Connector assembly for microelectronic multi-chip-module

• US 5,435,733 A
• Filed: 11/12/1993
• Issued: 07/25/1995
• Est. Priority Date: 11/12/1993
• Status: Expired due to Term

• Current Assignee: Yakisami Capital Co LLC (Intellectual Ventures LLC)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Le, Bao Q., Feigenbaum, Haim, Kovacs, Alan L., Schreiber, Christopher M., Chernicky, Gerald P.
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US08/152,342
• Time in Patent Office: 620 Days
• Field of Search: 439/67, 439/68, 439/71, 439/77, 439/66, 361/785, 361/788, 324/762
• US Class Current: 439/68
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof. The components (70, 72,74,76,78) on the module (66) can be hermetically sealed by a cover (80), and the module (66) and cable (96) can be hermetically sealed by a first resilient ring (112) which is compressed between the frame (104) and the cover (80), and a second resilient ring (114) which is compressed between the frame (104) and the motherboard (64). Alternatively, the cover (80) and the first ring (112) can be replaced by a cover (104a) which is integral with a frame (104'"'"'). An alternative connector (136) includes a flexible cable (146) which extends around an edge of a frame (144) to enable vertical stacking of MCMs (164) and/or backplanes (138) in any combination.

Claims

1. A connector assembly for electrically connecting a first contact on a microelectronic structure to a second contact on a support member, comprising:

a flexible cable including first and second spaced protrusions;

a frame for resiliently pressing the first and second protrusions into electrical connection with the first and second contacts respectively;

a first resilient sealing member sealingly compressed between the frame and the microelectronic structure; and

a second resilient sealing member sealing compressed between the frame and the support member, said first and second resilient members for hermetically sealing the first contact, the second contact and the cable.

2. A connector assembly as in claim 1, in which the first and second protrusions comprise gold dots.

3. A connector assembly as in claim 1, in which the microelectronic structure is hermetically sealed with a cover and

the first resilient sealing member is sealingly compressed between the frame and the cover.

4. A connector assembly as in claim 1, further comprising resilient means which are retained by the frame for resiliently pressing the first and second protrusions into electrical connection with the first and second contacts respectively.

5. The connector assembly as in claim 4, in which the resilient means comprise first and second elastomer blocks.

6. A connector assembly as in claim 5, in which the elastomer blocks have convex ends which resiliently press the first and second protrusions into electrical connection with the first and second contacts respectively.

7. The connector assembly as in claim 5, in which the resilient means further comprise first and second springs retained by the frame adjacent to respective first and second elastomer blocks.

8. A connector assembly as in claim 1, in which the flexible cable comprises a conductor having a controlled impedance strip-line which electrically interconnects the first and second protrusions.

9. A connector as in claim 1, in which the microelectronic structure is mounted on the support member.

10. A connector as in claim 1, in which:

the frame has first and second opposite surfaces;

the flexible cable extends around an edge of the frame such that the first protrusion extends away from said first surface and the second protrusion extends away from said second surface;

the microelectronic structure faces said first surface of the frame with the first protrusion being pressed into electrical connection with the first contact; and

the support member faces said second surface of the frame with the second protrusion being pressed into electrical connection with the second contact.

11. An electronic assembly, comprising:

a microelectronic structure including a substrate, and a microelectronic component mounted on the substrate;

a support member;

a plurality of first contacts provided on the substrate adjacent to a peripheral edge thereof for interconnection with the microelectronic component;

a plurality of second contacts provided on the support member adjacent to the first contacts respectively;

a flexible cable including a plurality of electrical interconnects for connecting first contacts to second contacts respectively, each interconnect including an elongated electrical conductor and first and second spaced protrusions;

a frame for pressing the first and second protrusions into electrical connection with the first and second contacts respectively;

a first resilient ring which is sealingly compressed between the frame and the substrate; and

a second resilient ring which is sealingly compressed between the frame and the support member, the first and second resilient rings for hermetically sealing the first contact, the second contact and the cable.

12. As assembly as in claim 11, in which the first and second protrusions comprise gold dots.

13. An assembly as in claim 11, in which:

the microelectronic structure further comprises a cover which is attached to the substrate and hermetically seals the microelectronic component; and

the first resilient ring is sealingly compressed between the frame and the cover.

14. An assembly as in claim 11, in which the frame comprises a cover which encloses the microelectronic component.

15. An assembly as in claim 11, further comprising resilient means which are retained by the frame for resiliently pressing the first and second protrusions into electrical connection with the first and second contacts respectively.

16. An assembly as in claim 15, in which the resilient means comprise first and second elastomer blocks.

17. An electronic assembly as in claim 16, in which the elastomer blocks have convex ends which resiliently press the first and second protrusions into electrical connection with the first and second contacts respectively.

18. An assembly as in claim 16, in which the resilient means further comprise first and second springs retained by the frame adjacent to respective first and second elastomer blocks.

19. An assembly as in claim 11, in which each conductor comprises a controlled impedance stripline which electrically interconnects the first and second protrusions.

20. An assembly as in claim 11, in which:

the frame has first and second opposite surfaces;

the flexible cable extends around an edge of the frame such that the first protrusions extend away from said first surface and the second protrusions extend away from said second surface;

the microelectronic structure faces said first surface of the frame with the first protrusions being pressed into electrical connection with the first contacts; and

the support member faces said second surface of the frame with the second protrusions being pressed into electrical connection with the second contacts.