Apparatus and method for drying substrates

• US 5,443,540 A
• Filed: 12/22/1993
• Issued: 08/22/1995
• Est. Priority Date: 12/25/1992
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Kyushu Limited (Tokyo Electron Limited), Tokyo Electron Limited
• Inventors: Kamikawa, Yuuji
• Primary Examiner(s): Gromada, Denise L.
• Application Number:
  US08/171,643
• Time in Patent Office: 608 Days
• Field of Search: 34/73, 34/74, 34/75, 34/78, 34/391, 34/428, 34/467, 34/468, 34/469, 34/471, 134/104, 134/105, 134/107
• US Class Current: 34/471
• CPC Class Codes: F26B 21/145 Condensing the vapour onto the surface of the materials to be dried using condensing steam F26B3/00; using chemical liquids F26B5/005
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/67034 for drying

Abstract

An apparatus for drying substrates such as wafers while contacting IPA vapor with them to remove that solution, which adheres to them when they are washed, includes a vessel in which IPA is stored, a unit for supplying the IPA into the vessel, a unit for draining the IPA from the vessel, heater block arranged contactable with the underside of the vessel to heat the IPA in the vessel by heat conduction, a boat elevator for positioning the substrates in a steam existing space in which steam generated from the heated process solution and a water cooling system arranged in the vessel to exchanged heat between the IPA and cooling water so as to cool the IPA, which is to be drained from the vessel, by the cooling water.

Claims

1. A substrate-drying apparatus for removing water from at least one substrate while contacting the vapor of a process solution with said substrate, comprising:

a vessel in which the process solution is stored;

means for supplying the process solution into the vessel;

means for draining the process solution from the vessel;

a heater block arranged contactable with the bottom of the vessel to heat the process solution in the vessel by heat conduction;

means for positioning the substrate in a steam existing space in which steam is generated from the heated process solution; and

cooling means dipped in the process solution within the vessel to achieve heat exchange between the process solution and a coolant for cooling the process solution, which is to be drained from the vessel by the draining means, by the coolant.

2. The substrate-drying apparatus according to claim 1, further comprising lifter means arranged under the vessel to move the heater block up and down wherein the heater block is released from the bottom of the vessel by the lifter means when the process solution is to be draining from the vessel by the draining means.

3. The substrate-drying apparatus according to claim 2, wherein said lifter means includes guides formed at four corners of the heater block, guide rods freely slidably inserted into the guides, and a cylinder having a piston rod connected to the under-side of the heater block.

4. The substrate-drying apparatus according to claim 1, wherein said heater block is made of metal and includes a sheath heater embedded therein.

5. The substrate-drying apparatus according to claim 1, further comprising a case enclosing the vessel, a shutter arranged on the top of the case, and a boat for supporting the substrates thereon to carry them into the vessel when the shutter is opened.

6. A substrate-drying apparatus for removing a solution attached to a substrate from the substrate by applying a vapor of a process solution to the substrate, comprising:

a vessel in which the process solution is stored;

means for supplying the process solution into said vessel;

means for draining the process solution stored in the vessel;

a heater block mounted to be capable of contact with an outer bottom surface of the vessel for heating the process solution within the vessel by heat conduction;

means for positioning the substrate in a region of vapor generated from the heated process solution;

cooling means adapted to achieve heat exchange between the process solution and a coolant for cooling said process solution, which is to be drained by said draining means, by the coolant; and

moving means mounted below the vessel for moving the heater block;

wherein the heater block is released from the outer bottom surface of the vessel when the process solution is drained from the vessel by the draining means.

7. The substrate-drying apparatus according to claim 6, wherein said cooling means is a system in which water is used as the coolant, and the water cooling system has a heat transmitting pipe immersed in the process solution in the vessel.

8. The substrate-drying apparatus according to claim 7, further comprising means for forcedly draining the coolant from the heat transmitting pipe of the water cooling system.

9. The substrate-drying apparatus according to claim 8, further comprising a drain tank for storing the process solution drained, and also storing the coolant forcedly drained from the heat transmitting pipe.

10. A substrate-drying method comprising:

heating a process solution stored in a vessel to evaporate the process solution within the vessel;

arranging at least one substrate in a vapor-generating region within the vessel;

applying the vapor of the process solution to the substrate to remove from the substrate other solutions attached to the substrate;

draining process solution from the vessel; and

releasing a heater block from the bottom of the vessel when the process solution is drained from the vessel.