Fixture and method for attaching components
First Claim
1. A method for bonding multiple electronic components together at one time, which comprises the steps of:
- positioning the electronic components for assembly with an adhesive material that becomes fluid with application of heat between the components,applying a first pressure in a linear direction to urge a first set of at least two of the components together,applying a second pressure, independent of the first pressure, said second pressure applied annularly about said first pressure and in said linear direction, to urge a second set of at least two of the components together, andheating the components to a sufficient temperature to make the adhesive material fluid while the first and second pressures are applied.
2 Assignments
0 Petitions
Accused Products
Abstract
A fixture (10) for bonding multiple components together includes a bottom plate (20), a middle plate (22) and a top plate (24). The plates (20), (22) and (24) are aligned by dowels (26) and clamps (30). Bottom plate (20) has a rectangular pocket (32) for holding heat sink (14) and alignment pins (34) for locating plastic pin grid array (PPGA) package (12) over the heat sink (14). An annular projection (40 ) covered with a conformal pad (42) extends from bottom surface (44) of the middle plate (22). Dowel (50) extends through openings (46) and (36) in the top and middle plates (24) and (22) to apply pressure to chip (16). A first spring (56) is mounted on the dowel (50) and compressed between the top plate (24) and a snap ring (58) to provide pressure from the dowel (50 ) on the chip (16). A second, larger diameter spring (60) is compressed between the middle plate (22) and the top plate (24) to provide pressure from the middle plate (22) on the PPGA (12). Cartridge heaters (62) are embedded in the bottom plate (20) to provide heat for epoxy or solder bonding. A thermocouple (64) monitors temperature at the bottom plate (20).
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Citations
11 Claims
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1. A method for bonding multiple electronic components together at one time, which comprises the steps of:
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positioning the electronic components for assembly with an adhesive material that becomes fluid with application of heat between the components, applying a first pressure in a linear direction to urge a first set of at least two of the components together, applying a second pressure, independent of the first pressure, said second pressure applied annularly about said first pressure and in said linear direction, to urge a second set of at least two of the components together, and heating the components to a sufficient temperature to make the adhesive material fluid while the first and second pressures are applied. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification