Memory Assembly

• US 5,440,451 A
• Filed: 12/08/1993
• Issued: 08/08/1995
• Est. Priority Date: 12/29/1992
• Status: Expired due to Fees

• Current Assignee: Casio Computer Company Limited
• Original Assignee: Casio Computer Company Limited
• Inventors: Saito, Hirokazu, Iijima, Takeshi
• Primary Examiner(s): LeDynh, Bot L.
• Application Number:
  US08/163,428
• Time in Patent Office: 608 Days
• Field of Search: 361/760-761, 361/764-765, 361/768, 361/777, 361/783-784, 361/736-737, 361/792, 174/52.2, 174/52.4, 174/260, 174/261-262, 257/690, 257/700, 257/787
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A memory assembly, comprises a wiring board having wiring patterns, the wiring patterns having a plurality of electrodes, each of the wiring patterns having a connecting terminal formed on a single main surface of the wiring board, a memory device mounted to the wiring board and having a plurality of electrodes connected to the electrodes of the wiring patterns, and an electrical insulator mounted to the main surface of the wiring board and having a shape to expose the connecting terminal to the atmosphere. The insulator insulates the wiring patterns, the electrodes of the wiring patterns and the connecting terminal from possible electrical charges on a surface of the memory assembly to protect the memory device from being electrically charged and discharged. Even if the exterior surface of the memory assembly is charged with possible static electricity, the interior of the memory assembly is protected from being electrically charged and discharged.

Claims

1. A memory assembly, comprising:

a memory device having a plurality of electrodes;

a wiring board having wiring patterns, the wiring patterns having a plurality of electrodes electrically connected to the electrodes of said memory device, each of the wiring patterns having a connecting terminal which is electrically connectable to a data processing device outside the memory assembly, the connecting terminal being formed on a single surface of said wiring board;

an insulating board mounted to said surface of said wiring board and having an opening therein which exposes the connecting terminal to the atmosphere; and

an electrically conductive board mounted to a surface of said insulating board opposite to a wiring board side surface of said insulating board, said electrically conductive board having an opening therein which exposes the connecting terminal to the atmosphere.

2. The memory assembly as recited in claim 1, further comprising:

an electrically conductive framework mounted to the peripheries of said wiring board, said insulating board and said electrically conductive board.

3. The memory assembly as recited in claim 2, wherein a surface of the memory assembly has a recess for aligning the memory assembly with a data processing device when the memory assembly is mounted to the data processing device.

4. The memory assembly as recited in claim 1, wherein a surface of the memory assembly has a recess for aligning the memory assembly with a data processing device when the memory assembly is mounted to the data processing device.

5. The memory assembly as recited in claim 1, further comprising:

a package of a resin mounted to another surface of said wiring board opposite to an insulating board side surface of said wiring board.

6. A memory assembly, comprising:

a memory device having a plurality of electrodes;

a wiring board having wiring patterns, the wiring patterns having a plurality of electrodes electrically connected to the electrodes of said memory device, each of the wiring patterns having a connecting terminal which is electrically connectable to a data processing device outside the memory assembly, the connecting terminal being formed on a single surface of said wiring board;

an insulating board mounted to said surface of said wiring board and having an opening therein which exposes the connecting terminal to the atmosphere;

an electrically conductive board mounted to a surface of said insulating board opposite to a wiring board side surface of said insulating board, said electrically conductive board having a shape exposing the connecting terminal to the atmosphere; and

an electrically conductive framework mounted to the peripheries of said wiring board, said insulating board and said electrically conductive board.

7. The memory assembly as recited in claim 6, wherein a surface of the memory assembly has a recess for aligning the memory assembly with a data processing device when the memory assembly is mounted to the data processing device.

8. A memory assembly, comprising:

a memory device having a plurality of electrodes;

a wiring board having wiring patterns, the wiring patterns having a plurality of electrodes electrically connected to the electrodes of said memory device, each of the wiring patterns having a connecting terminal which is electrically connectable to a data processing device outside the memory assembly, the connecting terminal being formed on a single surface of said wiring board;

an insulating board mounted to said surface of said wiring board and having a shape which exposes the connecting terminal to the atmosphere;

an electrically conductive board mounted to a surface of said insulating board opposite to a wiring board side surface of said insulating board, said electrically conductive board having a shape which exposes the connecting terminal to the atmosphere; and

an electrically conductive framework mounted to the peripheries of said wiring board, said insulating board and said electrically conductive board.

9. The memory assembly as recited in claim 8, wherein a surface of the memory assembly has a recess for aligning the memory assembly with a data processing device when the memory assembly is mounted to the data processing device.

10. A memory assembly, comprising:

a memory device having a plurality of electrodes;

a wiring board having wiring patterns, the wiring patterns having a plurality of electrodes electrically connected to the electrodes of said memory device, each of the wiring patterns having a connecting terminal which is electrically connectable to a data processing device outside the memory assembly, the connecting terminal being formed on a single surface of said wiring board;

an insulating board mounted to said surface of said wiring board and having an opening therein which exposes the connecting terminal to the atmosphere; and

an electrically conductive framework mounted to the peripheries of said wiring board and said insulating board.

11. The memory assembly as recited in claim 10, wherein a surface of the memory assembly has a recess for aligning the memory assembly with a data processing device when the memory assembly is mounted to the data processing device.

12. A memory assembly, comprising:

a memory device having a plurality of electrodes;

a wiring board having wiring patterns, the wiring patterns having a plurality of electrodes electrically connected to the electrodes of said memory device, each of the wiring patterns having a connecting terminal which is electrically connectable to a data processing device outside the memory assembly, the connecting terminal being formed on a single surface of said wiring board;

an insulating board mounted to said surface of said wiring board and having a shape which exposes the connecting terminal to the atmosphere; and

an electrically conductive framework mounted to the peripheries of said wiring board and said insulating board.

13. The memory assembly as recited in claim 12, wherein a surface of the memory assembly has a recess for aligning the memory assembly with a data processing device when the memory assembly is mounted to the data processing device.