Process for forming implanted regions with lowered channeling risk on semiconductors
First Claim
1. A process for forming implanted regions on semiconductor devices with lowered channelling risk, wherein the semiconductor electronic devices include at least one layer of polycrystalline silicon which covers at least two isolation regions and an active area liable to a channelling phenomena, comprising the steps of:
- depositing a masking layer on said isolation regions covered by said polycrystalline layer;
implanting a first dopant species, in any unmasked areas of the semiconductor devices, to amorphousize any unmasked polycrystalline silicon areas;
removing the masking layer; and
implanting a second dopant species over the entire polycrystalline silicon layer to form resistors over the isolation regions.
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Abstract
A process for forming implanted regions with lowered channelling risk on semiconductors, wherein the semiconductor devices include at least one layer of polycrystalline silicon which covers all isolation regions and active areas which are liable to a channelling phenomena and wherein the process includes masking the areas or regions to be implanted on the polycrystalline layer, implanting a first dopant species having a high atomic weight to amorphousize the polycrystalline silicon in any unmasked areas, removing the masking layer, and implanting a second dopant species over the entire semiconductor.
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Citations
14 Claims
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1. A process for forming implanted regions on semiconductor devices with lowered channelling risk, wherein the semiconductor electronic devices include at least one layer of polycrystalline silicon which covers at least two isolation regions and an active area liable to a channelling phenomena, comprising the steps of:
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depositing a masking layer on said isolation regions covered by said polycrystalline layer; implanting a first dopant species, in any unmasked areas of the semiconductor devices, to amorphousize any unmasked polycrystalline silicon areas; removing the masking layer; and implanting a second dopant species over the entire polycrystalline silicon layer to form resistors over the isolation regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification