Flexible circuit wiring board and method of producing the same
First Claim
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1. A method of producing flexible circuit wiring boards comprising the steps of:
- forming a circuit wiring pattern consisting of plural conductors on one surface of an insulating base member;
adhering a surface protection layer to the exposed surface of said circuit wiring pattern, the surface protection layer defining at least a first cutaway portion at a location where conductors of said wiring pattern are to be terminated as projecting finger-like leads; and
removing the insulating base member from areas where the leads are to be formed by projecting the beam of an excimer laser onto said base member.
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Abstract
A flexible circuit wiring board having protruding, closely spaced leads, which are intended to be attached to a circuit device, is fabricated by forming a conductor pattern on a first surface of an insulating substrate, adhereing a protection layer to the conductor pattern and employing a laser to selectively etch away the substrate. The etching process leaves a reinforcing coating of the protective layer on the leads at least in the portions thereof which lie at the boundary of the area from which the substrate has been removed.
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Citations
7 Claims
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1. A method of producing flexible circuit wiring boards comprising the steps of:
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forming a circuit wiring pattern consisting of plural conductors on one surface of an insulating base member; adhering a surface protection layer to the exposed surface of said circuit wiring pattern, the surface protection layer defining at least a first cutaway portion at a location where conductors of said wiring pattern are to be terminated as projecting finger-like leads; and removing the insulating base member from areas where the leads are to be formed by projecting the beam of an excimer laser onto said base member. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification