Microstrip antenna structure having an air gap and method of constructing same

• US 5,444,453 A
• Filed: 06/28/1994
• Issued: 08/22/1995
• Est. Priority Date: 02/02/1993
• Status: Expired due to Fees

• Current Assignee: Ball Aerospace & Technologies Corporation (Ball Corporation)
• Original Assignee: Ball Corporation
• Inventors: Lalezari, Farzin
• Primary Examiner(s): Hajec, Donald
• Assistant Examiner(s): LE, HOANGANH T
• Application Number:
  US08/267,173
• Time in Patent Office: 420 Days
• Field of Search: 343/700 MS, 343/829, 343/830, 343/845, 343/846, 343/848
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

A microstrip antenna structure comprising a radiator layer that includes a substrate layer and a radiator patch that is disposed on one surface of the substrate layer; a ground plane; and support elements, formed as an integral part of either the radiator layer or the ground plane, for maintaining a dielectric space between the radiator patch and the ground plane that includes an air gap of predetermined thickness between the substrate layer and the ground plane. The present invention also includes a method for constructing such a microstrip antenna structure.

Claims

1. A microstrip antenna comprising:

a substantially rigid radiator layer that includes a substrate layer and a radiator patch disposed on one of a lower surface and an upper surface of said substrate layer;

a ground plane that is located adjacent to only said lower surface of said substrate layer, wherein said upper surface of said substrate layer is substantially free of any portion of said ground plane positioned adjacent thereto; and

a plurality of support means, each made from the same piece of material as at least one of said ground plane and said radiator layer, for maintaining a dielectric space between said radiator patch and said ground plane that includes an air gap, wherein each of said plurality of support means maintains a predetermined distance between said radiator patch and said ground plane, wherein each of said plurality of support means has a dimple shape that, if a cross-section is taken which is substantially between and substantially parallel to said radiator layer and said ground plane, has a closed surface, wherein each of said plurality of support means has a base that is surrounded by said ground plane or said radiator layer, and wherein each of said plurality of support means has substantially the same dimple shape.

2. A microstrip antenna according to claim 1, wherein:

said radiator patch is disposed on a bottom surface of said substrate layer, such that said radiator patch is positioned between said substrate layer and said ground plane.

3. A microstrip antenna according to claim 1 wherein:

said radiator patch is disposed on a bottom surface of said substrate layer such that said radiator patch is positioned between said substrate layer and said ground plane, and said air gap extends from said radiator patch to said ground plane.

4. A microstrip antenna according to claim 1, wherein:

each of said plurality of support means is arranged to avoid interposition between said radiator patch and said ground plane.

5. A microstrip antenna according to claim 1, wherein:

said radiator patch and said ground plane are separated by a distance substantially equal to H, and wherein said distance between each of said plurality of support means and said radiator patch is substantially equal to W, wherein W is at least approximately three times larger than H.

6. A microstrip antenna according to claim 1 wherein:

at least one of said plurality of support means includes a first portion that is made from the same piece of material as said radiator layer and a second portion that is made from the same piece of material as said ground plane.

7. A microstrip antenna according to claim 1, wherein:

said plurality of support means each serve to maintain a distance between said radiator patch and said ground plane that is less than about 0.5 millimeters so that high frequency operation can be achieved.

8. A microstrip antenna according to claim 1, wherein:

at least one of said substrate layer and said ground plane include a perforation of predetermined size to allow air and water to pass between said air gap and an exterior environment.

9. A microstrip antenna according to claim 1, wherein:

the air gap is open to the ambient atmosphere.

10. A microstrip antenna according to claim 1, further comprising:

a connector for conveying a signal to said radiator patch, wherein said connector includes a feed element that overlaps said radiator patch and a dielectric material that is located between said feed element and said radiator patch thereby forming a capacitively coupled connection between said feed element and said radiator patch.

11. A microstrip antenna according to claim 1, further comprising:

one of the following;

a back-launch connector, an edge-launch connector, and a reverse angle edge launch connector that is operatively attached to said radiator patch and said ground plane.

12. A microstrip antenna according to claim 1, wherein:

said substantially rigid radiator layer is substantially planar and each of said plurality of support means is made from the same piece of material as said ground plane.

13. A microstrip antenna according to claim 1, wherein:

said predetermined distance is fixed.

14. A microstrip antenna according to claim 1, wherein:

said plurality of support means includes at least three support means.

15. A microstrip antenna according to claim 1, wherein:

said said substantially rigid radiator layer extends to a first circumferential edge and said ground plane extends to a second circumferential edge;

wherein at least one of said plurality of support means is located interior to both said first and second circumferential edges.

16. A microstrip antenna according to claim 1, wherein:

said substantially rigid radiator layer includes a plurality of said radiator patch;

wherein at least three of said plurality of support means are located around each of said plurality of said radiator patch.

17. A microstrip antenna according to claim 1, wherein:

at least one of said plurality of support means includes a contact surface for contacting each of said ground plane and said radiator layer, wherein said contact surface is oriented other than perpendicular to said radiator layer and said ground plane.

18. A microstrip antenna according to claim 1, wherein:

said substantially rigid radiator layer includes a driver layer with a driver element;

each of said plurality of support means is made from the same piece of material as both said substrate layer of said substantially rigid radiator layer and said ground plane; and

said driver layer is supported between said substrate layer and said ground plane.

19. A microstrip antenna comprising:

a substantially rigid radiator layer that includes a substrate layer and a radiator patch which is disposed on one of a lower surface and an upper surface of said substrate layer;

a ground plane that is located adjacent to only said lower surface of said substrate layer, wherein said upper surface of said substrate layer is substantially free of any portion of said ground plane positioned adjacent thereto; and

a plurality of support means, each of said plurality of support means made from the same material as at least one of said ground plane and said radiator layer, for maintaining a dielectric space between said radiator patch and said ground plane that includes an air gap and that has a predetermined distance between said radiator patch and said ground plane;

wherein at least one of said substrate layer and said ground plane forms at least a portion of an exterior surface that is exposed to the environment and includes a perforation to allow at least one of the following;

air and water to pass between said air gap and an ambient environment exterior to said substantially rigid radiator layer and said ground plane.

20. A microstrip antenna according to claim 19, wherein:

said substrate layer and said ground plane each include a perforation to allow at least one of the following;

air and water to pass therethrough.

21. A microstrip antenna according to claim 19, wherein:

said air gap is open to the ambient atmosphere.

22. A method of constructing a microstrip antenna comprising the steps of:

providing a substantially rigid radiator layer that includes a substrate layer and a radiator patch that is located on one of a lower surface and an upper surface of said substrate layer, and a ground plane, wherein at least one of said radiator layer and said ground plane includes a plurality of support means that are each made from the same piece of material as at least one of said radiator layer and said ground plane and serve to maintain a dielectric space between said radiator patch and said ground plane that includes an air gap, wherein each of said plurality of support means maintains a predetermined distance between said radiator patch and said ground plane, and each of said plurality of support means is located a distance from said radiator patch so as to avoid interposition between said radiator patch and said ground plane, wherein each of said plurality of support means has substantially a dimple shape that, if a cross-section is taken which is substantially between and substantially parallel to said radiator layer and said ground plane, has a closed surface, wherein each of said plurality of support means has a base that is surrounded by said ground plane or said radiator layer, and wherein each of said plurality of support means has substantially the same dimple shape; and

operatively connecting said radiator layer and said ground plane layer to form a microstrip antenna in which said ground plane is located adjacent to only said lower surface of said substrate layer and said upper surface of said substrate layer is substantially free of any portion of said ground plane positioned adjacent thereto, and an air gap is located between the radiator patch and the ground plane.

23. A method of constructing a microstrip antenna according to claim 22, wherein:

said step of providing comprises punching one of the ground plane layer and the radiator layer with a die to form said support means.

24. A method of constructing a microstrip antenna according to claim 22, wherein:

said step of providing comprises molding one of the ground plane and the radiator layer with said support means.

25. A method of constructing a microstrip antenna according to claim 22, wherein:

said step of providing comprises molding one of the ground plane and the radiator layer with said support means to form a frame and metallizing said frame.

26. A method of constructing a microstrip antenna according to claim 22, wherein:

said step of providing comprises extruding one of the ground plane layer and the radiator layer to form said support means.

27. A method of constructing a microstrip antenna according to claim 22, wherein:

said step of providing comprises casting one of the ground plane and the radiator layer to form said support means.

28. A method of constructing a microstrip antenna according to claim 22, wherein:

said step of operatively connecting includes positioning said radiator layer so that said radiator patch is located between said substrate layer and said ground plane.

29. A method of constructing a microstrip antenna according to claim 22, further comprising the step of:

placing a feed element and a dielectric material such that the feed element overlaps the radiator patch by a predetermined amount and said dielectric material is located between the feed element and the radiator patch thereby forming a capacitively coupled electrical connection between the feed element and the radiator patch.

30. A method of constructing a microstrip antenna according to claim 22, wherein:

said step of providing comprises at least one of said substrate layer and said ground plane including a perforation of predetermined size to allow at least one of the following;

air and water to pass therethrough.