Pressure sensor for high temperature vibration intense environment

• US 5,436,491 A
• Filed: 10/13/1993
• Issued: 07/25/1995
• Est. Priority Date: 10/19/1992
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Hase, Yuji, Bessho, Mikio
• Primary Examiner(s): Mintel, William
• Assistant Examiner(s): TRAN, MINH LOAN
• Application Number:
  US08/135,410
• Time in Patent Office: 650 Days
• Field of Search: 257/415, 257/417, 257/419, 257/420, 257/701, 257/687, 73/777, 73/720, 73/726, 73/721, 73/727, 73/754, 73/756
• US Class Current: 257/417
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10155 being other than a cuboid

Abstract

A pressure sensor includes an electrically insulating material covering wires for transmitting an electrical signal generated by a semiconductor pressure-sensing unit, the joints between the wires and the pressure-sensing unit, and the joints between the wires and leads connected to the wires for leading the electrical signal to the outside of the body casing of the sensor. Thus, detection of pressure is possible even in an intense-vibration environment, and it is also possible to reduce influences by changes in temperature.

Claims

1. A pressure sensor comprising:

a body casing having an opening portion formed with an opening therethrough;

a metal diaphragm sealed on the outer end of said opening portion of said body casing, said metal diaphragm being capable of deforming when subjected to pressure from the outside of said pressure sensor;

a non-compressible medium sealed contacting inner surfaces of said body casing;

a sealing member cooperating with said metal diaphragm to seal the inside of said body casing;

a base mounted on said sealing member;

a semiconductor pressure-sensing unit mounted on said base, said semiconductor pressure-sensing unit having a semiconductor diaphragm for receiving pressure through said non-compressible medium when said metal diaphragm deforms, and for deforming in accordance with the received pressure, said semiconductor pressure-sensing unit also having a strain gauge for outputting an electrical signal indicating such a deformation of said semiconductor diaphragm;

wires for transmitting an electrical signal from said semiconductor pressure-sensing unit;

leads connected with said wires for leading the electrical signal to the outside of said body casing of said sensor;

an electrically insulating material covering said wires per se, the joints between said wires and said semiconductor pressure-sensing unit, and the joints between said wires and said leads; and

a spacer provided between said electrically insulating material and said sealing member.

2. The pressure sensor according to claim 1, wherein said spacer comprises insulating material.

3. The pressure sensor according to claim 1, wherein said spacer comprises an insulation material having a linear coefficient of thermal expansion substantially similar to that of the semiconductor pressure-sensing unit.

4. The pressure sensor according to claim 1, wherein said electrically insulating material mitigates pressure transients sensed by said pressure-sensing unit responsive to thermal expansion of said non-compressible medium.

5. The pressure sensor according to claim 1, wherein said strain gauge is not contacted by said electrically insulating material.

6. The pressure sensor according to claim 1, wherein said insulating material has a first coefficient of linear expansion and wherein said spacer has a second coefficient of linear expansion substantially similar to that of said pressure-sensing unit and wherein said first coefficient is different from said second coefficient of linear expansion.

7. A pressure sensor comprising:

a body casing having an opening portion formed with an opening therethrough;

a metal diaphragm sealed on the outer end of said opening portion of said body casing, said metal diaphragm being capable of deforming when subjected to pressure from the outside of said pressure sensor;

a sealing member disposed on the inner end of said opening portion of said body casing and opposed to said metal diaphragm, said sealing member having an opening therethrough;

a base disposed on said sealing member and having an opening formed therethrough;

a semiconductor pressure-sensing unit having a semiconductor diaphragm on one side thereof and a strain gauge on the other, said semiconductor pressure-sensing unit being disposed on said base with said semiconductor diaphragm opposed to said metal diaphragm;

a non-compressible medium sealed contracting inner surfaces of said body casing in a space defined by said metal diaphragm, said body casing, respective openings of said sealing member and said base, and said pressure sensing unit;

wires for transmitting an electrical signal from said semiconductor pressure-sensing unit;

leads connected with said wires for leading the electrical signal away from said sensor; and

an electrically insulating material covering said wires per se, the joints between said wires and said semiconductor pressure-sensing unit, and the joints between said wires and said leads.

8. A pressure sensor comprising:

a body casing having an opening portion formed with an opening therethrough;

a metal diaphragm sealed on the outer end of said opening portion of said body casing, said metal diaphragm being capable of deforming when subjected to pressure from the outside of said pressure sensor;

a non-compressible medium sealed contacting inner surfaces of said body casing;

a sealing member cooperating with said metal diaphragm to seal the inside of said body casing;

a base mounted on said sealing member;

a semiconductor pressure-sensing unit mounted on said base, said semiconductor pressure-sensing unit having a semiconductor diaphragm for receiving pressure through said non-compressible medium when said metal diaphragm deforms, and for deforming in accordance with the received pressure, said semiconductor pressure-sensing unit also having a strain gauge for outputting an electrical signal indicating such a deformation of said semiconductor diaphragm;

wires for transmitting an electrical signal from said semiconductor pressure-sensing unit;

leads connected with said wires for leading the electrical signal to the outside of said body casing of said sensor; and

an electrically insulating material covering said wires per se, the joints between said wires and said semiconductor pressure-sensing unit, and the joints between said wires and said leads,

wherein said electrically insulating material is provided between said sealing member and said base, and covers said base in such a manner as to include said base in the coverage of said electrically insulating material.

9. The pressure sensor according to claim 8, wherein said electrically insulating material fixedly connects said base to said sealing member.