Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process

• US 5,445,705 A
• Filed: 06/30/1994
• Issued: 08/29/1995
• Est. Priority Date: 06/30/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Barbee, Steven G., Datta, Madhav, Li, Leping, Shenoy, Ravindra V., Ratzlaff, Eugene H., Heinz, Tony F.
• Primary Examiner(s): Breneman, R. Bruce
• Assistant Examiner(s): CHANG, JONI YUK YING
• Application Number:
  US08/269,865
• Time in Patent Office: 425 Days
• Field of Search: 156/626, 156/627, 156/345, 156/637, 156/639, 156/638, 156/642, 156/635
• US Class Current: 216/86
• CPC Class Codes: H01L 21/32135 by vapour etching only

Abstract

A contactless method and apparatus for in-situ chemical etch monitoring of an etching process during etching of a workpiece with a wet chemical etchant are disclosed. The method comprises steps of providing a base member having a reference surface; releasably securing the workpiece to the base member; providing at least two sensors disposed on the base member to be proximate to but not in contact with the outer perimeter of the workpiece surface; and monitoring an electrical characteristic between said at least two sensors, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process.

Claims

1. A contactless method for in-situ chemical etch monitoring of an etching process during etching of a workpiece with a wet chemical etchant, the workpiece characterized by a workpiece surface to be etched with side edge portions along an outer perimeter thereof, said method comprising the steps of:

a) providing a base member having a reference surface;

b) releasably securing the workpiece to said base member, wherein the workpiece surface is substantially flush with the reference surface;

c) providing at least two sensors disposed on said base member to be proximate to but not in contact with the outer perimeter of the workpiece surface, said at least two sensors further being substantially flush with the reference surface and positioned on opposite side edge portions of the workpiece surface; and

d) monitoring an electrical characteristic between said at least two sensors, wherein a change in the electrical characteristic is indicative of a condition of the etching process.

2. The method of claim 1, wherein:

providing said base member further includes providing a recess formed in the reference surface thereof, the recess being of a dimension for receiving the workpiece therein; and

releasably securing the workpiece to said base member further comprises providing a vacuum source, the vacuum source for releasably securing the workpiece in the recess.

3. The method of claim 1, wherein providing at least two sensors comprises providing chemically inert conductive wires imbedded in the reference surface of said base member, the inert wires having respective exposed surfaces thereof, the exposed surfaces being in substantially the same plane as that of the workpiece surface.

4. The method of claim 1, wherein providing the at least two sensors comprises providing two sensors.

5. The method of claim 1, wherein monitoring an electrical characteristic comprises monitoring an impedance and further wherein the change comprises a change in impedance.

6. A contactless method for in-situ control of an etching process during etching of a workpiece in an etch station using a wet chemical etchant, the workpiece characterized by a workpiece surface to be etched with side edge portions along an outer perimeter thereof, said method comprising the steps of:

a) providing a base member having a reference surface;

b) releasably securing the workpiece to said base member, wherein the workpiece surface is substantially flush with the reference surface;

c) providing at least two sensors disposed on said base member to be proximate to but not in contact with the outer perimeter of the workpiece surface, said at least two sensors further being substantially flush with the reference surface and positioned on opposite side edge portions of the workpiece surface;

d) monitoring an electrical characteristic between said at least two sensors, wherein a change in the electrical characteristic is indicative of a condition of the etching process; and

e) controlling the etching process in response to the monitoring of the change in the electrical characteristic.

7. The method of claim 6, wherein:

providing said base member further includes providing a recess formed in the reference surface thereof, the recess being of a dimension for receiving the workpiece therein; and

releasably securing the workpiece to said base member further comprises providing a vacuum source, the vacuum source for releasably securing the workpiece in the recess.

8. The method of claim 6, wherein providing at least two sensors comprises providing chemically inert conductive wires imbedded in the reference surface of said base member, the inert wires having respective exposed surfaces thereof, the exposed surfaces being in substantially the same plane as that of the workpiece surface.

9. The method of claim 6, wherein providing the at least two sensors comprises providing two sensors.

10. The method of claim 6, wherein monitoring an electrical characteristic comprises monitoring an impedance and further wherein the change comprises a change in impedance.