known temperatures,

measuring the surface electrical resistivities of the series of wafers, and

forming a calibration relation between the surface electrical resistivities of the series of wafers and their respective known temperatures.

8. The method of claim 1, wherein the step of determining the value of the unknown temperature includes the step of

finding the value of the unknown temperature from the measured surface electrical resistivity of the test wafer and a calibration relation.

9. The method of claim 1, wherein the test wafer has a microelectronic device structure therein in addition to the temperature measuring structure produced by the steps of first ion implanting, annealing, and second ion implanting.

10. A method for measuring the value of an unknown test temperature, comprising the steps of:

providing a doped test wafer having a short-range, unstable defect structure therein;

heating the test wafer to the unknown temperature;

discontinuing the step of heating;

measuring the surface electrical resistivity of the test wafer after the step of discontinuing; and

determining the value of the unknown temperature from the measured surface electrical resistivity.

11. The method of claim 10, wherein the step of providing a doped test wafer includes the steps of

providing an initial wafer,

first doping the initial wafer with a first dose of a first ionic species,

annealing the first doped initial wafer, and

second doping the annealed wafer by ion implanting the annealed wafer with a second dose of a second ionic species, the second dose being lower than the first dose.

12. The method of claim 11, wherein the first ionic species and the second ionic species are the same ionic species.

13. The method of claim 12, wherein the step of first doping includes the step of first implanting at a first energy and the step of second doping includes the step of second implanting at a second energy, wherein the second energy is less than the first energy.

14. The method of claim 12, wherein the second dose is at least about two orders of magnitude smaller than the first dose.

15. The method of claim 10, wherein the step of providing a doped test wafer includes the steps of

providing an initial wafer of a bulk-doped semiconductor material;

first ion implanting the initial wafer with a first dose of an ionic species of a dopant type opposite to that of the doped semiconductor material;

annealing the ion implanted initial wafer at an annealing temperature, and

second ion implanting the annealed wafer with a second dose of the same ionic species as used in the first dose to form a test wafer, the second dose being lower than the first dose.

16. The method of claim 10, wherein the step of determining the value of the unknown temperature includes the steps of

preparing a series of wafers identical to the test wafer,

heating the series of wafers to a series of known temperatures,

measuring the surface electrical resistivities of the series of wafers,

forming a calibration relation between the surface electrical resistivities of the series of wafers and their respective known temperatures, and

determining the unknown temperature the measured surface electrical resistivity of the test wafer and the calibration relation.