Hall effect sensor
First Claim
Patent Images
1. A Hall effect sensor comprising:
- a) a quantum well structure havingi) a first layer of a III-V semiconductor material,ii) a second layer of a III-V semiconductor material, andiii) a third layer of III-V semiconductor material deposited on a semiconductor substrate, the III-V material of the second layer having a forbidden band gap narrower than that of the III-V materials of the first and third layers;
b) a fourth layer superimposed on the third layer and doped with donor type impurities, said fourth layer having a thickness less than 250 Å
, and a carrier density per unit area integrated over the whole fourth layer less than 5×
1012 cm-2 ; and
c) a fifth layer of III-V semiconductor material superimposed on said fourth layer, said fifth layer having a thickness greater than 200 Å
, which is not doped or is doped with acceptor type impurities, wherein the conduction band of said fifth layer has a higher energy than the energy of the conduction band of the second layer, and said second layer of III-V semiconductor material has a forbidden band gap of smaller width than the forbidden band gap of said first layer, and said third layer of III-V semiconductor material has a forbidden band gap of greater width than the forbidden band gap of the first layer.
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Abstract
A Hall effect sensor of two-dimensional electron gas type comprising, on an insulating substrate, a quantum well structure, a carrier injection layer adjacent to the quantum well structure, of thickness less than 250 Å and having an density per unit area of donors integrated over the whole thickness of the carrier injection layer less than 5×1012 cm-2, an insulating burial layer deposited on the carrier injection layer, having a conduction band with an energy level greater than the Fermi energy of the sensor and a thickness greater than 200 Å. Applicable to the field of electricity meters and current sensors.
59 Citations
18 Claims
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1. A Hall effect sensor comprising:
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a) a quantum well structure having i) a first layer of a III-V semiconductor material, ii) a second layer of a III-V semiconductor material, and iii) a third layer of III-V semiconductor material deposited on a semiconductor substrate, the III-V material of the second layer having a forbidden band gap narrower than that of the III-V materials of the first and third layers; b) a fourth layer superimposed on the third layer and doped with donor type impurities, said fourth layer having a thickness less than 250 Å
, and a carrier density per unit area integrated over the whole fourth layer less than 5×
1012 cm-2 ; andc) a fifth layer of III-V semiconductor material superimposed on said fourth layer, said fifth layer having a thickness greater than 200 Å
, which is not doped or is doped with acceptor type impurities, wherein the conduction band of said fifth layer has a higher energy than the energy of the conduction band of the second layer, and said second layer of III-V semiconductor material has a forbidden band gap of smaller width than the forbidden band gap of said first layer, and said third layer of III-V semiconductor material has a forbidden band gap of greater width than the forbidden band gap of the first layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification