High curvature antenna forming process

• US 5,437,091 A
• Filed: 06/28/1993
• Issued: 08/01/1995
• Est. Priority Date: 06/28/1993
• Status: Expired due to Term

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Norman, Ronald W.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US08/082,111
• Time in Patent Office: 764 Days
• Field of Search: 29/600, 29/846
• US Class Current: 29/600
• CPC Class Codes: H01Q 9/0471 Non-planar, stepped or wedge-shaped patch
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A high curvature antenna is formed by using a multiple layer of laminate positioned between all microstrip elements and the conductive ground plane. By using multiple layers of laminate material, attached to one another with a thin bonding film, the antenna is easily configured in a high curvature manner. This structure and method of fabrication allows for the manufacture of a high curvature antenna having no wrinkles, kinks or discontinuities of any type in the ground plane, thus reducing defects when the antenna is produced.

Claims

1. A process for fabricating high curvature antenna having a small radius of curvature, comprising the steps of:

forming a microstrip component upon a first laminate layer;

attaching a second laminate layer to the first laminate layer, the second laminate layer having an electrically conductive material attached to one surface thereof, the second laminate layer attached to first laminate layer opposite the microstrip component such that the electrically conductive material is opposite the first laminate layer, thus forming a multilayer antenna structure;

attaching a radome layer to the multilayer antenna structure so as to cover the microstrip component, the radome layer attached before the multilayer antenna structure is formed into the substantially semicylindrical configuration; and

pressing the multilayer antenna structure into a mold while concurrently heating the multilayer antenna structure, the mold for forming the multilayer antenna structure into a substantially semicylindrical configuration.

2. The process of claim 1 wherein the first laminate layer has metal cladding on only one surface thereof.

3. The process of claim 2 wherein the microstrip component is formed by chemically etching the metal cladding of the first metal clad laminate layer into a predetermined pattern.

4. The process of claim 1 further comprising attaching a connector means to the electrically conductive material of the second laminate layer, the connector means electrically connected to the microstrip component for communicating signals to and from the microstrip component.

5. The process of claim 1 wherein the microstrip component is an antenna radiator.

6. The process of claim 1 further comprising the step of forming a second microstrip component upon the first laminate layer.

7. The process of claim 7 wherein the second microstrip component is a matching network.

8. A method for making a high curvature microwave antenna having a small radius of curvature, comprising the steps of:

assembling a multilayer planar antenna by attaching a plurality of microstrip antenna components to a plurality of planar laminate layers and a ground plane to the plurality of laminate layers all attached to one another by a bonding film and positioned in juxtaposition with one another, the plurality of microstrip antenna components being attached to the plurality of laminate layers on a first side thereof and the ground plane being attached to a second side, the first side and the second side opposite one another;

attaching a radome layer over the plurality of microstrip components;

heating the multilayer planar antenna; and

bending the multilayer planar antenna into a high curvature configuration by applying pressure to the multilayer planar antenna.

9. The method of claim 8 wherein pressure is applied to the multilayer planar antenna by a forming fixture, the forming fixture having a convex member and a concave member and pressure is applied by placing the multilayer antenna between the convex member and the concave member and then having the convex member and the concave member approach one another such that a convex portion of convex member is inserted into a concave portion of concave member.

10. The method of claim 9 wherein the multilayer planar antenna is inserted into the forming fixture such that the plurality of microstrip components faces the concave portion of the concave member.

11. The method of claim 8 wherein the plurality of microstrip components are attached to the plurality of laminate layers by first placing a metal cladding upon at least one layer of laminate and chemically etching the metal cladding to form the plurality of microstrip components.

12. The method of claim 8 wherein the plurality of laminate layers includes a first laminate layer and a second laminate layer.

13. The method of claim 10 wherein the high curvature antenna is formed into a substantially semicylindrical configuration having a radius of curvature less than 10 inches.

14. The method of claim 10 wherein the high curvature antenna is formed into a substantially semicylindrical configuration having a radius of curvature less than 3 inches.

15. The method of claim 8 wherein the ground plane is copper.