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Pressure sensor for high temperature vibration intense environment

  • US 5,436,491 A
  • Filed: 10/13/1993
  • Issued: 07/25/1995
  • Est. Priority Date: 10/19/1992
  • Status: Expired due to Term
First Claim
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1. A pressure sensor comprising:

  • a body casing having an opening portion formed with an opening therethrough;

    a metal diaphragm sealed on the outer end of said opening portion of said body casing, said metal diaphragm being capable of deforming when subjected to pressure from the outside of said pressure sensor;

    a non-compressible medium sealed contacting inner surfaces of said body casing;

    a sealing member cooperating with said metal diaphragm to seal the inside of said body casing;

    a base mounted on said sealing member;

    a semiconductor pressure-sensing unit mounted on said base, said semiconductor pressure-sensing unit having a semiconductor diaphragm for receiving pressure through said non-compressible medium when said metal diaphragm deforms, and for deforming in accordance with the received pressure, said semiconductor pressure-sensing unit also having a strain gauge for outputting an electrical signal indicating such a deformation of said semiconductor diaphragm;

    wires for transmitting an electrical signal from said semiconductor pressure-sensing unit;

    leads connected with said wires for leading the electrical signal to the outside of said body casing of said sensor;

    an electrically insulating material covering said wires per se, the joints between said wires and said semiconductor pressure-sensing unit, and the joints between said wires and said leads; and

    a spacer provided between said electrically insulating material and said sealing member.

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