Optical fiber-optical device coupling package and optical fiber-optical device module

• US 5,436,997 A
• Filed: 10/13/1993
• Issued: 07/25/1995
• Est. Priority Date: 10/14/1992
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Nakagawa, Gohji, Makiuchi, Masao
• Primary Examiner(s): Healy, Brian
• Application Number:
  US08/135,443
• Time in Patent Office: 650 Days
• Field of Search: 385/14, 385/15, 385/76, 385/77, 385/78, 385/88, 385/89, 385/92, 385/94
• US Class Current: 385/92
• CPC Class Codes: G02B 6/4202 for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4234 Passive alignment along the optical axis and active alignment perpendicular to the optical axis
• CPC Class Codes: G02B 6/4237 Welding
• CPC Class Codes: G02B 6/424 Mounting of the optical light guide
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4273 with heat insulation means to thermally decouple or restrain the heat from spreading
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/024 Arrangements for thermal management

Abstract

A package used to couple an optical fiber and an optical device to each other comprises a frame member open at the top and the bottom thereof for accommodating an electronic part therein, the frame member having an opening formed in a portion of a side wall thereof in or adjacent which an optical fiber and an optical device are coupled to each other, a heat sink for closing one of the opening ends of the frame member, and a lid for closing the other opening end of the frame member.

Claims

1. An optical fiber-optical device coupling package, comprising:

a frame member open at a top and a bottom thereof for accommodating an electronic part therein;

said frame member having an opening formed in a portion of a side wall thereof in which an optical fiber and an optical device are coupled to each other;

first and second lids for closing the top and the bottom of said frame member, respectively;

a plurality of heat radiating fins formed on said first lid; and

a heat insulating member disposed between said first lid and said frame member.

2. An optical fiber-optical device coupling package according to claim 1, further comprising lead terminals extending through said side wall of said frame member.

3. An optical fiber-optical device coupling package according to claim 2, wherein said frame member is made of a conductive material, and said lead terminals are electrically isolated from said frame member.

4. An optical fiber-optical device coupling package according to claim 1, further comprising lead terminals extending from said frame member to the outside through said second lid.

22. An optical fiber-optical device coupling package according to claim 1, wherein said first lid has a region for supporting the electronic part in a surface which is opposite to that of said radiating fins.

5. An optical fiber-optical device module, comprising:

a frame member open at a top and a bottom thereof for accommodating an electronic part therein;

said frame member having an opening formed in a side wall thereof;

an optical device disposed in said opening on an inner side of said frame member;

an optical fiber disposed in said opening on an outer side of said frame member and optically coupled to said optical device in said opening;

first and second lids for closing the top and the bottom of said frame member, respectively, said first lid being thermally connected to said electronic part; and

a plurality of heat radiating fins formed on said first lid.

6. An optical fiber-optical device module according to claim 5, wherein each of said optical fiber and said optical device is disposed by a plural number.

7. An optical fiber-optical device module according to claim 5, further comprising a ferule fitted in said opening and having said optical fiber mounted thereon, said optical device being secured to an end face of said ferule adjacent said opening.

8. An optical fiber-optical device module according to claim 5, further comprising a lead extending through said side wall of said frame member.

9. An optical fiber-optical device module according to claim 8, wherein said lead is connected to an electrode of the electronic part by way of a conductive member, and the electrode of the electronic part is connected to an electrode of said optical device by way of another conductive member.

10. An optical fiber-optical device module according to claim 8, wherein said lead contacts directly with an electrode of the electronic part in said frame member.

11. An optical fiber-optical device module according to claim 5, wherein the electronic part is carried on a face of said first lid while said heat radiating fins are formed on the opposite face of said first lid.

12. An optical fiber-optical device module according to claim 5, wherein the electronic part is carried on a face of said second lid adjacent said frame member and a lead is connected to the opposite face of said second lid, and a face of said first lid adjacent said frame member is thermally connected to the electronic part and said heat radiating fins are formed on the opposite face of said first lid.

13. An optical fiber-optical device module according to claim 5, further comprising a support base plate having said optical device mounted thereon, said support base plate having a wiring pattern in the form of a microstrip line formed on a surface thereof.

14. An optical fiber-optical device module according to claim 5, wherein the electronic part is disposed by a plural number in said frame member.

15. An optical fiber-optical device module according to claim 14, wherein at least one of the electronic parts accommodated in said frame member is covered with a conductive cap.

16. An optical fiber-optical device module according to claim 5, wherein the inside of said frame member is partitioned into a plurality of spaces by a partition, and the electronic part is accommodated in each of said spaces.

17. An optical fiber-optical device module according to claim 16, further comprising a lead extending through said partition.

18. An optical fiber-optical device module according to claim 5, wherein said plurality of heat radiating fins are formed in a non-uniform distribution density on said first lid.

19. An optical fiber-optical device module according to claim 5, wherein said plurality of heat radiating fins are formed on said first lid and have non-uniform surface areas.

20. An optical fiber-optical device according to claim 5, wherein an end portion of said optical fiber adjacent said opening has a face inclined with respect to an optical axis of said optical fiber, and an optical input end or an optical output end of said optical device is disposed around said optical fiber in the proximity of said inclined face of said optical fiber.

21. An optical fiber-optical device module according to claim 5, wherein an end of said optical fiber is attached to a connector fitted in said opening.

23. An optical fiber-optical device module according to claim 5, further including a heat insulating member disposed between said first lid and said frame member.

24. An optical fiber-optical device module, comprising:

a frame member open at a top and a bottom thereof for accommodating an electronic part therein;

said frame member having an opening formed in a side wall thereof;

an optical device disposed in said opening on an inner side of said frame member;

an optical fiber disposed in said opening on an outer side of said frame member and optically coupled to said optical device in said opening;

first and second lids for closing the top and the bottom of said frame member, respectively; and

a plurality of heat radiating fins formed in a non-uniform distribution density on said first lid.

25. An optical fiber-optical device module, comprising:

a frame member open at a top and a bottom thereof for accommodating an electronic part therein;

said frame member having an opening formed in a side wall thereof;

an optical device disposed in said opening on an inner side of said frame member;

an optical fiber disposed in said opening on an outer side of said frame member and optically coupled to said optical device in said opening;

first and second lids for closing the top and the bottom of said frame member, respectively; and

a plurality of heat radiating fins formed on said first lid and having non-uniform surface areas.